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LED fluorescent glue and packaging method for improving luminescence uniformity, and LED

A technology of uniform light emission and packaging method, which is applied to LED. It can solve the problems of poor density between phosphor and colloid, uneven dispersion of phosphor, and poor product performance, and achieve good chemical stability, uniform white light spot, and small specific gravity.

Inactive Publication Date: 2016-08-10
SHENZHEN JUFEI OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is that there is a density difference between phosphor powder and colloid in the existing LED packaging technology. After the two are mixed, the phosphor powder is unevenly dispersed in the fluorescent glue, resulting in uneven light color and poor product performance. Thereby proposing a kind of LED fluorescent glue that improves luminous uniformity and encapsulation method and the LED that obtains by this method encapsulation

Method used

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  • LED fluorescent glue and packaging method for improving luminescence uniformity, and LED
  • LED fluorescent glue and packaging method for improving luminescence uniformity, and LED
  • LED fluorescent glue and packaging method for improving luminescence uniformity, and LED

Examples

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Embodiment 1

[0029] This embodiment provides a LED fluorescent glue that improves the uniformity of light emission. In parts by weight, the fluorescent glue consists of 1 part of packaging glue, 0.01 part of phosphor powder, 0.01 part of silica-based inorganic nanoparticles, and 0.01 part of organic silicon particles. composition, wherein the fluorescent powder is a silicate fluorescent powder, the silica-based inorganic nanoparticles are fumed silica with a particle diameter of 5nm, and the organosilicon particles are polysiloxane-based organosilicon particles. The example is methyl silicone resin, the particle size is micron order, and the refractive index is less than 1.45.

[0030] This embodiment also provides an LED packaging method for improving luminous uniformity, comprising the following steps:

[0031] a. Solid crystal, fix the light-emitting chip on the bottom of the package cavity of the LED bracket with the crystal-bonding material silver glue, and then perform wire bonding t...

Embodiment 2

[0037] This embodiment provides a LED fluorescent glue that improves the uniformity of light emission. In parts by weight, the fluorescent glue consists of 1 part of packaging glue, 0.5 part of phosphor powder, 0.06 part of silica-based inorganic nanoparticles, and 0.5 part of organic silicon particles. composition, wherein the fluorescent powder is aluminate fluorescent powder, the silica-based inorganic nanoparticles are fumed silica with a particle diameter of 25nm, and the organosilicon particles are polysiloxane-based organosilicon particles. The example is low phenylmethyl silicone resin, the particle size is micron order, and the refractive index is less than 1.45.

[0038] This embodiment also provides an LED packaging method for improving luminous uniformity, comprising the following steps:

[0039] a. Die-bonding, fix the light-emitting chip on the bottom of the package cavity of the LED bracket with the solder paste of the crystal-bonding material, and then perform ...

Embodiment 3

[0045] This embodiment provides a LED fluorescent glue that improves the uniformity of light emission. In parts by weight, the fluorescent glue consists of 1 part of packaging glue, 1 part of phosphor powder, 0.1 part of silica-based inorganic nanoparticles, and 1 part of organic silicon particles. Composition, wherein the fluorescent powder is a mixture of nitride fluorescent powder and nitrogen oxide fluorescent powder, the silica-based inorganic nanoparticles are fumed silica with a particle size of 50nm, and the organosilicon particles are polysiloxane The silicone-like particles, in this embodiment, are low-phenylmethyl silicone resins, the particle size is micron order, and the refractive index is less than 1.45.

[0046] This embodiment also provides an LED packaging method for improving luminous uniformity, comprising the following steps:

[0047] a. Die-bonding, the flip-chip light-emitting chip is fixed on the bottom of the package cavity of the LED bracket with sili...

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Abstract

The invention discloses an LED fluorescent glue that improves the uniformity of light emission. In parts by weight, the fluorescent glue consists of 1 part of packaging glue, 0.01-1 part of fluorescent powder, 0.01-0.1 part of silica-based inorganic nanoparticles, 0.01 part of ‑1 part silicone granules. Inorganic nanomaterials and silicone particles are mixed in the encapsulation glue, which reduces the sedimentation rate of the phosphor in the encapsulation glue, improves the uniformity of the phosphor distribution in the colloid, makes the white light spot more uniform, and improves the light diffusivity and transmittance. The light rate is maximized, and by changing the propagation path of the light, the light of various wavelengths is more fully mixed, and the spatial color uniformity of the light is further improved. It also provides an LED packaging method and LED that improve the uniformity of light emission, which improves the consistency of products, reduces the probability of uneven color distribution in space due to uneven distribution of phosphor powder, and improves product yield and product production. efficiency.

Description

technical field [0001] The invention belongs to the technical field of LED light emission, and in particular relates to an LED fluorescent glue for improving the uniformity of light emission, a packaging method and an LED packaged by the method. Background technique [0002] With the continuous advancement of technology in the LED field, in recent years, the luminous efficiency of white LEDs has been significantly improved while the price has been significantly reduced. The white LED market is getting closer and closer to civil lighting and indoor lighting. In the LED production process, light color consistency is an important indicator to measure product quality. Poor light color consistency will lead to color temperature deviation in white LED products, which will affect the yield of finished products. [0003] The traditional semiconductor packaging technology mainly adopts the phosphor powder coating process, that is, the phosphor powder and the colloid are stirred and m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/56H01L33/58H01L33/00
CPCH01L2224/48091H01L2224/48247H01L33/502H01L33/005H01L33/56H01L33/58H01L2933/0033H01L2933/0041H01L2933/0058
Inventor 龚涛郭苑马明来童文鹏张志宽
Owner SHENZHEN JUFEI OPTOELECTRONICS CO LTD
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