High capacity multilayer ceramic dielectric capacitor composed of chips and provided with leads

Abstract

The invention provides a high capacity multilayer ceramic dielectric capacitor composed of multiple chips and provided with leads. The high capacity multilayer ceramic dielectric capacitor relates to the electronic circuit technology field, and comprises leads, a substrate, ceramic dielectric capacitor chips, a metalized through hole and two copper foils. The metalized through hole is disposed in the substrate, and the copper foils are disposed on the substrate. The ceramic dielectric capacitor chip comprises a plurality of chips, and the two copper foils are parallelly disposed on the substrate in a coated manner. The ceramic dielectric capacitor chips are vertically disposed on the substrate at equal interval. The capacitor chips disposed on two sides of the substrate are connected together through the metalized through hole. A segment of each of the leads is bent vertically to be hooked with the metalized through hole of the substrate, and the lower part of each of the leads below the bent segment is directly disposed on the corresponding copper foil in a welded manner. The ceramic dielectric capacitor chips, the leads and the substrate are sleeved with the housing, the heat conductive silica gel can be poured in the housing in a sealed manner, and at last a housing cover can be used to seal the potting materials. The high capacity multilayer ceramic dielectric capacitor provided by the invention has advantages of strong anti-mechanical stress performance and strong thermal stress performance.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular to a leaded large-capacity multilayer ceramic capacitor composed of a plurality of chips. Background technique [0002] Multilayer ceramic capacitors are widely used in various fields due to their small size, low loss, and high reliability. They are good substitutes for electrolytic capacitors such as aluminum electrolysis and tantalum electrolysis. However, due to the limitation of the manufacturing process level, it is difficult to enlarge the product size, resulting in the capacitance of a single product having no advantage over electrolytic capacitors. [0003] In order to increase the capacitance of multilayer ceramic capacitors, at present, it is more common to stack multiple ceramic capacitor chips horizontally or vertically, solder various leads, and use no encapsulation or mold encapsulation. Such as CN201984955U, CN102592823A, CN202695133U, CN201984956U, CN202...

AI Technical Summary

Problems solved by technology

The problem with this is that multiple chips are in contact with each other, resulting in stress that is easily generated during the process of soldering the leads, and will eventually affect the installation and use of the product

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