77 results about "Kapton" patented technology

A fuel cell is described. The fuel cell includes current collectors, each of which includes a substrate of lightweight material, such as Kapton material. Micro channels are formed via laser machining or chemical etching into the substrate. The current collectors further include conductive layers sputtered on the substrate, and protective coating on the conductive layers. A variety of materials are available for the conductive layers. The fuel cell so developed is particularly well suited to mobile applications, such as electronic devices.

A cable for use in monitoring patients in an MRI environment. In one embodiment the cable is constructed of a flexible substrate on which are drawn conductive traces with a conductive ink. In one embodiment the flexible substrate is Kapton. In one embodiment the conductive ink is a carbon ink. In one embodiment the carbon ink has a resistance of 10 ohms/sq. In one embodiment the cable has a distributed impedance of 10,000 ohms/ft.

The invention relates to a preparation method of atomic oxygen-resistant polyimide hybrid films containing POSS structures. The preparation method comprises the following steps: reacting phenyl-containing monomers with aminopropyl-containing silane monomers in an alcohol/water cosolvent system under the action of a catalyst, volatilizing the solvent, washing, lyophilizing to obtain diamine POSS, modifying a polyimide material with the diamine POSS to prepare polyamide acid containing the POSS structure, and carrying out thermal imidization to obtain a series of polyimide hybrid films with different contents of the diamine POSS. Reaction conditions for synthesizing the diamine POSS are mild, the cost is low, and the POSS structure is introduced to the main chain of a polyimide molecule in a chemical bond manner, so the polyimide material has an excellent intrinsic atomic oxygen resistance, the hybrid films have excellent comprehensive performances, and the atomic oxygen resistances of the hybrid films are 6 times higher than that of unmodified Kapton polyimide films, thereby the hybrid films of the invention have important meanings to the development of the aviation and space industry.

An electronic package for interconnecting a high density pattern of conductors of an electronic device (e.g., semiconductor chip) of the package and a less dense pattern of conductors on a circuitized substrate (e.g., PCB), the package including in one embodiment but a single thin dielectric layer (e.g., Kapton) with a high density pattern of openings therein and a circuit pattern on an opposing surface which includes both a high density pattern of conductors and a less dense pattern of conductors. Conductive members are positioned in the openings to electrically interconnect conductors of the electronic device to conductors of the circuitized substrate when the package is positioned thereon. In another embodiment, the interposer includes a second dielectric layer bonded to the first, with conductive members extending through the second layer to connect to the less dense pattern of circuitized substrate conductors. Circuitized substrate assemblies using the electronic packages of the invention are also provided.

The invention relates to a plasma Gurney flap. The adopted plasma exciter is based on the principle of surface dielectric barrier discharge (DBD). The plasma Gurney flap comprises a single plasma exciter or a plasma exciter bar which is arranged on the airfoil shape trailing edge or the pressure surface at the trailing edge. The plasma exciter comprises two dissymmetrically placed electrodes, one of which (cathode) is exposed in the air directly while the other one (anode) is embedded in an insulating medium, wherein the electrodes are made of sheet metal, and the sizes thereof can be determined according to concrete conditions of application; if the insulating medium adopts polytetrafluoroethylene, epoxy resin, and the like, the plasma exciter can be made by adopting a printed circuit board; if the insulating medium adopts flexible insulating materials such as Kapton, Teflon, and the like, the plasma exciter can be made in a pasting mode; and the flexible insulating materials can adapt to different shapes of the airfoil trailing edge, thus the plasma Gurney flap is quite simple and convenient and is convenient to maintain.

The invention relates to a preparation method for a hyperbranched polymide film with the low dielectric constant. A series of the low-dielectric constant PI films with a hyperbranched structure are synthesized by taking 2,4,6-triaminopyrimidine (TAP) as a branching center through a one-step method. Through introduction of the hyperbranched structure, the dielectric constant of the PI film is significantly lowered, the inherent advantages of PI are better kept, and the good mechanical strength and thermo-oxidative stability are supplied to the film. The hyperbranched structure contains a large quantity of molecular chain end groups, dense packing of molecular chains is effectively inhibited, and therefore the hyperbranched PI film has the excellent dissolution characteristic to be more prone to be processed into a complex device. Compared with a Kapton standard film which is generally used at present, under the same testing conditions, the dielectric constant of the hyperbranched PI film prepared through the method is lowered by 20%-40%, the lowest dielectric constant even gets close to 2.0 and reaches the ultralow dielectric constant level, and the urgent demand for micro-electronic industry development in future can be met.

Sensor systems and methods are disclosed herein. A relative humidity sensor can be associated with one or more heating elements, wherein a perimeter of the relative humidity sensor is surrounded with a relatively conductive material. A thin substrate material can surround and laminate the heating element, such that the heating element is porous to permit humid air to pass through the heating element and wherein the at the heating element is assembled slightly offset from a surface of the relative humidity sensor. Air that is saturated with water vapor can then pass through and be heated by the heating element in order to evaporate water droplets associated with the water vapor to thereby reduce relative humidity to a measurable level.

