65results about How to "Excellent soldering heat resistance" patented technology

The present invention provides a polyurethane resin composition having high adhesiveness to various plastic films and metals, high moist heat resistance that can even accommodate soldering after humidification, and excellent flame retardancy without using any halogen or antimony, and an adhesive composition, laminate, and printed wiring board that use the polyurethane composition. A polyurethane resin composition containing a polyurethane resin (A) that satisfies (1)-(3) and an epoxy resin (B). (1) Includes a polyester polyol containing a phosphorus compound residue represented by general formula (1) or general formula (2) as a structural component; (2) an acid value (unit: Eq / 106 g) of from 50 to 1000; (3) a urethane group concentration (unit: Eq / 106 g) of from 100 to 600 (R1 and R2 are each independently a hydrogen atom or hydrocarbon group, R3 and R4 are each independently a hydrogen atom, hydrocarbon group, or hydroxy group-substituted hydrocarbon group, and l and m are integers of 0 to 4.) (R5 is a hydrogen atom or hydrocarbon group, and R6 and R7 are each independently a hydrogen atom, hydrocarbon group, or hydroxy group-substituted hydrocarbon group.)

Disclosed is a flexible laminate comprising a metal foil layer / a thermoplastic layer or / and a conductive circuit layer / a thermoplastic polyimide layer, which is obtained by bonding a metal foil layer or a conductive circuit layer to at least one side of a thermoplastic polyimide layer. In this flexible laminate, the thermoplastic polyimide layer is made of a thermoplastic polyimide resin film or sheet which is obtained by melt-extruding a thermoplastic polyimide resin. Alternatively, the thermoplastic polyimide layer is made of a biaxially stretched thermoplastic polyimide resin film or sheet. Such a flexible laminate can be easily produced by a lamination method wherein a thermoplastic polyimide resin film (1) and a metal foil (2) or a conductive circuit layer (4) are bonded by heat and pressure, and has excellent heat resistance, electrical characteristics and mechanical strength inherent in polyimides. When a biaxially stretched thermoplastic polyimide resin film or sheet is used, the flexible laminate can be improved in dimensional stability and solder heat resistance.

The invention provides a welding-resistant photoresist ink composition with the advantages of excellent light hardening force, high alkali wash imaging resolution force and low dielectric constant. The printed circuit board welding-resistant ink prepared by using the composition has the advantages of excellent adherence, solution resistance, electrical characteristics, plating resistance, solder heat resistance, electrical erosion resistance and the like, the dielectric constant Dk of the ink is less than 3.20 (1GHz), and the loss factor Df is less than 0.015(1GHz). The low-dielectric constant welding-resistant photoresist ink composition comprises the following components in percentage by weight: (A) 20-70% of light polymerizable prepolymer (oligomer) shown as a formula (1), wherein the prepolymer is prepared by reacting (a1) dicyclopentadiene-phenol polyfunctional epoxy resin (namely DCPD-phenol polyfunctional epoxy resin) or (a2) polyoxyphenylene modified polyfunctional epoxy resin or (a3) phenol-benzaldehyde polyfunctional epoxy resin or any mixture of two of (a1), (a2) and (a3) with (b) monocarboxylic acid containing a vinyl and then reacting with (c) saturated or insaturated polybasic anhydrides; (B) 0-20% of a light polymerizable vinyl monomer serving as a diluent; (C) 5-30% of an epoxy resin compound comprising (C1) a dicyclopentadiene-phenol polyfunctional epoxy resin (namely DCPD-phenol polyfunctional epoxy resin) or polyoxyphenylene modified polyfunctional epoxy resin or phenol-benzaldehyde polyfunctional epoxy resin or any combination of the three resins, (C2) a tetramethyl diphenol epoxy resin, and (C3) an active ester-based resin; (D) 2-10% of a photo-polymerizatoin initiator; (E) 10-50% of an inorganic filling agent; (F) 0-2.0% of an accelerant; and (G) 10-40% of an organic solvent.

There are provided a novel photosensitive resin composition, a cured film of which has ample flexibility, and which yields an insulating protective coating having superior soldering heat resistance, thermal degradation resistance and electroless gold plating resistance. The photosensitive resin composition as claimed in the present invention comprises: a photopolymerizeable component containing a urethane acrylate compound (A) and a compound (B) having an ethylenic unsaturated group other than said urethane acrylate compound (A), a thermosetting resin (C), a photopolymerization initiator (D) and a thermal polymerization catalyst (E); wherein, said urethane acrylate compound (A) is the reaction product of an isocyanate compound (a-1) of the following general formula (1): CH2═CH—COO—R—NCO  (1) (wherein, R represents a hydrocarbon group having 1 to 30 carbon atoms) with a polyhydroxy compound (a-2).