117results about How to "Reliability is deteriorated" patented technology

The invention relates to a method and apparatus for determining a chemical component from a sample, where the sample is measured on a test strip with the help of a color reaction. The method concerns finding the measurement time Tm for measuring the reflection of the test strip. The method comprises the following steps: a) Recording the R(t) function, b) Determining the T0 starting time at the detection of the wetting through of the sample, c) Generating the function R(t)+L(t), d) Monitoring and storing the ext[R(t)+L(t)] extreme value of the R(t)+L(t) function, and, at the same time, e) Generating the function R(t)+L(t)-ext[R(t)+L(t)] from the time of reaching an ext[R(t)+L(t)] extreme value, f) when the R(t)+L(t)-ext[R(t)+L(t)] function reaches a predetermined C(t) value, determining the Tm measuring time.

A wiring connecting structure for a piezoelectric actuator includes a terminal 57-1, a through hole 67 formed through the terminal 57-1, a first liquid stopper 69-1 arranged around the through hole 67 in a gap between the terminal 57-1 and a common electrode 19 of a piezoelectric element 13 of the piezoelectric actuator, and a liquid trap 73 arranged adjacent to the first liquid stopper 69-1. The terminal 57-1 faces the common electrode 19 with an electric insulating layer 61 being on the piezoelectric element 13 side and the first liquid stopper 69-1 being in the gap between the common electrode 19 and the terminal 57-1. A liquid conductive adhesive 79 is filled in the through hole 67. If there is an excess of the liquid adhesive 79, the excess is guided into a trapping space 77 of the liquid trap 73, to prevent the excess from oozing out.

A wiring connecting structure for a piezoelectric element is capable of performing wiring to the piezoelectric element without deteriorating the quality and reliability of the piezoelectric element. The piezoelectric element is arranged between a base and head of an object, to minutely move the head in a sway direction according to deformation that occurs on the piezoelectric element in response to a voltage applied from a terminal to an electrode of the piezoelectric element. The wiring connecting structure includes first and second liquid stoppers arranged between the terminal and the electrode, the second liquid stopper being arranged outside the first liquid stopper. The wiring connecting structure also includes an adhesive part to connect the electrode to the terminal. The adhesive part has a conductive adhesive part defined by the first liquid stopper and a sealing adhesive part defined by the second liquid stopper. The sealing adhesive part seals the first liquid stopper and conductive adhesive part.

A wiring connecting structure for a piezoelectric element is capable of performing wiring to the piezoelectric element without deteriorating the quality and reliability of the piezoelectric element. The piezoelectric element is arranged between a base and head of an object, to minutely move the head in a sway direction according to deformation that occurs on the piezoelectric element in response to a voltage applied from a terminal to an electrode of the piezoelectric element. The wiring connecting structure includes first and second liquid stoppers arranged between the terminal and the electrode, the second liquid stopper being arranged outside the first liquid stopper. The wiring connecting structure also includes an adhesive part to connect the electrode to the terminal. The adhesive part has a conductive adhesive part defined by the first liquid stopper and a sealing adhesive part defined by the second liquid stopper. The sealing adhesive part seals the first liquid stopper and conductive adhesive part.

This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

With a recent shrinking semiconductor process, insulating layers formed between interconnect layers are becoming thin. To avoid parasitic capacitance between them, materials of a low dielectric constant have been used for an insulating layer in a multilevel interconnect. Low-k materials, however, have low strength compared with the conventional insulating layers. Porous low-k materials are structurally fragile. The invention therefore provides a manufacturing method of a semiconductor device having a multilevel interconnect layer including a low-k layer. According to the method, in a two-step cutting system dicing in which after formation of a groove in a semiconductor water with a tapered blade, the groove is divided with a straight blade thinner than the groove width, the multilevel interconnect layer portion is cut while being covered with a tapered face and then the wafer is separated with a thin blade which is not brought into contact with the multilevel interconnect layer portion. The wafer can be diced without damaging a relatively fragile low-k layer.

In a method of forming a liquid crystal display device, a black matrix is disposed on a substrate including a switching element formed thereon, a color filter is disposed on the switching element, a pixel electrode is electrically connected to the switching element, and a first alignment layer is disposed on the pixel electrode, to form a first substrate. A second substrate including a second alignment layer is formed. At least one of the first alignment layer and the second alignment layer includes a reactive mesogen. A liquid crystal layer is interposed between the first substrate and the second substrate. A light is irradiated onto the second substrate to provide pretilt angles of liquid crystal molecules of the liquid crystal layer.

This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

A control system is provided for controlling a hybrid vehicle that includes an internal combustion engine; an electric motor for starting the internal combustion engine; an inverter for controlling the electric motor; a clutch for selectively connecting and disconnecting power transmission between the internal combustion engine and the electric motor; and a battery for supplying power to the electric motor. The control device includes: a voltage detection unit for detecting the voltage of the battery a voltage control unit for controlling the output of the battery in accordance with a first power value currently available within the voltage limit range of the battery; and an internal combustion engine starting unit for engaging the clutch to start engine while controlling the inverter in accordance with the output from the battery that in turn is controlled by the voltage control unit.

