The invention relates to a
copper alloy material used for
lead frame and the preparation method, belonging to the
copper alloy material field; wherein
nickel accounts for 0.9 to 3.5% (weight percentage),
silicon accounts for 0.18 to 0.8%,
phosphorus accounts for 0.02 to 0.1% and the rest is
copper. The preparation method is that all the components according to the weight ratio are mixed and melted, after
casting, hot
forging,
solid solution, multiple cold rolling, deformation and aging, the product is got. The
copper alloy material used for
lead frame has the advantages of tensile strength of 600 to 850MPa,
conductivity of 45 to 65%IACS, elongation of 5 to 8% and
softening temperature of 500 to 550 centigrade; thereby the requirements on the
copper alloy material performance of the
lead frame in electronic industrial field is well achieved; the
copper alloy material can also be used in the copper
alloy material field needing high strength and high conductive, such as contact lines in trolleys and electric locomotives, rotor bars of the high-speed
turbine generator and inner liners of the large thrust
rocket engines.