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Real-time deviation correcting method for precise cutting process of diamond wire saw

A diamond wire saw and precision cutting technology, used in stone processing tools, stone processing equipment, fine working devices, etc., can solve problems such as deviation, and achieve the effect of fast deviation correction

Inactive Publication Date: 2010-09-01
DALIAN UNIV OF TECH
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  • Abstract
  • Description
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Problems solved by technology

[0006] The technical problem to be solved by the present invention is real-time deviation correction during the precision cutting process of diamond wire saw, especially a method proposed for the problem that deviation easily occurs during the precision cutting process of diamond wire saw for large-sized materials

Method used

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  • Real-time deviation correcting method for precise cutting process of diamond wire saw
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  • Real-time deviation correcting method for precise cutting process of diamond wire saw

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Embodiment Construction

[0032] The specific embodiments of the present invention will be described in detail below in conjunction with the technical solutions and accompanying drawings, and the specific implementation steps are as follows.

[0033] Step 1. First complete the workpiece clamping, wire saw tool setting, place two CCD photoelectric sensors on the upper and lower parts of the workpiece, and make them as close as possible to the workpiece, so that the wire saw just passes through the center of the CCD. At this time, the computer control system will The position of the straight wire saw that is not in contact with the workpiece is recorded by the CCD photoelectric sensor, which is used to characterize the initial cutting surface position of the workpiece.

[0034] Step 2. Start cutting, and the CCD starts to detect the deviation of the wire saw in real time.

[0035] Step 3. Deviation correction strategy. When one of the CCDs detects the deviation of the wire saw, it will judge whether the...

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Abstract

The invention discloses a real-time deviation correcting method for a precise cutting process of a diamond wire saw, which belongs to the technical field of precise cutting and machining of large-size artificial crystal. The method is characterized by comprising the following steps of: detecting the position offset of the diamond wire saw in real time by using a photoelectric position detecting element, and feeding back the position offset to a computer control system to control a workbench to perform corresponding position and angle adjustment so that the wire saw moves towards the direction of reducing the cutting deviation and the cutting deviation correction is realized. The method has the advantages that abrasion brought to contact detection and deviation correction of the wire saw can be avoided by adopting non-contact wire saw position detection and wire saw deviation correcting motion; and in addition, compared with a method for reducing cutting deviation by improving the precision of a machine tool, a deviation feedback-based deviation correcting strategy adopted by the invention has the advantage that: good deviation correcting effect can be achieved for wire saw precision cutting of a large-scale workpiece on the premise of not remarkably improving the manufacturing cost of a wire saw cutting system. Theoretically, the method can obtain highest deviation correcting precision of 17 microns.

Description

technical field [0001] The invention belongs to the technical field of precision cutting and processing of large-sized artificial crystals, and relates to a real-time deviation correction method during the precision cutting process of a diamond wire saw. Background technique [0002] With the development of high-tech fields such as optoelectronics and strong lasers, higher processing accuracy and quality requirements are put forward for the cutting of large-scale hard and brittle materials. The diamond wire saw uses the consolidated diamond abrasive electroplated on the steel wire matrix to cut the material, which has the advantages of high cutting quality, small kerf, and can cut large-sized workpieces. Its cutting range not only includes ordinary hard and brittle materials such as stone and glass, but also can be used for precious materials such as gemstones, silicon wafers, and functional crystals. With the upcoming operation of the National Ignition Facility (NIF) in th...

Claims

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Application Information

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IPC IPC(8): B28D1/32B28D1/12B28D5/04
Inventor 高航王强国郭东明滕晓辑
Owner DALIAN UNIV OF TECH
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