An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and / or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.

A piezoelectric element 13 has a common electrode 19 that receives electricity from a terminal 57. The terminal 57 has a through hole 67 and an electric insulating layer 61. The piezoelectric element 13 is arranged so that the common electrode 19 faces the electric insulating layer 61 of the terminal 57. A liquid stopper 69 is formed around the through hole 67 so as to come between the common electrode 19 and the terminal 57 when the common electrode 19 and terminal 57 are set to face each other. A liquid conductive adhesive 71 is injected into the through hole 67 to fill a gap defined by the liquid stopper 69 between the terminal 57 and the common electrode 19 and secure electric connection between the terminal 57 and the common electrode 19. This configuration improves the reliability of wiring to the piezoelectric element and prevents the piezoelectric element from being damaged.

A stable kinetic performance is to be exhibited even in the case of such a small-sized slider as Femto slider. In one embodiment, an air bearing surface (ABS) of a slider comprises a first pad constituting portion extending from a leading edge side to a trailing edge side, a second pad constituting portion and a third pad constituting portion formed on both sides of the first pad constituting portion and extending from the leading edge side to the trailing edge side, a connecting pad for connecting the first, second, and third pad constituting portions on the leading edge side, a first negative pressure portion formed by the first and second pad constituting portions and the connecting pad, a second negative pressure portion formed by the first and third pad constituting portions and the connecting pad, and an air trap portion formed on the leading edge side of the connecting pad.

Disclosed is a transmissive and reflective type LCD. In the LCD, a second substrate faces a first substrate. Liquid crystal layer is formed between the first and second substrate. A first polarizing plate is formed on outer surface of the first substrate. A second polarizing plate is formed on outer surface of the second substrate. A backlight is arranged at a rear side of the first polarizing plate. A transparent transflective film is arranged between the first polarizing plate and the backlight and has a plurality of layers where a first and a second layer each having different refractivity indexes are alternatively stacked. The transparent transflective film partially reflects and transmits incident light. By a restoring process occurring between the transflective film and the backlight, a predetermined amount of the incident light is transmitted through the transflective film repeatedly, so that transmissivity and light efficiency are enhanced.

A system for estimating a posture angular velocity of a predetermined part, such as a body 3, of a robot by using motion state amounts of the robot, including a desired motion of a desired gait, a detected value of a joint displacement, and a desired value of a joint displacement of a robot 1 having a gyro sensor (angular velocity sensor) mounted on the body 3 or the like in a case where no slippage is taking place between the robot and a floor, e.g., a state wherein the robot is not in a motion. A drift correction value of the angular velocity sensor is determined on the basis of a difference between the estimated value of the posture angular velocity and a detected posture angular velocity value by the angular velocity sensor, and the detected posture angular velocity value corrected by the drift correction value is integrated to determine an estimated value of the posture angle of the predetermined part.

A device has a semiconductor chip, a wiring board, a support which supports the semiconductor chip on the wiring board and forms a gap between the semiconductor chip and the wiring board, and a sealing resin injected into the gap and covering the semiconductor chip.

This semiconductor device comprises: a trench that is provided in a semiconductor substrate; an insulating film that covers the inner surface of the trench; and a buried wiring line that fills up the lower part within the trench and is in contact with the insulating film. A barrier insulating film is arranged at least at the interface between the insulating film and the buried wiring line.

A hydraulic brake device includes a master cylinder supplying pressurized fluid to plural brakes which respectively restrict the rotations of road wheels, a solenoid block mounted on the master cylinder and containing plural solenoid valves, and an ECU provided with a control board for controlling the solenoid valves to distribute pressurized fluid to the plural brakes and also provided with a case for containing the control board therein. The solenoid block and the ECU form an integrated structure, and the integrated structure composed of the solenoid block and the ECU is removably mounted on the master cylinder. Further, the ECU is secured to the solenoid block by screw bolts which are arranged within an area inside the external form of the control board. Thus, it becomes unnecessary to provide bolt seats for the screw bolt outside the case.

A multilayer piezoelectric device has a laminated body 1 having piezoelectric layers 2 laminated in the direction of a given axis “A” and internal electrode layers 4, 5 each disposed between two respective neighboring piezoelectric layers 2. The device further has a underlying layer 3 disposed on a side of the laminated body 1 and electrically connected to the internal electrode layers 4, 5, a first conductive reinforcing layer 10 joined to the underlying layer 3, a second conductive reinforcing layer 11 joined to the first conductive reinforcing layer 10, and a conductive joining material 9 joining the underlying layer 3 to the first conductive reinforcing layer 10. The second conductive reinforcing layer 11 is not directly joined by means of the conductive joining material 9.

