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Flexible circuit conductive composition, preparation method and using method thereof

A flexible circuit and composition technology, applied in conductive pattern formation, conductive coatings, opto-mechanical equipment, etc., can solve the problems of inability to simplify the steps of nanoimprinting, inability to change the non-conductive properties of nanoimprinting compositions, etc. The effect of sintering time, reducing sintering temperature, and simple manufacturing process

Active Publication Date: 2011-10-12
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the addition of magnetic particles does not change the non-conductive properties of the nanoimprint composition
Therefore, the steps of nanoimprinting cannot be simplified.

Method used

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  • Flexible circuit conductive composition, preparation method and using method thereof
  • Flexible circuit conductive composition, preparation method and using method thereof
  • Flexible circuit conductive composition, preparation method and using method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] First, dissolve 8g of nano-silver powder (brand NSP-01, average particle size 50nm) in 12g of ethanol, stir evenly, and then disperse it by ultrasonic wave (brand AS5150B, frequency 55Hz) for 20 minutes, and in yellow light (filtering light with wavelength less than 420nm) Add 1.0g of polyester acrylic resin CN294E (4Pa·s, 60°C), 0.15g of isooctyl acrylate, 0.23g of dipropylene glycol diacrylate, and 0.12g of 3-ethoxytrimethylolpropane triacrylate under the conditions, Then add 0.3g of 2-hydroxy-2-methyl-1-phenylacetone, 0.1g of dibenzoyl peroxide, 0.04g of BYK 020, 0.04g of Glide 100, 10.02g of FIRSTCURE ST-10.02g, stir well and ultrasonically (brand AS5150B, frequency 55Hz) to a viscosity (20°C) of about 4Pa·s to prepare a flexible circuit conductive composition.

[0047] Print the conductive composition of the flexible circuit on the surface of the polyimide film by screen printing, expose it to a high-pressure mercury lamp (the main wavelength is 365nm) for 5min, an...

Embodiment 2

[0049] First, dissolve 7g of nano-gold powder (brand GNP01-5-100, average particle size 5nm) in 15g of acetone and disperse it by ultrasonic wave (brand AS5150B, frequency 55Hz) for 20 minutes until uniform, and then in yellow light (filtering light with wavelength less than 420nm) Under the conditions, 1.9g of polyester acrylic resin CN294E (4Pa s, 60°C), 0.15g of N-vinylpyrrolidone, 0.25g of neopentyl glycol diacrylate, 0.1g of trimethylolpropane triacrylate, α, 0.35g of α'-dimethylbenzil ketal, 0.1g of azobisisobutyronitrile, 0.05g of BYK 055, 0.05g of Glide 100, 0.05g of p-hydroxyanisole, and then ultrasonic (brand AS5150B, frequency 55Hz) to a viscosity (20°C) of about 4Pa·s to prepare a conductive composition for a flexible circuit.

[0050] The prepared flexible circuit conductive composition was printed on the surface of the polyimide film by screen printing technology, exposed to a high-pressure mercury lamp (main wavelength of 365nm) for 5min, and then placed on a te...

Embodiment 3

[0052] Preparation of nano-silver modified carbon nanotubes: first mix carbon nanotubes with ethylene glycol, ultrasonically mark it as sample 1 for 15 minutes, then mix sodium dodecylbenzenesulfonate (SDBS), polyvinylpyrrolidone (PVP) (weight ratio is SDBS / PVP / CNTs=2:2:1), silver nitrate (weight ratio is Ag:PVP:SDBS=1:1:1) is added in ethylene glycol and ultrasonically marked as sample 2 for 10 minutes, and Sample 2 is added to sample 1, ultrasonicated for 2-4 hours, filtered, and dried to obtain nano-silver modified carbon nanotubes.

[0053]5.0g nano-silver powder (brand NSP-01, average particle size 50nm), 0.5g nano-silver modified carbon nanotubes prepared by the above-mentioned method were dissolved in 12g acetone, and ultrasonic wave (brand AS5150B, frequency 55Hz) was dispersed to uniformity for 20 minutes. Add it into 2.4g of polyester acrylic resin CN294E (4Pa·s, 60°C) under the condition of yellow light (filter the light with a wavelength less than 420nm), stir well...

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Abstract

The invention relates to a flexible circuit conductive composition for a flexible printed circuit board (FPC), a preparation method and a using method thereof. The preparation method comprises the following steps of: adding photocurable resin and an optical activity monomer into a conductive nanometer material dispersion liquid and then preparing the composition by adopting a double-curing mode such as firstly photocuring and then thermal treatment. The photocuring leads the surface coating to be rapidly cured so as to achieve good mechanical property; and the thermal curing leads the coatingto be cured completely so as to reach the deep curing requirements. The thermal treatment leads nanometer metals to be sintered together so as to achieve good conductive performance. The prepared conductive system obtains a predesigned pattern in the specific area of a base material in a screen printing or nanometer impressing mode; the conductive pathway is obtained after the double curing and has the advantages of short curing time, low curing temperature, good electrical conductivity, high resolution ratio; and the prepared conductive film has the advantages of good adhesiveness, high hardness and good flexibility.

Description

Technical field: [0001] The invention relates to a flexible circuit conductive composition, a preparation method and a use method thereof. Background technique: [0002] Since the 1990s, the rapid development of electronic products led by the information industry has led to the vigorous development of the electronic product manufacturing industry integrating sound, light, image and network. As people's requirements for electronic products are getting higher and higher, electronic equipment products continue to develop in the direction of portability, multi-function, high reliability and low cost. The flexible printed circuit (FPC) has received unprecedented attention due to its unique portability and low cost. [0003] Currently, flexible printed circuits are usually made of copper-clad substrates. The main method is to attach the copper foil to an insulating flexible substrate through an adhesive, and then obtain a circuit pattern through a traditional etching method. It...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/10C09D175/14C09D167/06C09D171/00C09D4/02C09D4/06C09D7/12C09D5/24H05K3/10B41M1/12G03F7/00
Inventor 魏杰李嘉郭金保王慧慧
Owner BEIJING UNIV OF CHEM TECH
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