Low pressure sensing and imperviousness to corrosion and to the effects of harsh environments are achieved in a pressure sensor that employs a flexible membrane supporting piezoresistive elements. A plurality of piezoresistive elements are aligned substantially collinearly across one surface of the flexible membrane. Innermost piezoresistive elements are disposed in such a way that they experience tension in response to an applied pressure, whereas outermost piezoresistive elements are disposed in such a way that they experience compression in response to the same applied pressure. Contact pads for each end of each piezoresistive element allow the elements to be configured in any number of desirable arrangements. In one exemplary embodiment, four piezoresistive elements are disposed along a main central axis of the membrane. The contacts of the elements are connected to form a Wheatstone bridge. Conventional Wheatstone bridge techniques are utilized to convert an applied pressure into an output electrical signal. The membrane includes amorphous or nanocrystalline semiconductor layers grown on a flexible substrate such as Kapton or suitable plastic materials.

A system and method for enhanced magnet wire insulation is described. The system of the invention provides an enhanced insulation for magnet wire that is capable of withstanding high temperatures and provides a seal against water that is needed in electric submersible pump (ESP) applications. The enhanced insulation of the system of the invention provides the dielectric advantages of polyimide tape, such as Kapton tape, while also including the advantages of organic polymer thermoplastic insulation that prevents the delaminating at high temperatures that may occur in pumping applications using a variety of electrical submersible motors.

A flexible hybrid coverglass for spacecraft solar panels comprised of small beads of either fused silica or ceria-doped borosilicate glass embedded in a matrix of conventional coverglass adhesives. These beads may also be used in a matrix of Kapton as the solar panel's substrate which may be combined with flexible solar cells to form flexible solar panels.

The invention relates to a preparation method of a polyimide film with an ultralow dielectric constant and low dielectric loss. HBPSi (Hyperbranched Polysiloxane) is first obtained by adopting a hydrolytic cocondensation method and multistep purification; finally, an HBPSi structure is introduced into a PI (Polyimide) molecular main chain in the form of a chemical bond; the modification on a PI material on a molecular level is realized; the dielectric constant of the PI material is obviously decreased; the inherent advantage of the PI material is maintained better. A PI film is excellent in dielectric property, favorable in heat resistance, outstanding in mechanical strength, low in water absorption, high in surface evenness, mild in reaction condition in a preparation process and lower in research and development costs, and is beneficial to large-scale commercial production. In comparison with a Kapton standard film which is currently used generally, the dielectric constant of an HBPSi-PI film is decreased by 30 percent to 40 percent in an equal test condition; a lowest dielectric constant is even approximate to 2.0; the level of the ultralow dielectric constant is reached; the active demand of the development of a microelectronic industry in the future can be met.

Disclosed herein is a method of manufacturing a continuous disk winding for high-voltage superconducting transformers that has special features of no joint and low loss, which are advantages of a layer winding, while being formed in the shape of a disk winding, which is advantageous in voltage distribution and insulation. The method includes lapping a high-temperature superconducting wire using Kapton films to apply multiple layers of insulation around the high-temperature superconducting wire, fixing one end of the high-temperature superconducting wire to a current inlet terminal of a bobbin, to the lower end of which is attached a fixing plate, which has the current inlet terminal, and winding the high-temperature superconducting wire on the bobbin by the predetermined number of turns, fitting a disk having a slit formed therein onto the bobbin to form high-temperature superconducting wire layers, inserting the high-temperature superconducting wire into a front end of the slit of the fitted disk and moving high-temperature superconducting wire to a rear end of the slit such that the high-temperature superconducting wire can be wound on the next layer by the predetermined number of turns, fitting a plurality of disks, each of which has a slit formed therein, onto the bobbin at predetermined intervals to form a plurality of high-temperature superconducting wire layers, and repeatedly winding the high-temperature superconducting wire for each disk such that the high-temperature superconducting wire is wound from one end of the bobbin to the other end of the bobbin, and, after the winding operation is completed, fixing the other end of the high-temperature superconducting wire to a current inlet terminal of another fixing plate attached to the upper end of the bobbin.

A vacuum chamber 2 has walls having an inner layer 20 of a gas impermeable electrically non-conductive material and an outer layer 22 of a different electrically non-conducting material. The inner layer 20 is a polymeric film layer of Kapton® polyimide. The outer layer 22 is a composite material which includes reinforcing carbon or glass fibers bound in a matrix of epoxy resin. The vacuum chamber has end flanges for attaching it to adjacent parts of a vacuum system. The vacuum chamber is made by placing a sheet of Kapton® material around a mould and sealing its ends together. The composite material is then wound onto the inner layer in its wet form to provide the outer layer. The outer layer material is then cured to dry the epoxy resin, binding the layer to the inner layer, and the multi-layer structure removed from the mould. The vacuum chamber is particularly suitable for use in an ion implantation system in the presence of a time varying magnetic field.

The invention discloses a model construction method for researching thermodynamic properties of a repeated polyimide system by adopting system coarse graining molecular dynamics. The method comprisesthe following steps: a) carrying out all-atomic dynamics simulation on a melt system consisting of dianhydride and diamine used for synthesizing polyimide to obtain the equilibrium conformation and density of the melt system; b) adopting a reasonable system coarse graining model mapping scheme, and analyzing to obtain a bonding conformation distribution function and a radial distribution functionRDF of all-atomic dynamics simulation; c) carrying out Boltzmann transformation on the bonded conformation distribution function and the radial distribution function RDF of the all-atomic dynamics simulation obtained in the step b), so as to carry out coarse graining model molecular dynamics simulation; and d) obtaining a coarse graining potential function of the polyimide molecules. According tothe method disclosed by the invention, a Kapton film formed by polymerizing benzene type tetracarboxylic dianhydride and 4, 4 '-diaminodiphenyl ether is taken as an example, and through the steps, thermodynamic properties (density, glass transition temperature and the like) matched with an experiment are obtained.