Solvent-free conductive adhesive and preparation method thereof

Abstract

The invention discloses a solvent-free conductive adhesive and a preparation method thereof. The solvent-free conductive adhesive comprises the following components in parts by mass: 30-35 parts of solvent-free polyester resin; 2-3 parts of a latent curing agent; 0.3-0.5 part of single-walled carbon nanotube slurry; 1-3 parts of a dispersant; 0.2-0.5 part of an antifoaming agent; and 60-70 parts of nano silver powder. The solvent-free polyester resin is acrylate modified saturated polyester resin, and the dispersant is a block copolymer containing pigment affinity groups. The invention also provides a preparation method of the solvent-free conductive adhesive. The solvent-free conductive silver adhesive does not contain halogen, has good conductivity and excellent adhesion strength, can bedirectly used without blending of single components, does not need dry ice protection in the transportation process, has the advantages of simple preparation process, low cost, environmental protection and the like, is suitable for conductive adhesion and electrode extraction of solar conductive adhesives, LEDs and LCDs, and has a wide application prospect.

Description

technical field [0001] The invention relates to the technical field of conductive adhesives, in particular to a solvent-free conductive adhesive and a preparation method thereof. Background technique [0002] With the light, thin, small, integrated, and low-cost requirements of the microelectronics industry, the importance of conductive adhesives as a core basic material for the microelectronics industry as a substitute for lead-tin solder has become increasingly prominent. In recent years, new types of conductive adhesives have come out continuously in China, but most of them contain organic solvents, so the disadvantage of unstable contact resistance is very prominent. For example, Chinese patent document CN1931946A discloses a single-component silver-filled conductive adhesive that can be stored and transported at normal temperature, CN101245227A discloses a kind of epoxy conductive silver adhesive for LED and its manufacturing method, and CN101514281A discloses a conduct...

AI Technical Summary

Problems solved by technology

As a component of the conductive adhesive, the organic solvent in these technical solutions can improve the process performance; but it also has many disadvantages, such as toxicity, environmental pollution, unstable contact resistance of the cured product, and fillers It is easy to delaminate with organic trees, so the solvent-free conductive adhesive is more suitable for today's green environmental protection requirements

[0003] The current conductive adhesive products have the following technical problems: 1. Big smell; 2. Contain harmful substances, such as halogen elements; 3. High cost; 4. The reaction time is short and difficult to operate; 5. Printing is easy to ooze , the lines are easy to be out of shape, the electrical conductivity and thermal conductivity are not guaranteed, the electrical and thermal conductivity are low, and it is easy to age

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