The invention relates to an organic
silicon conductive
adhesive which comprises a resin composition, an
organic solvent and argent
powder, wherein the resin composition comprises: (1) 40 to 65weight percent of ethenyl end capped
polydimethylsiloxane; (2) 8 to 10 weight percent of trimethyl silicyl end capped poly(
dimethyl siloxane-co-dimethyl
silicone); (3) 10 to 30 weight percent of polysiloxane
silicone oil with
hydrogen-
silicon bonds and / or ethenyl; (4) 0.1 to 2 weight percent of a
polymerization inhibitor; and (5) 0.01 to 0.2 weight percent of a
platinum complex catalyst; the weight ratio of the resin composition to the argent
powder is 10-40 to 90-60; and the use amount of the
organic solvent is 5 to 10 percent of the weight of the resin composition. The preparation process of the organic
silicon conductive
adhesive is as follows: the resin composition is stirred for 20 to 30 minutes, is added with the argent
powder, is stirred for 10 to 20 minutes, is transferred to a three-roller
machine, and is continuously rolled and mixed for three times to prepare the organic silicon conductive
adhesive. The storage life of the organic silicon conductive adhesive is half a year at the temperature of 5 DEG C below zero . The organic silicon conductive adhesive is subjected to
thermal curing for 1 to 2 hours at the temperatures of 160 DEG C, 180 DEG C and 240 DEG C respectively. As a result, a product has the following performances: flake thrust force is between 1.5 and 3.0 kgf; volume resistivity is less than or equal to 6X10< -4 >
Omega.cm; and pencil
hardness is less than 6 B.