Photocuring/thermosetting inkjet composition and printed wiring board using same

一种热固化性、组合物的技术，应用在印刷电路、印刷电路制造、印刷电路二次处理等方向，能够解决降低阻焊剂耐热性、耐化学药品性、不能降低目标粘度、无法显现理想范围等问题，达到非电解镀耐受性优异的效果

Active Publication Date: 2006-06-07
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, inkjet ink has a limitation that its viscosity must be about 20 mPa·s or less at the time of coating, which is far from the viscosity of ink used for screen printing, which is about 20,000 mPa·s, even when diluted with a large amount of diluent. Still can't reduce to target viscosity
Furthermore, even if the viscosity is reduced, on the contrary, the physical properties such as heat resistance and chemical resistance required as a solder resist are greatly reduced.
In addition, when diluted with a volatile solvent, the non-volatile content becomes very small, and it is difficult to ensure the film thickness
Therefore, as a solder resist for printed circuit boards, the above-mentioned inkjet method cannot express an ideal range, and there is no useful solder resist ink that can be used with an inkjet printer.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～7 and comparative example 1

[0049] After mixing the mixing components shown in Table 1 in the mixing ratio shown in Table 2, use a disperser (DISPERMAT) CA-40C and a milling system (Milling System, manufactured by Getmann) to disperse for 20 minutes, and then filter through 1.0 μm filter to obtain a photocurable and thermally curable composition for inkjet.

[0050]

A component

①

pentaerythritol triacrylate

②

4-Hydroxybutyl acrylate

③

Acrylic dimer

④

2-Methacryloxyethyl isocyanate

⑤

Cyclopolymer-A-200 (acryloyl group-containing alicyclic epoxy resin, manufactured by Daicell Chemical Industry Co., Ltd.)

⑥

Oxetane methacrylate

⑦

ニカラツクMX-302 (acrylic-modified alkylated melamine, manufactured by Sanwa Chemical Co., Ltd.)

⑧

2-methoxyethyl acrylate

B component

(The brackets represent

molecular weight)

①

Dipentaerythritol hexaacrylate (547)

②

Trimethylolp...

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PUM

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Abstract

The invention provides a photocurable and thermosetting composition for inkjet, which contains: (A) a monomer having an acryl group or a methacryloyl group and a thermosetting functional group in the molecule; (B) a weight average molecular weight of 700 or less of the photoreactive diluent and (C) photopolymerization initiator other than the component (A), and the viscosity of the composition is 150 mPa·s or less at 25°C. The composition is used to directly draw a solder resist pattern on a printed circuit board with an inkjet printer, and is cured once by irradiating active energy rays, and then further heated and cured.

Description

technical field [0001] The present invention relates to a photocurable and thermosetting composition having heat resistance and a printed circuit board having a solder resist pattern directly drawn using the composition, which is suitable as a photoresist ink for use with an inkjet printer And directly describe the situation. Background technique [0002] As a method of manufacturing a printed circuit board using an inkjet printer, the following proposals have been disclosed (JP-A-56-66089, JP-A-56-157089, JP-A-58-50794, JP-A-6-237063 No.): A resist layer was formed by drawing a conductor circuit pattern on a metal foil on a plastic substrate with an inkjet printer, and an etching treatment was performed. This method is to draw directly based on CAD data. Therefore, compared with the photo-development method that uses a photosensitive resin and must use a photomask to make a wiring pattern or the photoresist ink to make a wiring pattern by a screen printing method, the abov...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F220/10B41M5/00C08F2/00C08F2/46C08F10/00C08F20/00C09D11/00C09D11/322C09D11/324C09D11/38H05K3/28
CPCC09D11/101H05K3/287H05K2203/013C08F20/06C08F220/10H05K3/28
Inventor 柿沼正久日马征智宇敷滋
Owner TAIYO HLDG CO LTD
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