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55 results about "Flip chip interconnect" patented technology

Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine

The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capillary a predetermined height after forming the ball bond with the wire paying out of the capillary tip, (3) moving the capillary laterally a predetermined distance, preferably in a direction toward the site of other end of the wire loop, if the bump is to be used as the platform for a stitch bond of a wire loop, (4) raising the capillary further, and (5) moving the capillary diagonally downwardly and in the opposite direction of the first lateral motion. The wire is then severed by raising the capillary, closing the clamps and raising the capillary again to snap the wire pigtail off at the bump.
Owner:KULICKE & SOFFA IND INC

Copper Post Solder Bumps on Substrate

A method comprises forming semiconductor flip chip interconnects where the flip chip comprises a wafer and a substrate having electrical connecting pads and electrically conductive posts operatively associated with the pads and extending away from the pads to terminate in distal ends. Solder bumping the distal ends by injection molding solder onto the distal ends produces a solder bumped substrate. Another embodiment comprises providing the substrate having the posts on the pads with a mask having a plurality of through hole reservoirs and aligning the reservoirs in the mask to be substantially concentric with the distal ends. This is followed by injecting liquid solder into the reservoirs to provide a volume of liquid solder on the distal ends, cooling the liquid solder in the reservoirs to solidify the solder, removing the mask to expose the solidified solder after the cooling and thereby provide a solder bumped substrate. This is followed by positioning the solder bumped substrate on a wafer in a manner that leaves a gap between the wafer and the substrate. The wafer has electrically conductive sites on the surface for soldering to the posts. Abutting the sites and the solder bumped posts followed by heating the solder to its liquidus temperature joins the wafer and substrate, after which, the gap is optionally filled with a material comprising an underfill.
Owner:IBM CORP
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