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Black photosensitive resin composition and application of black photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in the field of materials and can solve the problems that the cover film technology cannot meet the requirements of the market.

Inactive Publication Date: 2015-04-22
SHANGHAI FUSAITE NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In short, with the rapid development of circuit boards, the traditional cover film technology can no longer meet the requirements of the market

Method used

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  • Black photosensitive resin composition and application of black photosensitive resin composition
  • Black photosensitive resin composition and application of black photosensitive resin composition
  • Black photosensitive resin composition and application of black photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0071] Synthesis example 1: Synthesis of acid-modified epoxy resin-(meth)acrylic resin

[0072] In a four-necked flask equipped with a stirrer, a reflux condenser, and a nitrogen tube, feed nitrogen, and add 207.1 grams of epoxy resin (YDCN-704, the epoxy equivalent of which is 207.1) (to Japan Toto Chemical), diethylene di 186 grams of alcohol ethyl ether acetate, 73 grams of acrylic acid, 0.8 grams of triphenylphosphine, and 0.03 grams of 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl radical, stirred into a homogeneous solution Afterwards, gradually heated to 120 degrees, after 12 hours, added 66 grams of tetrahydrophthalic anhydride in the reactor, then adjusted the reaction temperature to 100 degrees, stirred for 5 hours, and obtained an acid-modified epoxy resin with a solid content of 65wt%. - Acrylic resin, called black photoresist 1

Synthetic example 2

[0073] Synthesis Example 2: Synthesis of Polyurethane Resin

[0074] In a four-necked flask equipped with a stirrer, a reflux condenser, and a nitrogen tube, feed nitrogen, add 25.00 grams (0.1 moles) of xylylmethane 4,4-diisocyanate, and 15 grams of γ-butyrolactone, and stir After uniformity, heat to 90 degrees, then drop into this solution polycarbonate diol (the product of Asahi Kasei Co., Ltd., PCDL T5651) 30 grams (0.03 mole), dimethylolpropionic acid 4.02 grams (0.03 mole) and two Ethylene glycol ethyl ether acetate 25 grams, this solution is heated, and after stirring at 95 degree for 5 hours again, obtains uniform transparent viscous macromolecular liquid. Then add 6.08 grams of glycolic acid (0.08 moles) and 6 grams of diethylene glycol ether acetate in this solution, continue to heat at 90 degrees, stir for 5 hours, so as to obtain the polyurethane oligomer that the end is a hydroxy acid, solid The content is about 55wt%, and this polyurethane compound is called bla...

Synthetic example 3

[0075] Synthesis Example 3: Synthesis of Polyurethane Resin

[0076] In a four-necked flask equipped with a stirrer, a reflux condenser, and a nitrogen tube, feed nitrogen, add 25.00 grams (0.1 moles) of xylylmethane 4,4-diisocyanate, and 15 grams of γ-butyrolactone, and stir After uniformity, heat to 90 degrees, then drop into this solution polycarbonate diol (the product of Asahi Kasei Co., Ltd., PCDL T5651) 30 grams (0.03 mole), dimethylolpropionic acid 4.02 grams (0.03 mole) and two Ethylene glycol ethyl ether acetate 25 grams, this solution is heated, and after 5 hours of stirring at 95 degree of degree again, obtain uniform transparent viscous macromolecule liquid. Then add 3.04 grams of glycolic acid (0.04 moles) and 4.65 grams of hydroxyethyl acrylate (0.04 moles) and 7 grams of solvent diethylene glycol ethyl ether acetate in this solution, continue to heat at 90 degrees, stir for 5 hours, thereby The obtained polyurethane oligomer whose terminal is hydroxy acid and ...

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PUM

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Abstract

The invention discloses a black photosensitive resin composition and a cured envelope, a dry film and a circuit board which are prepared by using the composition. The black photosensitive resin composition comprises (A) a pigment, (B) a polymer soluble in an alkaline aqueous solution, (C) a photopolymerization initiator, (D) photo-curable resin, (E) heat-cured resin, (F) a flame retardant and (G) inorganic filler. The black photosensitive resin composition disclosed by the invention is rich in flexibility, and excellent in electrical insulation property, solder heat resistance and acid-base resistance property.

Description

technical field [0001] The invention relates to the field of materials, in particular, relates to the use of black photosensitive resin composition, insulating material and circuit board obtained by using the black photosensitive resin composition in the manufacture of circuit boards. Background technique [0002] In recent years, with the rapid development and progress of semiconductor components, there is a tendency for electronic equipment to be smaller, lighter, more functional, and more multifunctional. In line with these trends, the density of printed circuit boards has continued to increase. A high-density printed circuit board is a structural component formed of insulating materials supplemented by conductor wiring. When the final product is made, integrated circuits, transistors, diodes, passive components (such as resistors, capacitors, connectors, etc.) and various other electronic components will be installed on it. Through the connection of wires, electronic si...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/00
Inventor 金行洲孙暐刘驰洲
Owner SHANGHAI FUSAITE NEW MATERIAL TECH
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