1740 results about "High absorption" patented technology

Ultrasound bulk wave transducers and bulk wave transducer arrays for wide band or multi frequency band operation, in which the bulk wave is radiated from a front surface and the transducer is mounted on a backing material with sufficiently high absorption that reflected waves in the backing material can be neglected. The transducer is formed of layers that include a high impedance section comprised of at least one piezoelectric layer covered with electrodes to form an electric port, and at least one additional elastic layer, with all of the layers of the high impedance section having substantially the same characteristic impedance to yield negligible reflection between the layers. The transducer further includes a load matching section comprised of a set of elastic layers for impedance matching between the high impedance section and the load material and, optionally, impedance matching layers between the high impedance section and the backing material for shaping the transducer frequency response. For multiband operation, the high impedance section includes multiple piezoelectric layers covered with electrodes to form multiple electric ports that can further be combined by electric parallel, anti-parallel, serial, or anti-serial galvanic coupling to form electric ports with selected frequency transfer functions. Each electric port may be separately transceiver-connected to obtain parallel, anti-parallel, serial or anti-serial port coupling for multi-band transmission, and extremely wide-band reception.

A low-cost device for the detection of thermal neutrons. Thin layers of a material chosen for high absorption of neutrons with a corresponding release of ionizing particles are stacked in a multi-layer structure interleaved with thin layers of hydrogenated amorphous silicon PIN diodes. Some of the neutrons passing into the stack are absorbed in the neutron absorbing material producing neutron reactions with the release of high energy ionizing particles. These high-energy ionizing particles pass out of the neutron absorbing layers into the PIN diode layers creating electron-hole pairs in the intrinsic (I) layers of the diode layers; the electrons and holes are detected by the PIN diodes.

Ultrasound bulk wave transducers and bulk wave transducer arrays for wide band or multi frequency band operation, in which the bulk wave is radiated from a front surface and the transducer is mounted on a backing material with sufficiently high absorption that reflected waves in the backing material can be neglected. The transducer is formed of layers that include a high impedance section comprised of at least one piezoelectric layer covered with electrodes to form an electric port, and at least one additional elastic layer, with all of the layers of the high impedance section having substantially the same characteristic impedance to yield negligible reflection between the layers. The transducer further includes a load matching section comprised of a set of elastic layers for impedance matching between the high impedance section and the load material and, optionally, impedance matching layers between the high impedance section and the backing material for shaping the transducer frequency response. For multiband operation, the high impedance section includes multiple piezoelectric layers covered with electrodes to form multiple electric ports that can further be combined by electric parallel, anti-parallel, serial, or anti-serial galvanic coupling to form electric ports with selected frequency transfer functions. Each electric port may be connected to separate electronic transceiver systems to obtain, through selection of drive signals on individual ports, selectable electric parallel, anti-parallel, serial, or anti-serial coupling of the ports in transmit mode, enabling transmission of ultrasound pulses with multi-band frequency components. In receive mode, signals from the individual electric ports can be combined after isolation amplifiers in a filter-combination unit to obtain composite electric ports with extreme wide-band transfer functions and multi-band transfer functions covering a range from a 1st to a 4th harmonic band.

Light-emitting devices (e.g., LEDs) and methods associated with such devices are provided. In some embodiments, the device includes a distribution of light-generating portions (including active regions) that are spatially localized and separated (e.g., horizontally or vertically) from one or more patterned light extraction portions. This arrangement can allow light generated by the device to propagate and pass through regions of low absorption (e.g., light-extraction portions) rather than in regions of high absorption (e.g., light-generating portions), which can enhance light emission. In some instances, the devices include one or more series of light extraction portions with features arranged in a first and / or second pattern, which may be formed on one or more interfaces of the device (e.g., an emission surface). Patterns can be defined by a series of features (e.g., holes) having certain characteristics (e.g., feature size, depth, nearest neighbor distances) which may be controlled to influence properties of the light emitted from the device, including improving extraction and / or collimation of the emitted light.

An embodiment of the present invention allows for the production, with a high productivity, of a water-absorbent resin having an improved relationship between absorption capacity and water-soluble polymer, which are conflicting properties of the water-absorbent resin, being easily controlled for polymerization reaction, being of no odor, being less colored, and being of high absorption properties (high absorption capacity under load and high PPUP). In one embodiment of the present invention, a process for producing a water-absorbent resin by polymerizing an acrylic acid composition including acrylic acid and / or its salt, the process includes: (a) the step of carrying out radical polymerization of the acrylic acid composition to form a hydrogel crosslinked polymer; and (b) the step of drying the hydrogel crosslinked polymer by application of heat, the acrylic acid composition having an unpolymerizable organic compound content of 1 to 1000 ppm by weight, wherein the unpolymerizable organic compound has a solubility parameter of (1.0 to 2.5)×104(Jm−3)1 / 2.

A package for an optical fiber device is disclosed. It has a high thermal conductivity packaging substrate surrounding the optical fiber device and has adhesive bonds at each end anchoring the optical fiber device to the substrate. The adhesive bonds are made of a material that has high transparency in damp heat as well as a high glass transition temperature and is capable of withstanding temperatures of over 100° C. The packaging substrate has a high absorption capacity and a CTE in relation to the CTE of the adhesive bond, such as to compensate for any variation in the adhesive bond due to temperature variations. This allows to limit mechanical stress in the optical fiber device within the package.

The invention relates to a method for carrying out surface modification on waste fly ash and leading the waste fly ash to become an absorbing material with high absorption capacity and sterilization performance, and the method comprises the following steps: mixing the fly ash of 20 meshes with solution of an inorganic acid modifier (mixed solution that HCl: H2SO4 is equal to 1:3) according to the solution-ash ratio of 3: 1, and obtaining the partially modified fly ash under the ultrasonic action; and using a silane coupling agent for processing the surface of the fly ash, and further utilizing the reaction activity of the silane coupling agent for carrying out the further graft reaction, thereby preparing the absorbing material with immobilized polyquaternary ammonium salt sterilization performance and higher absorption capacity.

Light absorbing coating with high absorption capacity.This coating comprises at least one thin optically discontinuous metal layer (8), absorbent within a determined spectral range in the visible-near infrared range, and at least one dielectric layer (10) transparent within this range and formed on the thin layer. Application to imagery.