54results about How to "Relieve mechanical stress" patented technology

A system, method and device for integrally installing electrical components, electronic components and devices in a pneumatic tire, including a specially structured mounting connection plate for mounting at least one electronic device supported by a substrate. The mounting web is preferably adapted to be positioned on the inner liner of a pneumatic tire and is configured to isolate any mounted electronic devices from tire related phenomena including mechanical stress, vibration, heat and other The reaction produced by the rotational motion of the tire. An embodiment of a mounting board includes a circular or rectangular platform for supporting various electronic components, and circular, rectangular or cross-shaped posts for connecting the base of the mounting board to the platform supporting the electronic device. Selected electronic devices may be encapsulated by an encapsulating material to facilitate operative connection of the electronic device to the tire web.

Embodiments of the invention relate to making reconnection when a soldered connection fails in a head / slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head / slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.

The invention provides a circuit board flatting device, which includes a bearing tool and a pressing component. The bearing tool is provided with a first bearing plane, and the first bearing plane is concave; the pressing component is provided with a pressing plane, and the pressing plane and the first bearing plane are convexity. The technical proposal also provides a method of utilizing the circuit board flatting device to flat the circuit board. The circuit board flatting device and the method of flatting circuit board in the technical proposal can effectively flat circuit boards with certain warping.

Methods and structures for relieving stresses in stressed semiconductor liners. A stress liner that enhances performance of either an NFET or a PFET is deposited over a semiconductor to cover the NFET and PFET. A disposable layer is deposited to entirely cover the stress liner, NFET and PFET. This disposable layer is selectively recessed to expose only the single stress liner over a gate of the NFET or PFET that is not enhanced by such stress liner, and then this exposed liner is removed to expose a top of such gate. Remaining portions of the disposable layer are removed, thereby enhancing performance of either the NFET or PFET, while avoiding degradation of the NFET or PFET not enhanced by the stress liner. The single stress liner is a tensile stress liner for enhancing performance of the NFET, or it is a compressive stress liner for enhancing performance of the PFET.

The invention provides a circuit board flatting device, which includes a bearing tool and a pressing component. The bearing tool is provided with a first bearing plane, and the first bearing plane is concave; the pressing component is provided with a pressing plane, and the pressing plane and the first bearing plane are convexity. The technical proposal also provides a method of utilizing the circuit board flatting device to flat the circuit board. The circuit board flatting device and the method of flatting circuit board in the technical proposal can effectively flat circuit boards with certain warping.

A manufacturing method for soft-magnetic Fe-Si-Al-Ni alloy powder comprises smelting alloy formed by 4.0% to 5.0% of Si, 3.0% to 4.0% of Al, 1.0% to 2.5% of Ni, 0.1% to 0.4% of Ti, 0.1% to 0.4% of Mn, 0.1% to 0.5% of P, 0.02% or less of C, and the balance Fe through an induction heating vacuum rapid solidification furnace, performing rapid solidification on the alloy to manufacture sheet materials, and subjecting the sheet materials to mechanical crushing, thermal processing of crushed materials, ball milling of the materials into fine powder, annealing treatment and screening and particle size distribution. The method has the advantages that the smelting alloy material is pure, the alloy saturation induction density Bs is more than 18000 gausses, and the adding of Ni can guarantee that the alloy magnetostriction coefficient is zero; excellent soft magnetic properties are provided during magnetic powder core manufacturing, and the AC / DC superposition performance is good particularly when the magnetic conductivity of pressed products is mu e60, for example, when AC is 100 KHz, DCH is equal to 50 Oe, mu 50 >=88% mu O, and the magnetic core loss is lower than that of the high-flux Fe50 Ni50 magnetic powder core, so that the soft-magnetic Fe-Si-Al-Ni alloy powder can replace Fe50 Ni50 and Fe-Si alloy magnetic powder cores to be used in electronic and electric industries.

A transition duct system for routing a gas flow in a combustion turbine engine is provided. The transition duct system includes one or more converging flow joint inserts forming a trailing edge at an intersection between adjacent transition ducts. The converging flow joint insert may be contained within a converging flow joint insert receiver and may be disconnected from the transition duct bodies by which the converging flow joint insert is positioned. Being disconnected eliminates stress formation within the converging flow joint insert, thereby enhancing the life of the insert. The converging flow joint insert may be removable such that the insert can be replaced once worn beyond design limits.