The invention relates to a compounding method of an epoxy resin solution with autocatalysis chemical copper plating activity and a chemical copper plating method, and belongs to the technical field of material surface treatment. The compounding method comprises the following steps: adding an activity ion source to an organic solvent under the circumstance of unceasingly stirring, adding a given number of curing catalysts, and sufficiently stirring the activity ion source, the organic solvent and the curing catalysts so as to form a uniform active agent solution; adding epoxy resins to a curing agent according to a certain proportion in a stirring manner so as to form an epoxy resin organic solution; unceasingly stirring the epoxy resin organic solution, and besides, slowly adding the active agent solution to the epoxy resin organic solution so as to form a uniform stable system, namely obtaining a chemical copper plating epoxy resin solution with autocatalysis activity; enabling a compounded resin solution to form a uniform coating on a basal board of a printed circuit board by a casting method or a silk screen printing method, and performing the procedures of solidification, microetch, reduction, chemical plating and the like so as to obtain a plating piece with a bright pink copper plating layer. Through performance test, the copper layer-resin binding force and the electrical conductivity of samples are excellent, and the compounding method and the chemical copper plating method are suitable for a chemical copper plating technology.