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Novel polyamic acid, photosensitive resin composition, dry film and circuit board

A polyamic acid, chemical formula technology, applied in printed circuits, printed circuits, printed circuit manufacturing and other directions, can solve problems such as limitations in the development of circuit protection films, difficulty in realizing weak alkaline aqueous solution development characteristics, and reduction in space filling characteristics. Provides the effect of process stability and ease of operation

Active Publication Date: 2014-01-08
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the molecular weight increases, the compatibility with other substances decreases, it becomes difficult to realize the developing characteristics with respect to weak alkaline aqueous solution, and the space filling characteristics decrease due to high modulus
Therefore, there are limitations in the development of circuit protection films made of polyimide as a photosensitive protection film

Method used

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  • Novel polyamic acid, photosensitive resin composition, dry film and circuit board
  • Novel polyamic acid, photosensitive resin composition, dry film and circuit board
  • Novel polyamic acid, photosensitive resin composition, dry film and circuit board

Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment 1

[0261] [Preparation Example 1] Preparation of polyamic acid (PAA1)

[0262] In a 4-necked round-bottom flask equipped with a thermometer, stirrer, nitrogen input port, and powder distribution funnel, 38 g of 4,4′-oxodiphthalic anhydride (ODPA) was dispersed into 150 g of In a mixed solvent of toluene and dimethylacetamide (weight ratio: 3:7).

[0263] Then, 23.2 g of 4,4′-oxodiphenylamine (4,4′-ODA) and 2.59 g of DPIM obtained in the synthesis example were completely dissolved in the above solution under stirring, and then the resulting product was stirred again 24 hours to obtain polyamic acid varnish.

[0264] The varnish solution had a solids content of 30% by weight and a viscosity of 3400 cps at room temperature.

preparation Embodiment 2

[0265] [Preparation Example 2] Preparation of polyamic acid (PAA2)

[0266] In a 4-necked round-bottomed flask equipped with a thermometer, stirrer, nitrogen gas inlet, and powder distribution funnel, 38 g of 4,4′-oxodiphthalic anhydride (ODPA) was dispersed into 149 g of In a mixed solvent of toluene and dimethylacetamide (weight ratio: 3:7).

[0267] Then, 20.6 g of 4,4′-oxodiphenylamine (4,4′-ODA) obtained in Synthesis Example and 5.19 g of DPIM were completely dissolved in the solution under stirring, and the resulting product was stirred for another 24 hours To obtain polyamic acid varnish.

[0268] The varnish solution had a solids content of 30% by weight and a viscosity of 3600 cps at room temperature.

preparation Embodiment 3

[0269] [Preparation Example 3] Preparation of polyamic acid (PAA3)

[0270] In a 4-necked round-bottomed flask equipped with a thermometer, stirrer, nitrogen gas inlet, and powder distribution funnel, 38 g of 4,4′-oxodiphthalic anhydride (ODPA) was dispersed into 149 g of In a mixed solvent of toluene and dimethylacetamide (weight ratio: 3:7).

[0271] Then, 25.8 g of 4,4′-oxodianiline (4,4′-ODA) was completely dissolved in the solution with stirring, and the resulting product was further stirred for 24 hours to obtain a polyamic acid varnish.

[0272] The varnish solution had a solids content of 30% by weight and a viscosity of 3100 cps at room temperature.

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Abstract

The present invention relates to: a novel polyamic acid in which imidazole is introduced to polymer chains; a photosensitive resin composition containing the polyamic acid which can provide a photosensitive material satisfying the characteristics of excellent flexibility and low stiffness, and has excellent heat resistance and coating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film.

Description

technical field [0001] The invention relates to a novel polyamic acid, a photosensitive resin composition, a dry film and a circuit board. [0002] More particularly, the present invention relates to a novel polyamic acid, a photosensitive resin composition capable of providing a photosensitive material satisfying characteristics of excellent flexibility and low rigidity and exhibiting excellent heat resistance and coating resistance, A dried film obtained from the photosensitive resin composition and a circuit board including the dried film. Background technique [0003] Solder resist (or protective film) is a protective film for circuit patterns formed on the outermost surface of a printed substrate, and strict precision requirements are caused by the current trend of high-precision printed circuit boards. [0004] Recently, a photosensitive protective film (imageable cover film) for circuit boards has been used in photolithography using a photosensitive resin composition...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08G79/08G03F7/004C08J5/18
CPCH05K1/0393H05K1/0346C08G73/10G03F7/037G03F7/0387G03F7/40H05K3/287H05K2201/0154
Inventor 金丁鹤庆有真金熹正李光珠
Owner LG CHEM LTD
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