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Polyamide resin, resin composition thereof, flame-retardant adhesive composition and adhesive sheet made of said composition, coverlay film, and printed wiring board

A technology of polyamide-imide resin and polyamide-imide, applied in the direction of polyurea/polyurethane adhesive, film/sheet adhesive, adhesive type, etc., can solve difficult flame retardancy Compatible with various characteristics, can not meet the problems of flame retardancy, heat resistance, soldering heat resistance, etc., and achieve the effect of excellent electrical insulation, improved adhesion, and excellent stability

Active Publication Date: 2011-08-31
TOYOBO MC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it can be seen that in any of the examples, inorganic fillers are added, and various properties such as flame retardancy and heat resistance cannot be satisfied without fillers.
The addition of fillers has the above-mentioned problems, and in Patent Document 14, soldering heat resistance is not sufficient even with the addition of fillers, and in Patent Document 15, hydrolysis resistance is poor due to the addition of phosphate esters of the additive type.
[0019] As mentioned above, the current situation is that it is difficult to combine flame retardancy and various characteristics in halogen-free flame retardant adhesives

Method used

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  • Polyamide resin, resin composition thereof, flame-retardant adhesive composition and adhesive sheet made of said composition, coverlay film, and printed wiring board
  • Polyamide resin, resin composition thereof, flame-retardant adhesive composition and adhesive sheet made of said composition, coverlay film, and printed wiring board
  • Polyamide resin, resin composition thereof, flame-retardant adhesive composition and adhesive sheet made of said composition, coverlay film, and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0194] · Example 1 (polyamideimide resin 1)

[0195] Add 105.67g (0.55mol) of trimellitic anhydride, 80.09g (0.40mol) of sebacic acid, 175g (0.05mol) of carboxylic acid at both ends to a 4-necked detachable flask equipped with a stirrer, a cooling tube, a nitrogen inlet tube and a thermometer. Nitrile rubber (CTBN1300×13, number average molecular weight 3500, acrylonitrile part ratio 26wt%), 252.75g (1.0mol) 4,4'-diphenylmethane diisocyanate, 526g dimethylacetamide, under nitrogen flow The temperature was raised to 100°C, and the reaction was carried out for 2 hours. Then, add 117g of dimethylacetamide, further react at 150°C for 5 hours, add 439g of toluene and 146g of dimethylacetamide to dilute, cool to room temperature, and obtain brown polyamideimide without turbidity at all Resin solution 1.

[0196] The inherent viscosity, glass transition temperature, and tensile modulus of the polymer obtained from the resin solution were measured, and the results are shown in Table...

Embodiment 2

[0198] · Example 2 (polyamideimide resin 2)

[0199] Add 142.18g (0.74mol) of trimellitic anhydride, 40.45g (0.20mol) of sebacic acid, 210.0g (0.06mol) of Carboxylic acid nitrile rubber (CTBN1300×13), 125.13g (0.5mol) 4,4'-diphenylmethane diisocyanate, 87.08g (0.5mol) toluene diisocyanate, 517g dimethylacetamide, under nitrogen flow The temperature was raised to 100°C, and the reaction was carried out for 2 hours. Next, after reacting at 150° C. for 5 hours, 431 g of toluene and 258 g of dimethylacetamide were added for dilution, and cooled to room temperature to obtain a brown polyamideimide resin solution 2 without turbidity.

[0200] The same measurement and evaluation as in Example 1 were carried out, and the results are shown in Table 1.

Embodiment 3

[0201] · Example 3 (polyamideimide resin 3)

[0202] Add 105.67g (0.55mol) trimellitic anhydride, 92.12g (0.4mol) dodecanedioic acid, 175g (0.05mol) two-terminal Carboxylic acid nitrile rubber (CTBN1300×13), 250.25g (1.0mol) of 4,4'-diphenylmethane diisocyanate, and 535g of dimethylacetamide were heated to 100°C under a nitrogen stream, and reacted for 2 hours. Then, after reacting at 150° C. for 5 hours, 594 g of toluene and 119 g of dimethylacetamide were added for dilution, and cooled to room temperature to obtain a brown polyamideimide resin solution 3 without turbidity.

[0203] The same measurement and evaluation as in Example 1 were carried out, and the results are shown in Table 1.

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Abstract

Provided is a polyamide resin that simultaneously satisfies requirements for heat resistance, adhesivity, insulation reliability, and solvent solubility, and that is ideal for heat-resistant adhesives for printed wiring board applications. Also provided is a flame-retardant non-halogen adhesive composition made from ingredients that are soluble in general-purpose solvents, and which not only demonstrates stable characteristics but also demonstrates excellent flame-retardancy, solder heat resistance, adhesivity, and electric insulating properties when used for flexible printed wiring boards, for example. Disclosed is a polyamide resin characterized in that the polyamide resin is obtained by reacting acid components (a) to (c) given below and a diisocyanate or diamine having an aromatic ring, and in that when the total of all the acid components of said polyamide resin is 100 mol%, the ratios of the respective acid components are 3 to 10 mol% (a), 10 to 80 mol% (b), and 10 to 87 mol% (c). (a) An acrylonitrile-butadiene rubber having carboxyl groups at both ends; (b) An aliphatic dicarboxylic acid with a carbon number of 4 to 12; (c) A polycarboxylic acid anhydride with an aromatic ring.

Description

technical field [0001] The present invention relates to a polyamide-imide resin and a thermosetting resin composition using the resin, and specifically relates to a thermosetting resin composition which is excellent in flexibility, heat resistance, solvent solubility, insulation, and adhesion and is suitable for copper clad layers Adhesive resin compositions for printed wiring boards such as pressboards, cover films, adhesive sheets, resin-attached copper foils, coating inks (opa-ko-toinki), and pre-impregnated cotton cloths. [0002] In addition, the present invention can exert excellent performance in printed circuit boards, especially flexible printed circuit boards that require flexibility, and relates to products with excellent flame retardancy, soldering heat resistance, adhesion and electrical insulation. Flame-retardant adhesive composition, and copper-clad laminate, adhesive sheet, cover film, resin-attached copper foil, resin-impregnated cotton cloth, and coating ink...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/34C08G73/14C08L63/00C08L79/08C09J7/02C09J109/02C09J163/00C09J179/08
CPCH05K3/386C08G18/692H05K3/281C08L63/00C09J175/04C08G73/1035C08G18/345C08L79/08C09J179/08C08L2666/22C08G18/34C08G73/14
Inventor 家根武久南原慎太郎伊藤武
Owner TOYOBO MC CORP
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