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Cutting adhesive tape for wafer processing and preparation method thereof

A technology for cutting tapes and wafers, which is applied in adhesives, semiconductor/solid-state device manufacturing, electrical components, etc. It can solve the problems of easy peeling, low initial adhesion and peel strength, and easy peeling of pressure-sensitive agents to achieve peel strength. The effect of low and excellent pickup performance

Pending Publication Date: 2019-09-13
广东硕成科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the actual application process, in order to improve the pick-up performance of the processed device, the initial adhesion and peel strength will be low, and it will easily fall off; Cause pollution; at the same time, achieve a certain viscosity between the adherend and the pressure-sensitive agent, so that the adherend will not loosen or fall off, causing the object to crack and splash

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Embodiment 1 of the present invention provides a dicing tape for wafer processing, including a substrate layer and an adhesive layer;

[0043] The raw materials for the preparation of the adhesive layer include 95 parts of olefinic acid, 5 parts of crosslinking agent and 50 parts of polyurethane;

[0044] The raw materials for the preparation of the adhesive layer also include a photopolymerization initiator, and the ratio of the photopolymerization initiator to the olefinic acid substance is 0.045:1;

[0045] Alkenoic acids include methacrylic acid, 3-hydroxyoct-7-enoic acid and 5-(3,4-dihydroxyphenyl)-2,4-pentadienoic acid, methacrylic acid, 3-hydroxyoct-7- The weight ratio of 7-enoic acid and 5-(3,4-dihydroxyphenyl)-2,4-pentadienoic acid is 5:2.5:1;

[0046] The crosslinking agent is 1,3-phenylene diisocyanate;

[0047] The raw materials for the preparation of polyurethane include polyisocyanate, catalyst, and small molecule polyol, and the weight ratio of polyisoc...

Embodiment 2

[0057] Embodiment 2 of the present invention provides a dicing tape for wafer processing, including a substrate layer and an adhesive layer;

[0058] The raw materials for the preparation of the adhesive layer include 100 parts of alkene, 10 parts of crosslinking agent and 65 parts of polyurethane;

[0059] The raw materials for the preparation of the adhesive layer also include a photopolymerization initiator, and the ratio of the photopolymerization initiator to the olefinic acid is 0.1:1;

[0060] Alkenoic acids include methacrylic acid, 3-hydroxyoct-7-enoic acid and 5-(3,4-dihydroxyphenyl)-2,4-pentadienoic acid, methacrylic acid, 3-hydroxyoct-7- The weight ratio of 7-enoic acid and 5-(3,4-dihydroxyphenyl)-2,4-pentadienoic acid is 6.5:3.5:1;

[0061] The crosslinking agent is 1,3-phenylene diisocyanate;

[0062] The raw materials for the preparation of polyurethane include polyisocyanate, catalyst, and small molecule polyol, and the weight ratio of polyisocyanate, catalys...

Embodiment 3

[0072] Embodiment 3 of the present invention provides a dicing tape for wafer processing, including a substrate layer and an adhesive layer;

[0073] The raw materials for the preparation of the adhesive layer include 80 parts of alkene, 0.1 part of a crosslinking agent and 35 parts of polyurethane;

[0074] The raw materials for the preparation of the adhesive layer also include a photopolymerization initiator, and the ratio of the photopolymerization initiator to the olefinic acid is 0.01:1;

[0075] Alkenoic acids include methacrylic acid, 3-hydroxyoct-7-enoic acid and 5-(3,4-dihydroxyphenyl)-2,4-pentadienoic acid, methacrylic acid, 3-hydroxyoct-7- The weight ratio of 7-enoic acid and 5-(3,4-dihydroxyphenyl)-2,4-pentadienoic acid is 3.5:1.5:1;

[0076] The crosslinking agent is 1,3-phenylene diisocyanate;

[0077] The raw materials for the preparation of polyurethane include polyisocyanate, catalyst, and small molecule polyol, and the weight ratio of polyisocyanate, catal...

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Abstract

Relating to the field of adhesive tapes, the invention more specifically provides a cutting adhesive tape for wafer processing and a preparation method thereof. The invention on the first aspect provides a cutting adhesive tape for wafer processing, the cutting adhesive tape includes a substrate layer and an adhesive layer, wherein the raw materials for preparation of the adhesive layer include olefine acid substances, a cross-linking agent and polyurethane, and the olefine acid substances include methacrylic acid and 3-hydroxyoctyl-7-olefine acid.

Description

technical field [0001] The invention relates to the field of tapes, and more specifically, the invention provides a dicing tape for wafer processing and a preparation method thereof. Background technique [0002] Recently, thinning and miniaturization of semiconductor devices and their packages have been increasingly demanded. Therefore, as the semiconductor device and its package, a flip chip type semiconductor device in which a semiconductor element such as a semiconductor chip is mounted (flip chip connected) on a substrate by flip chip bonding has been widely utilized. In such flip-chip connection, a semiconductor chip is fixed to a substrate in such a manner that the circuit face of the semiconductor chip is opposed to the electrode-forming face of the substrate. In such semiconductor devices and the like, there may be cases where the back surface of the semiconductor chip is protected with a protective film to prevent the semiconductor chip from being damaged or the l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/38C09J4/02C09J4/06H01L21/683
CPCC09J4/06C09J2203/326C09J2427/006C09J2475/00C09J7/38C09J2301/122C09J2301/302H01L21/6836H01L2221/68327H01L2221/68386
Inventor 柯跃虎曾庆明诸葛锋宋亦健
Owner 广东硕成科技股份有限公司
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