Silver coated nickel powder conductive adhesive and preparation method thereof

Abstract

The invention relates to a silver coated nickel powder conductive adhesive. The silver coated nickel powder conductive adhesive comprises, by mass, 40-90% of a conductive filler, 5-45% of a resin, 0.5-20% of a curing agent, 0-50% of a solvent and 0.1-20.0% of an assistant, and the conductive filler comprises at least one of micro-silver coated nickel powder and nano-silver coated nickel powder. The silver coated nickel powder conductive adhesive has the advantages of excellent conductivity, low cost, no lead, no halogens and the like. The invention also discloses a preparation method of the silver coated nickel powder conductive adhesive. The method is characterized in that the curing agent is added in a dispersion process after grinding, so the conductivity, the cementability, the viscosity and the like can be effectively regulated, and the untoward influences of the interaction of all components of the conductive adhesive in the dispersion and grinding processes to the storage, application and stability of the conductive adhesive are avoided.

Description

[0001] The invention relates to a conductive adhesive and a preparation method thereof, in particular to a silver-coated nickel powder conductive adhesive and a preparation method thereof, belonging to the technical field of conductive adhesives. Background technique [0002] With the development of electronic technology, semiconductor industry and other fields and the enhancement of environmental awareness, traditional lead-containing electronic assembly materials can no longer meet the needs of electronic devices and chip connections. In recent years, as solders containing tin and lead have been banned in Europe and other regions, emerging green technologies such as lead-free solders have emerged. The reflow soldering process of lead-tin solder paste and lead-free solder generally requires a soldering temperature of 220 ℃ to 240 ℃, and the high temperature and the resulting thermal stress will also damage the device and the substrate. As a new lead-free and green electronic ...

AI Technical Summary

Problems solved by technology

[0009] In terms of preparation process, the conventional conductive adhesive preparation process usually mixes conductive materials, resins, curing agents, solvents and other materials and then disperses or grinds them. The production efficiency is low, and it is difficult to effectively control parameters such as conductivity, adhesion, and viscosity; At the same time, since grinding and dispersion are often accompanied by an exothermic process, it is easy to cause the interaction between the components of the conductive adhesive, especially the curing of the resin, which is extremely unfavorable to the storage, application and stability of the conductive adhesive.

Images