2629 results about "Electrically conductive adhesive" patented technology

An electrically conductive adhesive includes a resin component, a photoinitiator, and metal-coated polymer beads. The beads have an average diameter and a very narrow size distribution around the average diameter. The adhesive is applied between a read / write head and a suspension to attach the two, and the adhesive is cured by exposure to an illumination and / or heat. A pad spacer is included between the read / write head and the suspension to define a spacing and parallelism therebetween. The beads in the adhesive can form one or more layers between the read / write head and the suspension or can be disordered. The metal coating of the beads provide electrical conductivity between the read / write head and the suspension.

A pad assembly according to the invention is used for mounting a current generator for applying a therapeutic electrical current to an area of human skin. Such an assembly includes a pad comprising a thin, flexible, stretchable plastic film that conforms to human skin, which pad has electrical paths printed on an underside thereof with electrically conductive ink. Each of the paths include a terminal and a conductive contact for connection to a current generator. A pair of layers of an electrically conductive adhesive such as a hydrogel are disposed over the terminals at spaced positions for conducting electrical current to human skin underlying the terminals. A fixture secured to the pad is configured for mounting the current generator a manner effective to conduct current from the current generator to the terminals of the pad.

The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides the mechanical robustness and reliability by relieving the stresses generated; and the metallurgically-bonded micron-sized metal particles and nano-sized metal particles provide a continuous conducting path with minimized interface resistance. Addition of nano-sized metal particles lowers the fusion temperature and allows the metallurgical-bonding to occur at manageable temperatures.

An anisotropic conductive adhesive contains conductive particles dispersed in a resin composition, wherein the resin composition includes a radical polymerization resin (A), an organic peroxide (B), a thermoplastic elastomer (C) and a phosphoric ester (D). The resin composition can further contain an epoxy silane coupling agent (E) represented by formula (2) or (3). The resin composition is mixed with other components after the radical polymerization resin (A), the thermoplastic elastomer (C), the phosphoric ester (D) and the epoxy silane coupling agent (E) are reacted. It is also possible to preliminarily react only the phosphoric ester (D) and the epoxy silane coupling agent (E) and to react the product of the preliminary reaction with the radical polymerization resin (A) and the thermoplastic elastomer (C), and then to add other components. The anisotropic conductive adhesive of the present invention can be used for electrical joining of electronic or electric parts of electrical apparatus.

The invention is based on use of a heat-activated adhesive for manufacturing of intelligent devices comprising printed conductive electronics on a flexible substrate, where the adhesive is an anisotropic electrically conductive adhesive and is applied to the substrate as a thin film which can be used for electrical connections and for providing mechanical stability to the printed conductive electronics.

A new interconnection scheme is disclosed for a tape automated bonding (TAB) package, a flip chip package and an active matrix liquid crystal display (AMLCD) panel, where an electrically conducting adhesive is used to form an electrical interconnection between an active electronic device and its components. The electrically conducting adhesive can be a mixture comprising a polymer resin, a no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating which provides a metallurgical bond between the conducting particles as well as to the substrates. The advantages of using the electrically conducting adhesives include reduction in bonding pressure and / or bonding temperature, control of interfacial reactions, promotion of stable metallurgical bonds, enhanced reliability of the joints, and others.

The present invention relates to a lithium-ion battery anode or cathode pole piece and a spreading method of the anode pole piece or the cathode pole piece, wherein, the anode pole piece and the cathode pole piece consists of a foil, a conducting adhesive thin layer and an electrode active material layer in turn; the thickness of the conducting adhesive thin layer is five to ten microns. The electrode pole piece is made in the procedures that a layer of conducting adhesive thin layer in the thickness of five to ten microns are pre-coated on the surface of the foil before the sizing agent is spread, so that a conducting adhesive thin layer having good adhesive force, good conductivity and compact structure is formed on the surface of the foil. Then the electrode active material sizing agent is spread on the conducting adhesive thin layer, and is dried under an appropriate temperature to produce a required pole piece. The present invention can reduce the surface of the foil, and can improve the wetting quality of the sizing agent, thereby improving the adhesion performance of the anode material and the collecting body (aluminum foil) so as to reduce the powder-dropping of the battery during the cycling process, and to prolong the cycling service life of the battery; moreover, the present invention can reduce the content of the adhesive agent in the sizing agent, and improve the utilization rate of the active substance, and the method of the present invention does not produce negative influence on the performance of the battery.

