Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Formula and preparation process of heat-conducting aluminum base copper-clad plate with high heat resistance and high insulation

An aluminum-based copper clad laminate, high-insulation technology, applied in the direction of adhesive types, chemical instruments and methods, non-polymer adhesive additives, etc., can solve the problems of poor insulation, complex processing technology, low heat resistance, etc. Achieve high heat resistance, low glue viscosity and excellent heat resistance

Inactive Publication Date: 2012-10-24
XIANYANG TIANHUA ELECTRONICS SCI & TECH
View PDF7 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem of low heat resistance, poor insulation and complex processing technology of aluminum-based copper-clad laminates in the prior art, thereby providing a new technical solution

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Formula and preparation process of heat-conducting aluminum base copper-clad plate with high heat resistance and high insulation
  • Formula and preparation process of heat-conducting aluminum base copper-clad plate with high heat resistance and high insulation
  • Formula and preparation process of heat-conducting aluminum base copper-clad plate with high heat resistance and high insulation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The present invention is described in further detail with specific embodiment now in conjunction with accompanying drawing:

[0038] The raw material prescription used in the present invention and preparation technology thereof are:

[0039] A. Raw material composition:

[0040]

[0041] B. Raw material composition:

[0042] Dicyandiamide 83%

[0043] KH-560 silane coupling agent 17%

[0044] C. Raw material composition:

[0045]

[0046]

[0047] (a) Prepared by mixing the ingredients of A: mixed glue A.

[0048] (b) Prepared by mixing B raw materials: curing agent and auxiliary agent B.

[0049] (c) Prepared by mixing the raw materials of C: high-insulation and heat-conducting powder C.

[0050] According to the ratio of mixed raw materials in A, weigh each raw material component respectively, the total amount is 30 kg, and put them into a stainless steel reactor with jacketed heating and stirring equipment. Turn on the stirring equipment, turn on the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a formula and a preparation process of a heat-conducting aluminum base copper-clad plate with high heat resistance and high insulation, and belongs to the technical field of chemical product manufacturing. The copper-clad plate comprises raw materials of TDE-85 epoxy resin, E-51 epoxy resin, hydroxyl-terminated polybutadiene liquid rubber, benzyl dimethylamine, dual nitrile amine, KH-560 silane coupling agent, nitride boron powder, alumina powder, aluminum nitride powder and silicon nitride powder. The preparation process comprises steps of mixing, stirring, heating, coating, drying and laminating. A product can be a copper foil layer, an aluminum substrate., and an intermediate high insulating heat-conducting adhesive coating. The product produced by the invention has a high long-term heat resistance and can be used at a high temperature of 150 DEG C for a long time. The product has excellent electric insulation, small dielectric constant and dielectric loss, and high breakdown voltage, and is suitable for occasions requiring high insulation. The heat-conducting adhesive coating has the advantages of simple preparation process, convenient coating construction and cost saving.

Description

1. Technical field [0001] The invention relates to a composition and a manufacturing method of a high-heat-resistant, high-insulation and heat-conducting aluminum-based copper-clad laminate, in particular to a composition and a preparation process of a high-heat-resistant, high-insulation and heat-conducting aluminum-based copper-clad laminate, which belongs to the manufacturing technology of chemical products In the field, its products can be copper foil layers, aluminum substrates, and high-insulation and thermal-conductive adhesive layers in the middle. 2. Background technology [0002] At present, the heat-conducting aluminum-based copper-clad laminates in the market, such as those produced by Taiwan Clear Technology and Zhuhai Quanbao Electronics, are mainly formulated with epoxy resin, plasticizer or nitrile rubber or thermoplastic engineering plastics as tougheners, and bis-nitrile Amine is used as a curing agent, combined with inorganic heat-conducting powders such a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L63/00C08L63/02C08L9/00C08K13/02C08K5/18C08K5/31C08K3/38C08K3/22C08K3/28C08K3/34C09J163/00C09J163/02C09J109/00C09J11/04B32B15/092B32B15/20
Inventor 周文英张祥林
Owner XIANYANG TIANHUA ELECTRONICS SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com