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Printing ink composition with water-soluble solvent, application of printing ink composition, and printed circuit board

An ink composition, water-soluble technology, applied in the directions of printed circuit parts, inks, applications, etc., can solve the problems that the degree of improvement needs to be improved, and the problems such as ink overflow have not been solved, and achieve good solder heat resistance and good heat resistance. Effect

Active Publication Date: 2015-10-14
深圳市容大感光科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The composition has some improvements in developability and heat resistance, but the degree of improvement still needs to be improved, and the problem of ink spillage is not solved

Method used

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  • Printing ink composition with water-soluble solvent, application of printing ink composition, and printed circuit board
  • Printing ink composition with water-soluble solvent, application of printing ink composition, and printed circuit board
  • Printing ink composition with water-soluble solvent, application of printing ink composition, and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0085] Add 203 grams of o-cresol novolac epoxy resin (Shandong Shengquan 704M, epoxy equivalent 203), 0.5 grams of hydroquinone, and 250 grams of diethylene glycol ethyl ether acetate (water-soluble solvent) into a three-necked flask, stir, and heat Heat and dissolve at 100°C to 110°C for 1 hour. After ensuring complete dissolution, cool down to 90°C, add a solution of 72 grams of acrylic acid and 3 grams of N,N dimethylbenzylamine dropwise, and finish the drop within three hours. The temperature is controlled during the process 90-100°C, after the dropwise addition, raise the temperature to 105°C to 110°C for 12 hours, the measured acid value is less than 10mgKOH / g, the temperature of the material is lowered to 90°C, add 100 grams of tetrahydrophthalic anhydride, and keep at 90-95°C for 4 hour, detect with infrared spectrometer, 1780cm-1 peak disappears, stop reaction, temperature is lowered to room temperature, obtains tea brown resin solution, resin viscosity is 260dPa.s / 25 ...

Synthetic example 2

[0087]Add 210 grams of Kunshan Nanya o-cresol novolac epoxy resin NPCN-704 (epoxy equivalent 210, softening point 70-80°C) and 250 grams of dipropylene glycol methyl ether ether acetate (water-soluble solvent) into a three-necked flask, stir and heat Heat and dissolve at 100°C to 110°C for 1 hour. After ensuring complete dissolution, cool down to 90°C, add 72 grams of acrylic acid, 0.3 grams of hydroquinone, and 1.8 grams of triphenylphosphine, heat to 100-120°C, and react for 15 hours , the acid value is less than 5mgKOH / g, add 100 grams of tetrahydrophthalic anhydride, control the temperature at 90 to 100 ° C for 4 hours, detect with an infrared spectrometer, the 1780cm-1 peak disappears, stop the reaction, and obtain a light yellow resin solution with a viscosity of 300dPa. s / 25 ℃, solid content 60%, the resin of acid value 60mgKOH / g, number average molecular weight is 2336, and resin code is A2 (wherein the mass percent that contains water-soluble organic solvent is 40%, ba...

Synthetic example 3

[0089] Add 210 grams of Kunshan Nanya o-cresol novolac epoxy resin NPCN-704 (epoxy equivalent 210, softening point 70-80°C) and 250 grams of 1,4-butyrolactone (water-soluble solvent) into a three-necked flask, stir and heat Heat and dissolve at 100°C to 110°C for 1 hour. After ensuring complete dissolution, cool down to 90°C, add 72 grams of acrylic acid, 0.3 grams of hydroquinone, and 1.8 grams of triphenylphosphine, heat to 100-120°C, and react for 15 hours , the acid value is less than 5mgKOH / g, add 100 grams of tetrahydrophthalic anhydride, control the temperature at 90 to 100 ° C for 4 hours, detect with an infrared spectrometer, the 1780cm-1 peak disappears, stop the reaction, and obtain a light yellow resin solution with a viscosity of 300dPa. s / 25 ℃, solid content 60%, the resin of acid value 60mgKOH / g, number average molecular weight is 1987, and resin code is A3 (wherein the mass percent that contains water-soluble organic solvent is 40%, based on the gross weight of ...

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Abstract

The invention relates to a printing ink composition with a water-soluble solvent, an application of the printing ink composition, and a printed circuit board. The printing ink composition comprises the following components: A) a photo-cured dilute-alkaline-water developable resin containing carboxyl and an unsaturated double bond, B) an unsaturated monomer, C) a water-soluble solvent, D) epoxy resin, E) an epoxy curing accelerator, F) a photopolymerization initiator, and optional G) a filling material, H) a pigment, and I) an antifoaming agent, a dye, a thermopolymerization inhibitor, an adhesive force promoter, a dispersant, a coupling agent, a fire retardant, a leveling agent, an anti-oxidant and / or a thixotropic agent. The printing ink composition is applied to holes of a circuit board, has excellent properties, such as hot-soldering-tin resistance, developability, and washing resistance of a liquid composite, and can be widely applied as an insulated solder-resisting protective material for the holes of the circuit board.

Description

technical field [0001] The invention belongs to the field of electronic materials, and in particular relates to a water-soluble solvent ink composition, its application and a printed circuit board. Background technique [0002] Due to the requirements of lightness, thinness, thinness, durability and reliability of electronic products, in recent years, the process of filling the through holes of printed circuit boards with photocurable and heat-curable composition inks has been widely used in the production of circuit boards. [0003] The composition ink is filled in the holes of the circuit board substrate through the process of aluminum plate printing. The commonly used process is: printing plugging ink with aluminum plate, followed by screen printing or electrostatic spraying or air spraying or roller coating and other processes to coat the surface with heat-curing light-curing ink, drying at 70-80°C, and using controllable The composition is selectively irradiated with u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101G03F7/027G03F7/004H05K1/02
Inventor 杨遇春付强刘启升
Owner 深圳市容大感光科技股份有限公司
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