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1165 results about "Dimethylamines" patented technology

Derivatives of dimethylamine (the structural formula CH3NHCH3).

Polymer dielectric medium with low dielectric constant and low loss and preparation method of polymer dielectric medium

The invention discloses a polymer dielectric medium with low dielectric constant and low loss and a preparation method of the polymer dielectric medium. The polymer dielectric medium comprises the following raw materials: 50-60% of epoxy resin system, and 40-50% of mixed boron nitride nanoparticles, wherein the mixed boron nitride nanoparticle is a mixture of a boron nitride nanotube and a boron nitride nanotube; the epoxy resin system is formed by 100phr of epoxy resin E-51, 85phr of methyl hexahydrophthalic anhydride and 1phr of benzyl dimethylamine in a mixing manner. The thermal breakdown voltage of the polymer dielectric medium is significantly improved by the polymer dielectric material with high heat conductivity and high electric breakdown, the service life is prolonged, the dielectric constant and loss and the heat expansion coefficient are reduced, the mechanical strength and the tenacity are improved, the highest heat conductivity can be up to 5.26W/mK, the volume resistivity is about 1014ohm.cm, the thermal breakdown voltage is about 2-3kV/mm higher than that of the similar heat-conducting polymer dielectric medium, and the dielectric constant and the loss are a little lower than those of pure resin.
Owner:XIAN UNIV OF SCI & TECH

Cationic viscoelastic surfactant and preparation and application thereof

InactiveCN105080424AExcellent high temperature resistance and shear resistanceGood suspension effectOrganic compound preparationTransportation and packagingFracturing fluid3-MCPD
The invention discloses a cationic viscoelastic surfactant and preparation and application thereof. The preparation method of the cationic viscoelastic surfactant comprises the following steps: firstly, mixing long-chain fatty acid with dimethylaminopropylamine according to a certain proportion, adding a catalyst solution to obtain a required amide product intermediate A by a series of reaction; allowing reflux condensation reaction of epoxy chloropropane and water at a certain proportion to be carried out in oil bath of 100 DEG C to obtain colourless and transparent 3-chloro-1,2-propylene glycol aqueous solution, namely an intermediate B; heating the intermediate A in oil bath for melting, and dropwise adding an aqueous solution B to obtain the required viscoelastic surfactant by a series of reaction; the surfactant can be mixed with a potassium chloride solution according to a certain proportion to obtain clean fracturing fluid which is low in cost and excellent in performance, besides, the clean fracturing fluid has excellent high-temperature resistance, shearing resistance, and excellent solid-carrying performance, is automatic and thorough in gel breaking, causes little damage to the reservoir stratum and has the characteristic of wide application range.
Owner:SOUTHWEST PETROLEUM UNIV

Flame-retardant encapsulating material and preparation method thereof

The invention relates to the field of encapsulation of electronic component, in particular relates to a flame-retardant encapsulating material applicable to electronic and electric product and a preparation method of the flame-retardant encapsulating material, solving the problems of the prior art that the fire-proofing and flame retardant performance is poor, and relatively high flame-retardant rating cannot be obtained. The material comprises a component A and a component B; in percentage by weight, the component A comprises base stock bisphenol-A epoxy resin, fire retardant, diluent diethylene glycol dibenzoate, flexibilizer dioctyl phthalate, pigment, organic silicon defoaming agent and filler silica micropowder; the component B comprises curing agent phthalic anhydride or methyl tetrahydrophthalic anhydride, curing agent eleostearate anhydride, and accelerator 2, 4, 6-tri(dimethylamino methyl) phenol; before the flame-retardant encapsulating material is used, the component A is pre-heated in an oven and then uniformly agitated in an up-to-bottom way; and the component A and the component B are uniformly mixed, so as to obtain flame-retardant encapsulating material; and then the encapsulating can be carried out. The flame-retardant encapsulating material provided by the invention is mainly applicable to insulating packaging of various electronic components such as power engine, rail transit, war industry, spaceflight, car and power.
Owner:大连宝津科技发展有限公司 +1