The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by one of several methods, including attachment by an electrically conductive adhesive, such as epoxy or polyimide, containing platinum metal flake in biocompatible glue; diffusion bonding of platinum bumps covered by an insulating layer; thermal welding of wire staples; or an integrated interconnect fabrication. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Incorporating organophilic clay into hot melt adhesive compositions, particularly those comprising semi-crystalline, thermoplastic polymers, greatly improves the adhesive properties in many respects. Some of these improvements are particularly beneficial to the specific use of hot melt adhesives filled with electrically conductive particles for use as electrically conductive adhesives.

A method of interconnecting terminals so as to obtain an excellent electrical connection between terminals such as opposing electrodes and a mounting method for semiconductor devices using this connecting method are provided. Electrode pads 21 of a semiconductor chip 20 and lands 11 which are provided on a substrate 10 so as to correspond with the electrode pads 21 are placed so as to oppose each other with an electrically conductive adhesive therebetween. Then, the electrically conductive adhesive is heated to a temperature which is higher than the melting point of electrically conductive particles contained in the electrically conductive adhesive and at which a resin is not completely cured, and the electrically conductive particles are bonded to each other. Then, the semiconductor chip 20 and the substrate 10 are secured by completely curing the resin in the electrically conductive adhesive.

There is provided a solid-state electrochromic device including a lower transparent conductive layer (12) formed into filmy shape on a glass substrate, partially provided with a groove (12b), and insulated with the groove (12b), an electrochromic layer (13) layered on the lower transparent conductive layer (12), and an upper transparent conductive layer (14) in direct contact with an insulated portion (12a) of the lower transparent conductive layer. Metal foil terminals (17) made of a metal foil (17a) to which an electrically conductive adhesive material (17b) is applied are bonded to an end of a body portion (12c) of the lower transparent conductive layer and an end of the insulated portion (12a) of the insulated lower transparent conductive layer.

The invention is directed to a device for delivering a pharmaceutically active compound or cosmetic substance to a subject comprises a flexible substrate sheet attached to an electronic controller. The controller is provided with a pair of electrical contacts on the underside thereof and is adhered to the sheet by means of a pair of strips of electrically conductive adhesive. The underside of the sheet is printed in two halves with electrically conductive ink to provide a pair of electrodes separated by an insulating barrier. A protuberance extends from each electrode and is folded onto the top of the sheet such that the contacts of the controller are adhered in electrical connection with the protuberances and thus also with the electrodes. The use of an adhesive to connect a controller in electrical communication with the electrodes enables an extremely simple construction of delivery device to be achieved.

A flip-chip package is described. The flip-chip package includes a chip, a substrate, supporters and electrically conductive adhesive bumps. The electrically conductive adhesive bumps are located between the chip and the substrate electrically connecting the bonding pads on the former and the bump pads on the latter, wherein each electrically conductive adhesive bump has a smaller diameter at the central portion thereof than at the end portions thereof. The supporters are also disposed between the chip and the substrate surrounding the active area of the chip, so that the chip can be supported on the substrate.

The invention provides a method for preparing high-heat-conductivity conductive adhesive containing graphene. The method comprises the steps of (1) functionalizing surface of graphene, namely adding graphene to acetone solution of an organic matter containing a conjugate ring, and strongly ultrasonically shaking for 6-48 hours at 40-100 DEG C to form non-covalent modified graphene; (2) mixing epoxy resin with an epoxy diluent for 3-30 minutes at room temperature to obtain a mixture of epoxy resin and the epoxy diluent, and sequentially adding metal powder and a coupling agent to the mixture; (3) adding the non-covalent modified graphene prepared in the step (1) to the mixture in the step (2); and (4) adding a curing agent to the mixture in the step (3) to prepare the even conductive adhesive. The method has the advantages that dispersing and enhancing interface joint in an epoxy system are facilitated by functionalizing the surface of graphene by a non-covalent bond; and then graphene is mixed with metal powder to obtain the high-heat-conductivity conductive adhesive. The high-heat-conductivity conductive adhesive has the application prospect in a high-power apparatus.

