The invention discloses a large-area reverse coil embossing shaping method for using flexible substrate and macro electron to produce middle micro structure. The invention uses reverse coil embossing technique, relative chromatograph aligning technique, and ultraviolet solidifying technique, to produce large-area three-dimension functional micro structure needed by macro electric appliance. The invention eliminates the left membrane in general embossing, to eliminate the additional process needed for treating left membrane. And the invention adds optical solidifier in electric functional material to solidify cold ultraviolet light source, thereby reducing the thermal deformation of flexible material. The invention has wide application in the productions of macro electron system as expandable large-size display, electric paper, OLED, film RFID, flexible solar sail, portable X-ray imager, portable radar, space solar power system, antenna device, and electromechanical intelligent cover adhered on the surface of arbitrary three-dimension structure.