1,1,1,2,2,3,3,4,4-Nonafluoro-4-methoxybutane refrigerant compositions comprising functionalized organic compounds and uses thereof

The present invention relates to compositions for use in refrigeration and air-conditioning systems comprising 1,1,1,2,2,3,3,4,4-nonafluoro-4-methoxybutane and at least one chlorocarbon, alcohol, ether, ester, N-(difluoromethyl)-N,N-dimethylamine, or mixtures thereof. Further, the present invention relates to compositions for use in refrigeration and air-conditioning systems employing a centrifugal compressor comprising 1,1,1,2,2,3,3,4,4-nonafluoro-4-methoxybutane and at least one chlorocarbon, alcohol, ether, ester, N-(difluoromethyl)-N,N-dimethylamine, or mixtures thereof. The compositions of the present invention may be azeotropic or near-azeotropic and are useful in processes for producing cooling or heat or as heat transfer fluids.
Owner:EI DU PONT DE NEMOURS & CO

Fluorescent probe for detecting hypochlorous acid and preparation method thereof

The invention discloses a fluorescent probe for detecting hypochlorous acid and a preparation method thereof, relating to fluorescent probes. The fluorescent probe for detecting hypochlorous acid, which has higher sensitivity and selectivity and is mainly applied to detecting the hypochlorous acid in an aqueous solution under a neutral condition, as well as the preparation method and the application thereof are provided. The fluorescent probe for the detecting hypochlorous acid is a 7-dimethylamino thiomethoxy-3-phenoxazone compound containing a phenoxazone fluorophore structure and taking dimethylamino thioformyl chloride as phenolichydroxyl protective group. The preparation method comprises the following steps of: adding dimethylamino thioformyl chloride to a container, solving the dimethylamino thioformyl chloride by DMF (Dimethyl Formamide), adding resorufin sodium salt and potassium carbonate and stirring to obtain isabelline slurry, diluting the isabelline slurry by a saturated sodium chloride solution to salt out red sediment, drying the red sediment, and separating by a silicagel column to obtain the fluorescent probe for detecting the hypochlorous acid in red powders. Thefluorescent probe for detecting the hypochlorous acid can be applied to the fluorescence detection of HC1O in the aqueous solution under the neutral condition.
Owner:XIAMEN UNIV

Combined treatment method of N, N-dimethylformamide (DMF) wastewater

The invention discloses a combined treatment method of N, N-dimethylformamide (DMF) wastewater, relates to the field of environment protection and water pollution treatment, and in particular relates to a combined treatment method for treating the N, N-DMF wastewater. The method specifically comprises the following steps: firstly decomposing the DMF wastewater into dimethylamine and formate under an alkali condition, then carrying out air stripping, introducing the dimethylamine waste gas generated in the air stripping into a bio-trickling tower for treatment, and directly carrying out biochemical treatment on the air-stripped wastewater. According to the combined treatment method disclosed by the invention, a physic-chemical method and a biological method are combined, a feasible process for treating the DMF wastewater is provided, the toxicity of the DMF wastewater is reduced by means of the physical-chemical method, the biodegradability of the DMF wastewater is improved, and the generated dimethylamine organic waste gas and wastewater are subjected to advanced treatment by means of the bio-chemical method. By adopting the combined treatment method disclosed by the invention, the effective and economical treatment of the DMF wastewater is achieved, and the problems of secondary pollution, difficult regeneration, low efficiency and the like easily caused by the existing treatment methods of adsorption, extraction, chemical oxidization and the like are solved.
Owner:NANJING TECH UNIV