There is provided a resin-seal type semiconductor device (BGA type semiconductor device) whose heat dissipating characteristic is improved, so that it is prevented from deteriorating in reliability. This BGA type semiconductor device includes a wiring substrate on a predetermined area on which a semiconductor chip is mounted; a plurality of metal bumps that are formed to be arranged at predetermined intervals in an area of the substrate different from the area on which the semiconductor chip is mounted; and a sealing resin layer that covers at least the semiconductor chip. Each of the plurality of metal bumps is covered with the sealing resin layer described above, with a part thereof exposed at a top face of the sealing resin layer.

Disclosed is an LCD device for performing bi-directional display. The LCD device includes first and second display units, and a light supplying unit. The first display unit includes an LCD panel and a transflective film that is disposed under the LCD panel and has layers in which first and second layers having different refractivity indexes are alternately stacked. The transflective film partially reflects and transmits light incident onto the film. The light supplying unit is disposed between the first and second display units, and provide the first and second display units with light generated from a lamp by dividing the light, to thereby regulate a contrast ratio of a luminance between the first and second display units. Therefore, the structure of an LCD panel for performing bi-directional image display can be simplified, and the light loss in the transmission mode can be reduced.

With a recent shrinking semiconductor process, insulating layers formed between interconnect layers are becoming thin. To avoid parasitic capacitance between them, materials of a low dielectric constant have been used for an insulating layer in a multilevel interconnect. Low-k materials, however, have low strength compared with the conventional insulating layers. Porous low-k materials are structurally fragile. The invention therefore provides a manufacturing method of a semiconductor device having a multilevel interconnect layer including a low-k layer. According to the method, in a two-step cutting system dicing in which after formation of a groove in a semiconductor water with a tapered blade, the groove is divided with a straight blade thinner than the groove width, the multilevel interconnect layer portion is cut while being covered with a tapered face and then the wafer is separated with a thin blade which is not brought into contact with the multilevel interconnect layer portion. The wafer can be diced without damaging a relatively fragile low-k layer.

This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

The reliability of a semiconductor device is improved. A sealing resin (sealed body) is formed between a sub-substrate (first base member) and a base substrate (second base member) that are provided individually and distinctly to be integrated therewith, and then, the sub-substrate is electrically coupled to the second base member. As a means for electrically coupling the sub-substrate to the base substrate, lands (first lands) formed on the sub-substrate and lands (second lands) formed on the base substrate are disposed such that the respective positions thereof are aligned. After through holes are formed from the lands of the sub-substrate toward the lands of the base substrate, a solder member (conductive member) is formed in each of the through holes.

A refrigerant compressor includes: an electric motor including a stator and rotor inside a sealed vessel; a compressing mechanism driven by a crank shaft in the rotor; a lower portion oil pool storing in the sealed vessel lubricating oil that lubricates the compressing mechanism; an upper counterweight on an upper end of the rotor. Refrigerant gas compressed by the compressing mechanism is discharged inside the sealed vessel, passes through a gas channel formed on the electric motor, moves from a lower space to an upper space with respect to the electric motor, and is discharged outside the sealed vessel. An oil return flow channel is formed on the upper end of the rotor toward a lower end from a vicinity of a leading end portion of the upper counterweight in a direction of rotation, and oil expressed in a vicinity of the rotor is directed to the oil return flow channel.

A discharge lamp lighting apparatus includes a switch circuit for DC / AC converting, a discharge lamp connected to a secondary winding of a transformer, a current detector detecting an AC output current of the discharge lamp, an error amplifier outputting an error signal to a detected current, a control circuit generating control signals that turn on / off the switching elements in such a way as to control the AC output current at a predetermined value, and a time division signal generator generating a time division signal at the start of an ON / OFF operation of the switching elements, wherein the time division signal delays a change in a burst dimming signal or has a predetermined inclination on the burst dimming signal. The error amplifier changes the error signal according to the time division signal from the time division signal generator.

The present invention relates to a camera module, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a housing configured to protect the image sensor and mounted therein with camera constituent parts, and plural pieces of lenses mounted on the housing, wherein a surface of the housing is metalized.

The present invention provides a semiconductor laser realizing reduced possibility that a wiring layer disposed in the air is broken even under severe environment of a large temperature difference. A trench is provided between adjacent ridges, and a wiring layer electrically connecting an upper electrode and a pad electrode is disposed in the air at least above the trench. The wiring layer in a portion above the trench has a flat shape or a concave shape which dents toward the trench. With the configuration, accumulation of strains in the wiring layer when the wiring layer repeats expansion and shrink under severe environment of a large temperature difference is suppressed.

A gas turbine system comprises a compressor for compressing air, a combustor for burning the air compressed by the compressor and fuel, a turbine driven by combustion gases produced from the combustor, and a spraying apparatus for adding water to working air at least upstream or in an intermediate stage of the compressor. A rotationally symmetric groove or projection is formed in an inner wall surface defining a channel through which the working air added with the water flows, or in a channel-defining surface of a rotor or a casing of the gas turbine. A larger amount of water can be supplied to the compressor while improving the reliability of the gas turbine.

A semiconductor device has an, improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side of the leads are fixed to a back surface of a semiconductor chip, and portions of the leads positioned outside the semiconductor chip are connected with electrodes formed on the semiconductor chip through wires.