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Photocurable composition for the formation of pressure-sensitive adhesive layer and dicing tape produced using the same

A technology of pressure-sensitive adhesives and cutting tapes, applied in the direction of adhesives, adhesive types, ester copolymer adhesives, etc., can solve the problems of outdated and improved absolute peel strength

Inactive Publication Date: 2009-03-04
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, however, the absolute peel strength was untimely increased by

Method used

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  • Photocurable composition for the formation of pressure-sensitive adhesive layer and dicing tape produced using the same
  • Photocurable composition for the formation of pressure-sensitive adhesive layer and dicing tape produced using the same
  • Photocurable composition for the formation of pressure-sensitive adhesive layer and dicing tape produced using the same

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Effect test

preparation example 1

[0077] Preparation Example 1: Preparation of Pressure Sensitive Adhesive (PSA) Adhesive

[0078] 6.00 kg of methyl ethyl ketone and 0.60 kg of toluene were used as organic solvents and put into a 20 L four-necked flask equipped with a reflux condenser, a thermometer and a dropping funnel. The temperature of the flask was raised to 60°C. Then, 3.40 kg of 2-ethylhexyl acrylate, 0.20 kg of ethyl acrylate, 0.30 kg of vinyl acetate, 0.48 kg of 2-hydroxyethyl methacrylate, 0.43 kg of acrylic acid and 0.04 kg of peroxide Benzoyl was mixed together and added dropwise to the flask at 60-70°C through the dropping funnel over 3 hours while stirring at 250 rpm. After the addition was complete, the reaction mixture was aged for 4 hours under the same conditions, and then 0.20 kg of ethyl acetate and 0.01 kg of azobisisobutyronitrile were added thereto. The resulting mixture was left for 4 hours and the viscosity and solids content were measured. The reaction was stopped to obtain an acr...

Embodiment 1

[0080] 100 g of PSA adhesive (A), 1 g of reactive acrylate (X-22-164B, Shin-Etsu Chemical Co., Ltd.) with a weight average molecular weight of 1,630 g / mol, 1 g of isocyanate curing agent (L -45, Nippon Polyurethane Industry Co., Ltd.) and 0.5 g of photoinitiator (IC-184, Ciba-Geigy) were mixed together to prepare a UV-curable pressure-sensitive adhesive (PSA) composition. This photocurable composition was coated on one surface of a 100 μm thick polyolefin film, and dried to prepare a 10 μm thick dicing tape (a).

Embodiment 2

[0082] 100 g of PSA adhesive (A), 1 g of reactive acrylate (X-22-164C, Shin-Etsu Chemical Co., Ltd.) with a weight average molecular weight of 2,730 g / mol, 1 g of isocyanate curing agent (L -45, Nippon Polyurethane Industry Co., Ltd.) and 0.5 g of photoinitiator (IC-184, Ciba-Geigy) were mixed together to prepare a UV-curable PSA composition. The photocurable composition was coated on one surface of a 100 μm thick polyolefin film and dried to prepare a 10 μm thick dicing tape (b).

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Abstract

The present invention discloses a photocurable composition used for forming pressure sensitive adhesive layer. The photocurable composition comprises pressure sensitive adhesive binder, reactive acrylate, thermal curing agent and phtoinitiator. The pressure sensitive adhesive binder is composed of pressure sensitive adhesive polymer resin and low molecular weight acrylate which comprises carbon-carbon double bond and is led into side chain of pressure sensitive adhesive resin. The reactive acrylate comprises dimethyl cyclosiloxane unit in molecular chain. The invention also discloses a cutting rubber belt which comprises a pressure sensitive adhesive layer formed by the photocurable composition. When a thin wafer is installed on cutting rubber belt, cut and radiated by UV, no connection occurs. Therefore the maximum peeling strength between the pressure sensitive adhesive layer and thin wafer is quite low, and the collecting capability of thin wafer is excellent.

Description

[0001] Cross References to Related Applications [0002] This non-provisional application claims priority under U.S.C. §119 to Korean Patent Application No. 10-2007-0088323, filed Aug. 31, 2007, the entire contents of which are hereby incorporated by reference in their entirety. technical field [0003] The disclosure relates to a photocurable composition for forming a pressure sensitive adhesive layer ('PSA layer') and a dicing tape prepared using the photocurable composition. More specifically, the photocurable composition comprises a pressure sensitive adhesive ('PSA adhesive'), a reactive acrylate, a thermal curing agent and a photoinitiator. The PSA adhesive contains a pressure sensitive adhesive polymer resin ('PSA polymer resin' or simply 'PSA resin') and a low molecular weight acrylate having a carbon-carbon double bond and incorporated into the side chain of the PSA resin. The reactive acrylate contains dimethylsiloxane units in the molecular chain. The dicing tape ...

Claims

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Application Information

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IPC IPC(8): C09J133/00C09J7/02
CPCC09J133/14Y10T428/1471C09J7/29C09J7/30C09J11/06C09J2203/326C09J2301/312
Inventor 黄龙河丁畅范宋圭锡朴白晟崔承执河京珍
Owner CHEIL IND INC
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