32results about How to "Reduce the effects of thermal stress" patented technology

The present invention further provides a chip package process, which includes providing a substrate, disposing a chip on the substrate and forming a buffering compound on the substrate and the chip, wherein the buffering compound covers the chip. The present invention further provides another chip package process, which includes providing a substrate, forming a buffering compound on the substrate and disposing a chip in the buffering compound.

The invention discloses a two-stage thermotube type EGR cooler. The two-stage thermotube type EGR cooler mainly consists of a shell with an exhaust gas inlet and an exhaust gas outlet respectively arranged on two ends of the cooler and a two-stage thermotube with heating sections arranged inside the shell. The thermotube is communicated with four pipe sections of a heating section, a steam tube, a condensation section and a condensation tube in turn from beginning to end; the heating sections of the two-stage thermotube are arranged along the exhaust gas flow direction in order; and the condensation sections of the two-stage thermotube are overlapped and arranged along the radiation wind blowing direction. In the two-stage thermotube, a first stage thermotube and a second stage thermotuberespectively adopt water and methanol as cooling mediums. The two-stage thermotube type EGR cooler adopts the principle of cooling exhaust gas by the thermotube technology and has good cooling effect. In addition, the reasonable combination of the two-stage thermotube and the cross matching of two radiating mediums further improve the temperature reduction effect of the cooler.

The invention relates to a 00Cr22Ni5Mo3N lock ring processing method capable of eliminating deformation and reducing material consumption, belonging to the lock ring production process. Solution treatment, artificial aging treatment and machining, using the method of double-foot continuous forging for forging, using the three-fire rolling ring formed by the ring rolling machine, after the solution treatment and artificial aging treatment of the supersaturated solid solution inside the stainless steel, the final lock is obtained. Finished circle. Strictly control the heating temperature, heating rate and holding time of the billet in the forming process of the lock ring section steel, and control the temperature of the solution treatment and artificial aging treatment to reduce the deformation of the product; the lock ring is forged by the method of double-length continuous rolling. Cancel the welding process to reduce the deformation caused by welding and the waste of cutting materials; use the forming process of the ring rolling machine to make special spindle molds and mandrel molds, and roll out the beveled edges inside and outside the lock ring to reduce material waste.

The invention discloses a process for preparing boot last without gas hole, comprising: A. injecting to form boot last blank and de-molding, B. cooling, C. nicking boot last. The process is characterized in that: the cooling step comprises following steps: fast cooling surface of boot last blank to solidify and form solidified thin layer, then cooling gradually in environment with temperature dropping from high to low. The boot last is characterized by high intensity and accuracy, and greatly increased rate of finished products. The invention also provides a private heat treating forming machine used in said process, comprising shell, shell is equipped with multiplayer conveyer belts up-and-down, one end of each conveyer belt expect bottom one and sealed shell is equipped with vacant sitefor boot last dropping, vacant site distributes interlaced side-to-side from top conveyor belt, the bottom of shell is provided with a plurality of hot gas feeding port with outlet located inwardly, hot gas feeding port is connected to hot gas source, shell is equipped with blank feeding port in relative to top conveyor belt and blank discharging port in relative to bottom conveyor belt.

The invention relates to a surface transverse wave pressure and temperature sensor, which comprises a glass membrane sheet, a glass circular ring, a quartz crystal cantilever beam, a resonance type surface acoustic transverse wave force sensing element, a quartz crystal wafer and a resonance type surface acoustic transverse wave temperature sensing element; the glass circular ring is disposed on ametal base arranged concentric with the pressure inlet of the metal base; the glass membrane sheet is disposed on the glass circular ring; the upper surface of the glass membrane sheet has three protuberant structures; quartz crystal cantilever beams are disposed on a edge protuberant structure and the middle protuberant structure while the distance between the middle protuberant structure and the quartz crystal cantilever beam is zero; the resonance type surface acoustic transverse wave force sensing element is photoengraved on the upper surface of the quartz crystal cantilever beam; the quartz crystal wafer is disposed on the other edge protuberant structure; and the resonance type surface acoustic transverse wave temperature sensing element is photoengraved on the upper surface crystalwafer. The invention reduces sensor volume, reduces the influence of adhesion force and thermal stress to the pressure sensor, increases the mechanical oscillation property and the fatigue property of the sensor, and improves the stability and the uniformity.

