30 results about "Ionic copper" patented technology

The invention discloses a hydrogen peroxide disinfectant. Thehydrogen peroxide disinfectantis composed of the following components in percentage by weight: 0.3-0.6% of hydrogen peroxide, 0.01%-0.05% of zinc ions / copper ions, 0.05-0.50% of citric acid, 0.4-1.5% of a penetrating agent, 0.1-1.0% of a surfactant and 0.04-0.1% of a stabilizing agent, with the balance being purified water. The inventionalso discloses a preparation method of the hydrogen peroxide disinfectant. The hydrogen peroxide disinfectant disclosed by the invention can be used for rapidly killing mycobacteria, and has good stability, catalyst resistance and strong anti-interference capability.

The invention discloses a method for preparing an infiltrated copper-chromium contact material by spark plasma sintering. Step 1: Pour chromium powder into a graphite mold, restore the powder, and then place it in a plasma sintering furnace to evacuate and pressurize. Pass in a pulsed direct current and heat up to 1050-1380°C, keep warm for 2.5-5min, and then cool with the furnace; step 2, take the copper block and polish it, clean it with ultrasonic waves, dry it, scan it with laser light, and then conduct plasma treatment. Obtain the infiltrated copper block; step 3, put the chromium skeleton into the graphite boat, place the infiltrated copper block on the chromium skeleton, fill it with corundum powder around it, place it in a high-temperature sintering furnace with a protective gas atmosphere, and heat up to After 1150-1300°C, heat preservation for 40-60min to obtain a copper-chromium sintered body; step 4, vacuumize and hot-press the copper-chromium sintered body at a pressure of 50-100MPa and a temperature of 800-850°C, and then cool to At room temperature, the copper-chromium contact material is prepared. The production method of the invention has the advantage of shortening the production cycle.

A method of treating a wiring substrate according to an embodiment includes, in a semi-additive process:(1) contacting the wiring substrate with a pre-etching treatment liquid composition containing a chloride ion, the wiring substrate containing a seed layer formed of an electroless copper and a wiring pattern formed of an electrolytic copper; and(2) continuously, etching the wiring substrate with an etching liquid composition containing a hydrogen peroxide, a sulfuric acid, a tetrazole, a chloride ion, a copper ion and a water.

The invention discloses a site fast detection method for copper, zinc, lead and cadmium as heavy metals in seawater, and belongs to the technical field of environment monitoring. A conducting carbon black-ionic liquid paste electrode as a work electrode, Ag / AgCl as a reference electrode and platinum filament or glass carbon as a counter electrode are assembled to form an electrochemical sensor. The concentrations of ionic copper, zinc, lead and cadmium in seawater are respectively determined by adopting square wave anodic stripping voltammetry; and the site fast detection method has the advantages of high sensitivity, favorable repeatability, simple and convenient operation, low expense, quick response, accurate quantification, low requirement on the environment condition and the like, and can be used for site monitoring of offshore pollution and conventional ocean site investigation along with ships.

A method for electroplating a copper deposit onto a semiconductor integrated circuit device substrate having submicron-sized features, and a concentrate for forming a corresponding electroplating bath. A substrate is immersed into an electroplating bath formed from the concentrate including ionic copper and an effective amount of a defect reducing agent, and electroplating the copper deposit from the bath onto the substrate to fill the submicron-sized reliefs. The occurrence of protrusion defects from superfilling, surface roughness, and voiding due to uneven growth are reduced, and macro-scale planarity across the wafer is improved.

The application discloses a fluorophosphate glass, the composition of which includes phosphorus ions, aluminum ions, zirconium ions, copper ions, alkali metal ions, alkaline earth metal ions and divalent metal ions, wherein the weight percentage of phosphorus ions is 18%-25% %, the weight percent of aluminum ion is 11%~21%, the weight percent of zirconium ion is 0.5%~7%, the weight percent of copper ion is 0.1%~10%, the weight percent of alkali metal ion is 6%~18% , the weight percent of alkaline earth metal ions is 27~58%, the weight percent of divalent metal ions is 27~58%, the hardness of the fluorophosphate glass of the present application is greater than 400HK, and its thermal expansion coefficient is less than or equal to 14*10 ‑6 k ‑1 , so that the fluorophosphate glass has high hardness and good thermal expansion coefficient, so the fluorophosphate glass of the present application will not be easily broken during thinning, and its thickness can reach less than or equal to 0.1 mm.

The invention discloses a solid phase extraction column for trace determination on heavy metal in a marine food product and a preparation method of the solid phase extraction column. An adsorbent of the solid phase extraction column is tin hydrogen phosphate. Screened by a lot of experiments, tin hydrogen phosphate is preferably a solid phase extraction adsorption medium for heavy metal ion enrichment and trace determination, the cost is lower, the adsorption capacity is great, an enrichment factor is high, enrichment performance is stable, multiple types of heavy metal ions (including lead ion, copper ion, arsenic, zinc and the like) can be enriched at the same time, the detection sensitivity and accuracy of the heavy metal ions in the marine food product can be improved, and tin hydrogenphosphate is insoluble in water and organic solvents, is resistant to strong acid and certain alkalinity, is high in chemical stability, can be reused, and has important social and economic effects.

The invention relates to a monomer copper (I) complex material used for blue or / and green light emission. Structure general formula of the monomer copper (I) complex material is represented by a formula in the invention, wherein one symbol is used for representing an amidine derivative ligand, and another symbol is used for representing two independent aromatic phosphine ligands or bridge-linked aromatic phosphonic bidentate ligands. The monomer copper (I) complex material is a neutral copper (I) complex. Compared with ionic complexes, the neutral copper (I) complex possesses excellent stability in vacuum evaporation because that no counter ion exists, so that application prospect is promising. The monomer copper (I) complex material possesses excellent stability because that no other ligating atom exists, and conversion into ionic copper (I) complex caused by reaction with surrounding environment is not easily caused; the complex luminous zone is mainly distributed in the blue light region, the green light region, or the blue-green light region. The monomer copper (I) complex material can be used for organic electroluminescence devices and sensors.