Bonding agent composition, bonding agent tablet using same and its uses

A binder and composition technology, applied in the direction of film/sheet adhesive, adhesive, adhesive type, etc., can solve the problems of reduced heat resistance of solder and poor heat resistance of solder

Active Publication Date: 2008-09-17
TOYO INK SC HOLD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, even if epoxy resin is used as the thermosetting resin, there will be no reaction between the two resins, so the heat resistance of the solder is poor.
In particular, the heat resistance of the solder after humidification is significantly reduced

Method used

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  • Bonding agent composition, bonding agent tablet using same and its uses
  • Bonding agent composition, bonding agent tablet using same and its uses
  • Bonding agent composition, bonding agent tablet using same and its uses

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0310] Next, the present invention will be described in more detail by showing examples, but the present invention is not limited thereto. In addition, in the examples, parts and % mean parts by weight and % by weight, respectively, Mn means number average molecular weight, and Mw means weight average molecular weight.

Synthetic example 1

[0312] In a reaction vessel equipped with a stirrer, a thermometer, a reflux cooler, a dropping device, and a nitrogen gas introduction pipe, the polyester polyol obtained from terephthalic acid, adipic acid, and 3-methyl-1,5-pentanediol was charged. 195.2 parts of alcohol (Kuraray Polyol P-2011 manufactured by KURARAY Co., Ltd., Mn=2040), 6.67 parts of dimethylol butyric acid, 40.7 parts of isophorone diisocyanate, and 70.0 parts of toluene, at 90°C under a nitrogen atmosphere React for 4 hours, add 250 parts of toluene therein, and obtain the urethane prepolymer (Mw=21,000; The molar ratio of the isocyanate group of the diisocyanate (b) is 1.30) solution.

[0313] Next, in a mixture of 6.08 parts of isophorone diamine, 0.59 parts of di-n-butylamine, 112.5 parts of 2-propanol and 184.5 parts of toluene, 506.3 parts of the above-mentioned urethane prepolymer solution containing isocyanate groups were added, React at 85°C for 4 hours, dilute with 63.0 parts of toluene and 27.0...

Synthetic example 2～5、7～9、13 and 16

[0315] Except having used the raw material shown in Table 1, it reacted similarly to the synthesis example 1, and obtained the solutions A-2-A-5, A-7-A-9, A-13, and A-16 of polyurethane polyurea resin. The properties of the obtained polyurethane polyurea resin are shown in Table 2.

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Abstract

Disclosed is an adhesive composition (I) characterized by containing a polyurethane polyurea resin (A) having a weight average molecular weight of 80,000-250,000 and an acid number of 3-25 mgKOH / g and an epoxy resin (B). The polyurethane polyurea resin (A) is obtained by reacting a urethane prepolymer (d) having an isocyanate group, a polyamino compound (e) and a monoamino compound (f) under the conditions stated below. The urethane prepolymer (d) having an isocyanate group is obtained by reacting a polyol compound (a), an organic diisocyanate (b) and a diol compound (c) having a carboxyl group. (i) The ratio between isocyanate groups of the urethane prepolymer (d) having an isocyanate group and amino groups of the polyamino compound (e) and the monoamino compound (f), namely amino groups / isocyanate groups is from 0.8 / 1 to 0.999 / 1 (molar ratio). (ii) The ratio of amino groups of the polyamino compound (e) in the 100 mol% of the total of the amino groups of the polyamide compound (e) and the amino groups of the monoamino compound (f) is 90.0-97.0 mol%.

Description

technical field [0001] The present invention relates to an adhesive composition for a flexible printed wiring board, and an adhesive sheet for a flexible printed wiring board, which are mounted on a semiconductor integrated circuit (IC) or the like and use a polyimide film or the like as a base film , and various flexible printed wiring boards formed using the same, and a manufacturing method thereof. [0002] Specifically, it relates to an adhesive composition and an adhesive sheet for fixing a reinforcing material composed of metal, glass epoxy, or polyimide to a flexible printed wiring board; Adhesive composition for conductive circuit side of flexible printed wiring board; adhesive composition and adhesive sheet suitable for further laminating flexible printed wiring boards; and related to use of the adhesive composition Various flexible printed wiring boards that are laminated and have excellent adhesiveness and solder heat resistance. Background technique [0003] Fl...

Claims

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Application Information

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IPC IPC(8): C09J175/00C09J7/02C09J163/00H05K1/03
CPCC08G18/0823H05K3/4626H05K3/386C08G18/12C09J175/04C08G18/3225C08G18/2865
Inventor 中村稔桑原章史小林英宣
Owner TOYO INK SC HOLD CO LTD
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