Modified alicyclic amine curing agent and preparation method thereof

The invention relates to a modified alicyclic amine curing agent and a preparation method thereof. The modified alicyclic amine curing agent is a product which is prepared by reaction of 37-42 parts of 1,3-hexamethylene dimethylamine (1,3-BAC), 12-16 parts of epoxy resin and 41-51 parts of benzyl alcohol in parts by weight; and the viscosity of the product at 25 DEG C is 100-200mPa.S, the amine value is 340-450mgKOH / g, and the active hydrogen equivalent is 100-145g / eq. The preparation method comprises the following steps of: adding the epoxy resin and the benzyl alcohol to a reactor, and uniformly stirring for standby application; adding the 1,3-BAC to another reactor, heating to 60 DEG C, then dropwise adding the previous materials to the 1,3-BAC for reaction, finishing dropwise addition at 60-70 DEG C within 1 to 2 hours, continuously reacting for 1 hours at 60-70 DEG C, and cooling and discharging. The modified alicyclic amine curing agent has low heat release and good compatibility with the epoxy resin and is difficult in moisture absorption and whitening; and after the epoxy resin is cured by the curing agent, the epoxy resin has a smooth surface without water waves and high glossiness and the like.
Owner:程梦喜

Immingled filling material filled polyurethane modified epoxy resin embedding material and preparation method

The invention relates to polyurethane modified epoxy resin encapsulating material filled with promiscuous padding and the preparation method, in particular to epoxy resin encapsulating material prepared by adopting the promiscuous padding mixed by glass fiber power (MG) and SiO2 or AIN and the TDE-85 epoxy resin modified by polyurethane and the preparation method thereof. By adopting the polyurethane to toughen and modify the TDE-85 epoxy resin basal body, and adopting methyl tetrahydrophthalic anhydride methpa as the curing agent, 1,4-butylene-glycol as the chain extender, trimethylol propane as the crosslinking agent, 2,4,6-tris(dimethylamino methyl) phenol as the curing accelerator, and the mixture of the MG and the SiO2 or the AlN as the padding, the epoxy resin encapsulating material is made by evenly mixing the components according to the prescriptive mass ratio, which had good technical performance, in particular to the mechanical property. The experiment indicates that the promiscuous padding can effectively make up for the performance defects of the epoxy resin encapsulating material filled with single particle padding, and has good integrated performance.
Owner:CENT SOUTH UNIV

Preparation method of molecular sieve catalyst used for preparing dimethylamine

The invention relates to a preparation method of a molecular sieve catalyst used for preparing dimethylamine. The invention mainly provides a preparation method of a catalyst with high methanol conversion rate, high dimethylamine selectivity and long service life. The method comprises: subjecting a molecular sieve and pseudoboehmite, as well as dilute nitric acid to pre-molding roasting, and conducting isometric impregnation with a cyclohexane solution of silicon tetrachloride, then conducting treatment with one or several of alkali metal, alkaline earth metal and rare earth metal ion exchange, and steam treatment, thus obtaining the molecular sieve catalyst that can reach the above three requirements at the same time.
Owner:CHINA NAT OFFSHORE OIL CORP +1

Formula and preparation process of heat-conducting aluminum base copper-clad plate with high heat resistance and high insulation

The present invention relates to a formula and a preparation process of a heat-conducting aluminum base copper-clad plate with high heat resistance and high insulation, and belongs to the technical field of chemical product manufacturing. The copper-clad plate comprises raw materials of TDE-85 epoxy resin, E-51 epoxy resin, hydroxyl-terminated polybutadiene liquid rubber, benzyl dimethylamine, dual nitrile amine, KH-560 silane coupling agent, nitride boron powder, alumina powder, aluminum nitride powder and silicon nitride powder. The preparation process comprises steps of mixing, stirring, heating, coating, drying and laminating. A product can be a copper foil layer, an aluminum substrate., and an intermediate high insulating heat-conducting adhesive coating. The product produced by the invention has a high long-term heat resistance and can be used at a high temperature of 150 DEG C for a long time. The product has excellent electric insulation, small dielectric constant and dielectric loss, and high breakdown voltage, and is suitable for occasions requiring high insulation. The heat-conducting adhesive coating has the advantages of simple preparation process, convenient coating construction and cost saving.
Owner:XIANYANG TIANHUA ELECTRONICS SCI & TECH
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