A wiring connecting structure for a piezoelectric element is capable of performing wiring to the piezoelectric element without deteriorating the quality and reliability of the piezoelectric element. The piezoelectric element is arranged between a base and head of an object, to minutely move the head in a sway direction according to deformation that occurs on the piezoelectric element in response to a voltage applied from a terminal to an electrode of the piezoelectric element. The wiring connecting structure includes first and second liquid stoppers arranged between the terminal and the electrode, the second liquid stopper being arranged outside the first liquid stopper. The wiring connecting structure also includes an adhesive part to connect the electrode to the terminal. The adhesive part has a conductive adhesive part defined by the first liquid stopper and a sealing adhesive part defined by the second liquid stopper. The sealing adhesive part seals the first liquid stopper and conductive adhesive part.

An electrically conductive adhesive tape used for electrical and electronic products to bond or fix an element to a support while maintaining an electrical conductibility between the element and support. The conductive adhesive tape has a structure including a resin film, a metal layer formed over one surface of the resin film by depositing a conductive metal over the surface of the resin film, and a conductive adhesive layer coated over the metal layer. The metal layer has a net-shaped structure. In some cases, the metal layer may have a planar structure. The conductive adhesive tape has a very small thickness by virtue of its metal layer deposited to a very small thickness. Accordingly, the conductive adhesive tape maintains a desired strength while exhibiting a high flexibility and a high bondability, thereby exhibiting a superior conductibility. In the case in which the metal layer has a net-shaped structure, the tape has a structure having spaces where the metal layer does not exist. Where the tape is applied to a Braun tube, accordingly, there is no influence on an electron beam emitted from a deflection yoke while a desired conductibility is maintained. The manufacture of the tape is simple. By virtue of the conductibility, the tape of the present invention also has an elecromagnetic wave shielding function.

A composition providing electrically conductive adhesive hydrogels suitable for use as skin contact adhesives and, particularly, suitable for use as an electrical interface for disposable medical devices. The present hydrogels provide for reduced skin irritation and / or malodor properties, hydrate a subject's skin, readily wet around a subject's skin surface hair, and protect against burning of a subject upon or due to electrical stimulation through the hydrogel. These hydrogels generally include a monomer, a first initiator, a second initiator, and a cross-linking agent. The present hydrogels also desirably include a solubilizer. The present hydrogels also desirably may include a buffer system to help prevent discoloration of the hydrogels and / or hydrolysis of the hydrogels as well as to improve shelf-life. Other additives such as conductivity enhancers, pharmaceuticals, humectants, plasticizers, skin health agents, etc. may be added to the present hydrogels either before or after curing.

An electrically conductive adhesive composition which has flexibility and folding endurance and is feasible for use as a shield against electromagnetic waves from a flexible printed circuit, comprises 100 parts by weight of (a) an acrylonitrile-butadiene copolymer, 20 to 500 parts by weight of (b) a phenolic resin and / or an epoxy resin, 1 to 100 parts by weight, per 100 parts by weight of the components (a) and (b) in total, of (c) an electrically conductive filler and 1 to 50 parts by weight, per 100 parts by weight of the components (a) and (b) in total, of (d) a bromine-containing flame retardant.

A new interconnection scheme of a ball grid array (BGA) module is disclosed where a solder ball is connected to the BGA module by use of an electrically conducting adhesive The electrically conducting adhesive can be a mixture comprising a polymer resin, no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating and others. The solder balls in a BGA module can also be connected to a printed circuit board by use of another electrically conductive adhesive which can be joined at a lower temperature than the first joining to the BGA module. Additionally, an electrically conducting adhesive can be formed into electrically conducting adhesive bumps which interconnect an integrated circuit device to the BGA module.

