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Flexible laminate having thermoplastic polyimide layer and method for manufacturing the same

The technology of a polyimide layer and a manufacturing method, which is applied to a flexible laminate having a thermoplastic polyimide layer and the manufacturing field thereof, can solve the problems of high dielectric constant and reduced heat resistance, and achieve adhesion Effects of excellent strength, excellent migration resistance, and excellent solder heat resistance

Inactive Publication Date: 2009-04-15
KURASHIKI BOSEKI KK +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, existing polyimides are not suitable for melt molding even if they are thermoplastic. Therefore, the method proposed in the above-mentioned patent documents is to cast and coat the precursor polyamic acid on the base film, heat, and pass A lamination method in which a film obtained by imidization reaction (dehydration condensation reaction) is laminated to metal foil using an adhesive such as epoxy resin
Therefore, this method has the same problem as the above that the dielectric constant increases and the heat resistance decreases due to the use of an adhesive.

Method used

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  • Flexible laminate having thermoplastic polyimide layer and method for manufacturing the same
  • Flexible laminate having thermoplastic polyimide layer and method for manufacturing the same
  • Flexible laminate having thermoplastic polyimide layer and method for manufacturing the same

Examples

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Effect test

manufacture example 1

[0148] A thermoplastic polyimide (AURUM (registered trademark) PD500A manufactured by Mitsui Chemicals Co., Ltd.) containing chemical structural formulas (6) and (7) in a ratio of 90:10 was used, Tg258[°C], melting point 380[°C] , to 500sec -1 The melt viscosity 700 [Pa·S] measured by the shear rate), the chemical structural formula is the thermoplastic polyimide (AURUM (registered trademark) PD450C of Mitsui Chemicals (KK) system of the above-mentioned formula (6); Tg250 [°C ], melting point 388[℃], in 500sec -1 The melt viscosity measured at the shear rate of 500 [Pa·S]) resin pellets, and the melt viscosity [Pa·S] of the thermoplastic polyimide resin used for extrusion molding is based on JIS K-7199 , Measured with Shimadzu Rheometer CFT-500.

[0149] After drying the above-mentioned resin particles at 180°C for 10 hours in a hot-air type high-temperature tank, use a single-screw extruder with a screw diameter of 50mm and a T-die installed at its front end to extrude the ...

manufacture example 2

[0151] The thermoplastic polyimide (AURUM (registered trademark) PD500A manufactured by Mitsui Chemicals Co., Ltd.) containing the chemical structure formula (6) and (7) in a ratio of 90:10; Tg258[°C], melting point 380[°C ], in 500sec -1 Melt viscosity measured at a shear rate of 700 [Pa·S]), the chemical structural formula is the resin particles of polyetherimide (ULTEM 1000P manufactured by General Electric Company) of the above-mentioned formula (13), and the above-mentioned Production Example 1 of Thermoplastic Polyimide Resin Film A thermoplastic polyimide resin film with a thickness of 50 μm (hereinafter referred to as thermoplastic PI film b) was obtained by the same method and corona discharge treatment.

[0152] Polyimide resin film:

[0153] The polyimide whose chemical structural formula is the above-mentioned formula (7) is generally sold as a polyimide resin film (Kapton 200H manufactured by DuPont-Toray Co., Ltd.), so this commercially available polyimide resin...

Embodiment 1

[0155] Copper foil with a thickness of 18 μm was laminated on both sides of a 50 μm thermoplastic PI film a. This was sandwiched from both sides by stainless steel plates (referred to as SUS plates). Further, FUJIRON STM manufactured by FUJICO Co., Ltd., which is a polybenzoxazole felt-like cushioning material laminated on both sides of the SUS plate, was installed in a vacuum high-temperature press machine manufactured by Kitagawa Seiki Co., Ltd. Then, reduce the pressure to 1.0kPa, at the initial pressure of 10kgf / cm 2 Under the pressure, after raising the temperature to 300°C at 5°C / min, increase the pressure to the secondary forming pressure of 25kgf / cm 2 , keep in this state for 10 minutes. Then, slowly cooled to room temperature, to obtain figure 2 The flexible double-sided copper-clad laminate substrate shown. The properties shown in Table 1 were evaluated using the obtained copper-clad laminate, and the results are shown in Table 1 together.

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Abstract

Disclosed is a flexible laminate comprising a metal foil layer / a thermoplastic layer or / and a conductive circuit layer / a thermoplastic polyimide layer, which is obtained by bonding a metal foil layer or a conductive circuit layer to at least one side of a thermoplastic polyimide layer. In this flexible laminate, the thermoplastic polyimide layer is made of a thermoplastic polyimide resin film or sheet which is obtained by melt-extruding a thermoplastic polyimide resin. Alternatively, the thermoplastic polyimide layer is made of a biaxially stretched thermoplastic polyimide resin film or sheet. Such a flexible laminate can be easily produced by a lamination method wherein a thermoplastic polyimide resin film (1) and a metal foil (2) or a conductive circuit layer (4) are bonded by heat and pressure, and has excellent heat resistance, electrical characteristics and mechanical strength inherent in polyimides. When a biaxially stretched thermoplastic polyimide resin film or sheet is used, the flexible laminate can be improved in dimensional stability and solder heat resistance.

Description

technical field [0001] The present invention relates to a flexible laminate having a layer of thermoplastic polyimide as an adhesive layer and a method for its manufacture. Background technique [0002] With the increase in density of electronic devices in recent years, the printed circuit boards used therein have been multilayered, and flexible circuit boards often use a multilayer structure. [0003] Polyimide resin film is flexible and soft, and has excellent properties such as mechanical strength, heat resistance, and electrical properties. Therefore, a three-layer substrate bonded to copper foil using an adhesive such as epoxy resin has been used. It is widely used in the manufacture of flexible circuit boards and a type of tape automated bonding (TAB, Tape Automated Bonding) products called flexible printed circuit boards. However, since an adhesive is used, there is a problem that the dielectric constant becomes high and the heat resistance decreases. [0004] In ad...

Claims

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Application Information

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IPC IPC(8): B32B15/088B29C65/02B32B15/08C08G73/10
Inventor 西川高宏中野正志茜典之伊藤信人佐佐木正树有马圣夫
Owner KURASHIKI BOSEKI KK
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