High-dispersity acidic copper plating additive as well as preparation method and application thereof

Abstract

The invention relates to the field of highly dispersive all-bright acidic copper plating of printed circuit boards, in particular to a highly dispersive acidic copper plating additive and its preparation method and application. A highly dispersed acidic copper plating additive: at least one divalent sulfide main brightener, at least one polyethylene glycol or polypropylene glycol or both block copolymer polymer inhibitors, at least one alkyl quaternary ammonium salt Type cationic surfactant, 5‑50ml / L sulfuric acid, 0.1‑4ml / L formaldehyde. Its preparation method is to slowly add a specified amount of concentrated sulfuric acid into water, stir evenly and cool to room temperature, then sequentially add the inhibitor, surfactant, main brightener and formaldehyde into the sulfuric acid aqueous solution, stir until completely dissolved Concentrate to the final volume to obtain the highly dispersed acidic copper plating additive of the present invention. The high-dispersion acidic copper plating additive of the invention is especially suitable for electroplating through-holes with high thickness-to-diameter ratio of printed circuit boards, and can obviously improve the dispersion ability of the plating solution.

Description

technical field [0001] The invention relates to the field of electroless plating solutions, in particular to a highly dispersed acidic copper plating additive and its preparation method and application. Background technique [0002] After decades of development in the printed circuit manufacturing industry, the manufacturing process has become increasingly complex, and the number of printed circuit boards with high build-up layers and high thickness-to-diameter ratios has gradually increased, and the requirements for the electrical interconnection process between layers are also getting higher and higher. The acidic copper plating additives used in general commercial applications can meet the copper thickness requirements of through-hole plating with low thickness to diameter ratio (≤6:1). When the thickness to diameter ratio of printed circuit boards is above 8:1, most acid plating Copper additives need to take measures such as reducing the current density, increasing the l...

AI Technical Summary

Problems solved by technology

However, the above measures will inevitably increase the energy consumption of the electroplating production line or reduce the production capacity of the electroplating line, increasing the manufacturing cost