A metal nanoparticle colloid solution, metal-polymer nanocomposites, and methods for preparing the same are provided. The metal nanoparticle colloid solution and the metal-polymer nanocomposites can be prepared with a variety of polymeric stabilizers and have uniform particle diameter and shape. The metal nanoparticle colloid solution and the metal-polymer nanocomposites have wide applications, for example, as an antibacterial agent, a sterilizer, a conductive adhesiv, conductive ink or an electromagnetic wave shielder for an image display.

A laminate-type piezoelectric element has a ceramic laminated body obtained by alternately laminating piezoelectric layers made of a piezoelectric material and inner electrode layers having electrical conductivity. Outer electrodes are joined to side surfaces of the ceramic laminated body via an electrically conductive adhesive. The electrically conductive adhesive has buried therein mesh bodies obtained by forming a mesh by using a nonmetallic material. The mesh bodies are desirably constituted by using any one of a resin, ceramic, carbon or glass.

The invention relates to a silver coated nickel powder conductive adhesive. The silver coated nickel powder conductive adhesive comprises, by mass, 40-90% of a conductive filler, 5-45% of a resin, 0.5-20% of a curing agent, 0-50% of a solvent and 0.1-20.0% of an assistant, and the conductive filler comprises at least one of micro-silver coated nickel powder and nano-silver coated nickel powder. The silver coated nickel powder conductive adhesive has the advantages of excellent conductivity, low cost, no lead, no halogens and the like. The invention also discloses a preparation method of the silver coated nickel powder conductive adhesive. The method is characterized in that the curing agent is added in a dispersion process after grinding, so the conductivity, the cementability, the viscosity and the like can be effectively regulated, and the untoward influences of the interaction of all components of the conductive adhesive in the dispersion and grinding processes to the storage, application and stability of the conductive adhesive are avoided.

The invention discloses a chemical silver plating preparing conducting resin method on the graphite powder surface in the chemical silver plating and micro-electronics connection material technique domain, which comprises the following steps: oxidizing the graphite powder in the air at 600-650DEG C; putting the dispersant, reducer and stabilizing agent in de-ionized water for reduced liquid; adding in graphite powder to stir; putting the silver nitrate in the de-ionized water; adding in ammonia and sodium hydroxide to get argentamine; putting the reduced liquid in the argentamine liquid to finish chemical silver plating on the graphite powder surface; filtering; separating and washing; drying in vacuum to get silver coated graphite powder.

The invention relates to the field of semiconductor electronic materials, and in particular relates to a silver nanowire doped conductive silver colloid and a preparation method thereof. The raw materials of the silver nanowire doped conductive silver colloid provided by the invention comprise the following components in percentage by weight: 25-60% of micrometer silver powder, 5-30% of silver nanowires, 20-50% of epoxy resin, 1.6-4% of curing agent, 5.8-9.2% of dissolvent, 0.4-1.6% of accelerant, 0.04-0.16% of toughening agent and 0.8-2.4% of additive. The conductive silver colloid is prepared by mixing and doping single-crystal silver nanowires and silver granules, thus, the total silver doping amount is reduced to 35-45%, and the conductive silver colloid has a favorable conductive effect, high shear strength, low working temperature and good ageing-resistant performance, and the cost of the conductive silver colloid is reduced. The silver nanowire doped conductive silver colloid can be widely applied to the fields of solar cell (film, crystal silicon) conductive colloids, conductive colloid LED (Light-Emitting Diode) package and the like.

The fabrication method of an organic substrate having embedded active-chips such as semiconductor chips is disclosed. The present invention previously applies the conductive adhesives in a wafer state, makes them in a B-stage state, obtains individual semiconductor chips through dicing, and positions the individual semiconductor chips previously applied with the conductive adhesives in the cavities, making it possible to simultaneously obtain an electrical connection and a physical adhesion of the substrate and the semiconductor chips by means of a method of applying heat and pressure and stack the copper clad laminates on the upper portion of the substrate to which the semiconductor chips are connected. The present invention has advantages in processes such as a lead-free process, an environmental-friendly fluxless process, a low temperature process, ultra-fine pitch applications, etc., by mounting the active-chips through the flip chip interconnection using the non-solder bumps and the conductive adhesives.

