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Novel polyamic acid, polyimide, photosensitive resin composition comprising same, and dry film produced from the composition

一种聚酰胺酸、感光树脂的技术，应用在聚酰胺酸或聚酰亚胺领域，能够解决限制、耐受性不足等问题

Active Publication Date: 2012-02-22
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a film prepared from the above-mentioned photosensitive resin composition or cured product is used for a circuit protection film, the cured film has an excellent performance as compared with a circuit protection film prepared from an epoxy-based material used in the prior art. Flexible, but insufficient adhesion strength to the substrate, solder heat resistance and pressure cooker test (PCT, Pressure cooker test) resistance
Therefore, such membranes are limited in commercial applications

Method used

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  • Novel polyamic acid, polyimide, photosensitive resin composition comprising same, and dry film produced from the composition
  • Novel polyamic acid, polyimide, photosensitive resin composition comprising same, and dry film produced from the composition
  • Novel polyamic acid, polyimide, photosensitive resin composition comprising same, and dry film produced from the composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0113] Embodiment 1: the preparation of polyamic acid and photosensitive resin composition

[0114] While passing nitrogen into a four-necked round-bottomed flask equipped with a thermometer, a stirrer, a nitrogen gas inlet, and a powder dispensing funnel, 190 g of N,N-dimethylacetamide (DMAc) was added to the four-necked round-bottomed flask. 7.94 g 4,4'-diaminodiphenyl ether (4,4'-ODA), 27.02 g 1,3-bis(4-aminophenoxy)benzene (TPE-R) and 3.82 g 3,5 -diaminobenzoic acid 2'-(methacryloyloxy)ethyl ester and dissolve it completely by stirring. The solution was cooled to below 15°C, and then 43.18 g of 4,4'-oxydiphthalic anhydride (ODPA) was added slowly. The solution was stirred at 5° C. for 24 hours to obtain a polyamic acid varnish.

[0115] The viscosity of the prepared polyamic acid was 3200 cps. After the product polymer was obtained by precipitation, it was confirmed by NMR analysis that 2'-(methacryloyloxy)ethyl 3,5-diaminobenzoate was intercalated into the polyamic aci...

Embodiment 2 to 5 and comparative Embodiment 1

[0118] The polyamic acid and photosensitive resin compositions were prepared in the same manner as in Example 1, except that the ingredients and their compositions in Table 1 were used.

[0119] [Table 1]

[0120]

[0121] ODPA: 4,4'-oxydiphthalic anhydride

[0122] 4,4'-ODA: 4,4'-diaminodiphenyl ether

[0123] TPE-R: 1,3-bis(4-aminophenoxy)benzene

[0124] HEMA-DA: 2′-(methacryloyloxy)ethyl 3,5-diaminobenzoate

[0125] Experimental Example: Membrane Physical Property Evaluation

[0126] The photosensitive resin compositions obtained in Examples 1 to 5 and Comparative Example 1 were coated on a polyethylene terephthalate (PET) film with a thickness of 71 μm using a doctor blade, and then dried in an oven at 80° C. for 15 minutes to obtain a dry film with a thickness of 25 μm.

experiment Embodiment 1

[0127] Experimental Example 1: Transparency

[0128] The transparency of the dried film was observed with the naked eye, and the results are shown in Table 2.

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Abstract

The present invention relates to a polyamic acid comprising a thermopolymerizable or photopolymerizable functional group, to a photosensitive resin composition which can form a high-resolution pattern, and which has a superior property of being developable with an aqueous alkaline solution, and which can provide a cured coating film having excellent flexibility, adhesion properties, soldering-heat resistance, and pressure cooker test (PCT) resistance, and to a dry film produced from the composition.

Description

technical field [0001] The invention relates to a novel polyamic acid, polyimide, a photosensitive resin composition containing the polyamic acid or polyimide and a dry film prepared therefrom. More specifically, the present invention relates to a novel polyamic acid or polyimide, which contains a functional group with thermopolymerization or photopolymerization properties; a photosensitive resin composition, which provides a Forms high-resolution patterns, has excellent developing characteristics when developed with an alkaline aqueous solution, and has excellent flexibility, adhesion, soldering heat resistance, and pressure cooker test (PCT, pressure cooker test) resistance and a dried film prepared therefrom. [0002] This application claims the benefit of Korean Patent Application No. 10-2009-0080606 filed in the Korean Intellectual Property Office on Aug. 28, 2009, the entire contents of which are incorporated herein by reference. Background technique [0003] Since p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10G03F7/004G03F7/037C08J5/18H05K1/00
CPCC08G73/10C08L79/08G03F7/037G03F7/0387G03F7/0388H05K3/287G03F7/004G03F7/0045G03F7/0047H05K3/00H05K3/0002
Inventor 李光珠庆有真高珠恩宋宪植沈正真金熹正
Owner LG CHEM LTD
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