A micro accelerometer based on electrostatic adsorption effect. It includes: a lower base, an upper base, a movable plate, a support beam and its anchor point, a support column, a fixed drive electrode, a movable drive electrode, a fixed switch electrode, and a movable switch electrode are arranged between the lower and upper bases. The fixed drive electrodes and fixed switch electrodes are located on the inner surfaces of the lower and upper bases, and the movable drive electrodes and movable switch electrodes are located on the lower and upper surfaces of the movable plate. The invention realizes the measurement of the acceleration by measuring the closing time of the switch electrode. The present invention uses a combination structure composed of a rigid circular plate and its supporting beams as a movable structure. The contact resistance between the movable and fixed switch electrodes is relatively low, and the movable and fixed drive electrodes have relatively large electrostatic adsorption force, thereby preventing the movable switch electrodes from contacting each other. Bouncing after fixing the switching electrodes and enabling the measurement of high accelerations. The supporting beam in the invention is a non-straight beam, which can effectively eliminate the influence of thermal stress on acceleration measurement.

The invention provides a fabrication method of a semiconductor device. The method comprises the steps of providing a package substrate, wherein the package substrate is provided with a first surface and a second surface which are opposite to each other, a plurality of chip pre-package regions and strip-shaped regions are arranged on the first surface, and the strip-shaped regions are arranged among the plurality of chip pre-package regions; and at least etching to remove a part of the strip-shaped regions. According to the fabrication method of the semiconductor device, provided by the invention, the thermal stress influence among the chip pre-package regions caused by thermal expansion coefficient mismatching of a package material is reduced by partially etching the package substrate, wraping is prevented, so that the performance stability of the semiconductor device is ensured, and the production efficiency is improved.

A metal-based integrated resonant accelerometer mounted on the same plane, including a metal base and two double-end fixed-supported quartz tuning forks, the metal base includes a mass block, a first flexible hinge, a second flexible hinge, and a fixed metal base , the mass block is connected to the fixed metal base through the first flexible hinge and the second flexible hinge; the two double-ended fixed-supported quartz tuning forks have the same structure and are mounted on the mass block and the fixed metal base. Differential layout; the metal base is processed by low-stress or stress-free processes such as laser cutting and wire cutting, and has a positioning slot for positioning double-ended fixed-supported quartz tuning forks. The positioning slot is perpendicular to the DA direction of the sensitive direction SA. It has the advantages of good differential effect, easy implementation of micro-assembly process, high sensitivity, simple processing, high processing precision of precision elastic parts, and small processing residual stress.

The invention discloses a power module by directly bonding a power terminal, comprising a chip, an insulating substrate, a radiating rib, the power terminal and a shell, wherein the power terminal is directly fixed on the shell. The fixing mode of the power terminal can optimize the design shape of the terminal, reduce stray inductance, and improve the reliability and service life by applying thepower terminal module.

The invention discloses a shell of a bulletproof vehicle and a production method thereof. The method comprises: cutting a bulletproof plate according to the size of the shell of a bulletproof vehicle; welding the cut bulletproof plate, wherein welding wire and the bulletproof The components of the boards are the same to form a preliminary bulletproof vehicle shell; the preliminary bulletproof vehicle shell is structurally reinforced to form a reinforced bulletproof vehicle shell; the entire reinforced bulletproof vehicle shell is heat treated to obtain a finished bulletproof vehicle shell. It solves the technical problems in the prior art that the bulletproof performance at the position of the welding seam joint is greatly reduced, the phenomenon of breakdown occurs in the target shooting test, and it is difficult to meet the overall protection requirements of the bulletproof vehicle. It has achieved the technical effect that the welded joints of the bulletproof vehicle can achieve the protection performance equivalent to that of the bulletproof plate after heat treatment, which greatly improves the overall safety of the bulletproof vehicle and meets the requirements of the overall bulletproof performance.

A circuit board capable of furthest exerting capacity of a semiconductor integrated circuit, easy to implement high function, easy to be produced and with excellent cost performance and reliability, comprising: a board core having a main core surface and a rear core surface; a ceramic capacitor having a main capacitor surface and a rear capacitor surface, having a structure in which a first innerelectrode layer and a second inner electrode layer are alternately stacked with a ceramic dielectric layer interposed therebetween, and having a plurality of capacitor function units being electrically independent from each other, the ceramic capacitor being buried in the board core in a state where the main core surface and the main capacitor surface are directed in a same direction; and a buildup layer having a structure in which an interlayer insulating layer and a conductor layer are alternately stacked on the main core surface and the main capacitor surface and having a semiconductor integrated circuit device mounting region for mounting a semiconductor integrated circuit device having a plurality of processor cores on a surface of the buildup layer, wherein the plurality of capacitorfunction units are capable of being electrically connected to the plurality of processor cores, respectively.