A composition providing electrically conductive adhesive hydrogels suitable for use as skin contact adhesives and, particularly, suitable for use as an electrical interface for disposable medical devices. The present hydrogels provide for reduced skin irritation and / or malodor properties, hydrate a subject's skin, readily wet around a subject's skin surface hair, and protect against burning of a subject upon or due to electrical stimulation through the hydrogel. These hydrogels generally include a monomer, a first initiator, a solubilizer, and a cross-linking agent. The present hydrogels also desirably include a buffer system to help prevent discoloration of the hydrogels and / or hydrolysis of the hydrogels as well as to improve shelf-life. Other additives such as conductivity enhancers, pharmaceuticals, humectants, plasticizers, skin health agents, etc. may be added to the present hydrogels either before or after curing.

A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive. A second substrate may then be attached to the conductive matrix structure secured to the first substrate by providing a low melting temperature attachment means to the solid conductive material attached to the matrix and subsequently reflowing the assembly to form an electronic assembly adapted with the capability of reworkability.

A packaged integrated circuit (IC) (100) includes a first substrate (110) including a first plurality of layers and first circuit coupling features (112) at an upper surface of the first substrate (110). The first plurality of layers include a first electromagnetic interference shielding layer (132). The packaged IC also includes a second substrate (106) having an upper surface attached to a lower surface of the first substrate (110) by an electrically conductive adhesive material (136). The second substrate (106) includes a second plurality of layers and a second circuit coupling feature (108) at a lower surface of the second substrate (106). The first plurality of layers includes a second EMI shielding layer (134). The packaged IC further includes a functional die (124) disposed between the first (110) and the second (106) substrates and functionally coupled to the first (112) and / or the second (108) circuit coupling features. In the packaged IC, the adhesive material (136) electrically couples the first (132) and the second (134) shielding layers.

A semiconductor device to prevent breakage of a semiconductor chip is disclosed. The device incorporates a sealing member, a semiconductor chip and having a source and gate electrodes on a first main surface and a drain electrode on a second main surface, a first electrode plate having an upper surface exposed to an upper surface of the sealing member and a lower surface exposed to a lower surface of the sealing member, and second electrode plates each having a lower surface exposed to the lower surface of the sealing member. The drain electrode of the chip is electrically connected to the drain electrode plate through an adhesive. Stud type bump electrodes are formed by gold wire on the source and gate electrodes and are covered with an electrically conductive adhesive. The bump electrode(s) and the source and gate electrode plates are electrically connected with each other through the adhesive.

The invention relates to conductive adhesive which is added with short rod shaped silver powder and a process for preparation, which belong to the technical field of preparing technology for plastic material which is used to pack micro-electronics. The invention is characterized in that mixing silver powder of the short rod shaped silver powder and micrometer silver powder are taken as conductive filler and added into epoxide resin basal bodies to prepare utility conductive adhesive with high performance. The components and the percentage composition of the conductive adhesive are that polymeric matrix epoxide resin E-51 is 24-40%, conductive silver powder particles are 50-70%, wherein the short rod shaped silver powder is 10% and the micrometer silver powder is 40-60%, toughening agent dibutylphthalate is 2.4-4.0%, and curing agent triethanolamine is 3.6-6.0%. The preparation of the micrometer silver powder adopts silver nitrate, polyvinylpyrrolidone surface active agent and hydrazine hydrate reducing agent 5% as raw materials and prepared through liquid phase reducing reaction. The usage mass ratio of the silver nitrate and the polyvinylpyrrolidone is 1:1. Since the conductive adhesive which is prepared by the invention is added with the micrometer silver powder, thereby the electrical conductivity and the mechanical properties are increased, and the invention has better antiaging performance.