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Low-content nanometer conducting silver paste and its prepn

A technology of conductive paste and nano-silver, applied in conductive coatings, conductive adhesives, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problem of reducing the performance of materials such as resistance to cold and heat cycles, heat and humidity resistance, and high viscosity , Weaken the problems of printing processability, line resolution and adhesion, etc., and achieve the effect of easy size distribution, low viscosity and convenient construction

Inactive Publication Date: 2003-08-20
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the resin is adsorbed by the particles, the viscosity of the system is very high, which greatly weakens its printing process, line resolution and adhesion, and reduces the material's resistance to cold and heat cycles, heat and humidity resistance, etc.

Method used

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  • Low-content nanometer conducting silver paste and its prepn
  • Low-content nanometer conducting silver paste and its prepn

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3

[0021] NaBH 4 Prepare colloidal nano-Ag particles for the reducing agent, the specific composition and product particle size are shown in Table 1, and the TEM photos of the product are as follows figure 1 shown. The TEM experiment method is as follows: the obtained Ag particles are dispersed with cyclohexane, and after ultrasonic vibration, samples are prepared on a Cu grid coated with a carbon film. Then observe the shape of the particles and take pictures under a HITACHI HU-12 transmission electron microscope, and then perform statistical analysis to obtain the average particle size and distribution of the nano-Ag particles. It can be seen from Table 1 that with the increase of the weight ratio of water / surfactant, the particle size of nano-silver basically increases proportionally, indicating that the microemulsion method can effectively control the particle size of the product. A few samples of Example 3 were taken for DSC scanning, and it was found that the nano-silver ...

Embodiment 4-7

[0023] Using hydrazine hydrate as a reducing agent to prepare colloidal nano-Ag particles, the specific composition is shown in Table 2, the particle size of the product is shown in Table 3, and the TEM photo of the product is as follows figure 2 shown. Other properties are similar to Examples 1-3.

Embodiment 8

[0024] Embodiment 8: Get 10g of the nano-silver powder obtained in the above-mentioned embodiment 3, mix with 90g of epoxy resin at 80°C, mechanically stir at room temperature for 30min, ultrasonically treat for 15min, then add curing agent 2-ethyl 4-methylimidazole 2phr, After stirring evenly, it becomes a low-viscosity conductive paste. Its viscosity increases only slightly over pure epoxy resin. Paint the conductive paste on a glass plate, and after curing at 90°C for 1h+150°C for 4h, use the flat glass method to measure its resistivity to 5×10 -3 Ω.cm.

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Abstract

The present invention relates to one kind of nano conducting silver paste and its preparation, and aims at solving the problems of conducting paste with higher conducting stuffing content, high colloid viscosity and unsuitability in connecting through holes in multi-layer circuit board. According to the self-assembling and low temperature welding features of the nano silver particles, the presentinvention prepares nano silver powder via microemulsion process and low-content conducting nano silver particle paste with epoxy resin stuffing component. The paste has high conductivity, low colloidviscosity and thus wide application foreground in fixing electronic elements onto circuit board, connecting electrodes and especially connecting through holes in multi-layer circuit board.

Description

technical field [0001] The invention relates to a nano-silver conductive paste and a preparation method thereof, in particular to a low-content nano-silver conductive paste and a preparation method thereof. Background technique [0002] Polymer-based conductive paste, composed of polymers and conductive fillers, is an indispensable basic material for the electronics industry, and its application range is constantly expanding. At present, it has been widely used in printed circuit boards, electrical connections, assembly of liquid crystal displays, etc., and puts forward higher requirements for the reliability of electrical and mechanical properties of conductive paste. On the other hand, in order to adapt to the miniaturization and high performance of electronic equipment, multilayer circuit boards that can fix various semiconductor chips at high density are required. In this way, it is more common to use the internal through hole connection met...

Claims

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Application Information

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IPC IPC(8): C09D5/24C09J9/02H01B1/22
Inventor 容敏智章明秋刘宏
Owner SUN YAT SEN UNIV
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