Surface treatment device and workpiece surface treatment method
A technology for surface treatment devices and workpieces, applied in the direction of grinding drive devices, grinding/polishing safety devices, manufacturing tools, etc., can solve the problems of complex spindle structure and single function, and achieve rich functions, high mechanical precision, and maintenance The effect of precision
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Embodiment 1
[0081] The surface treatment device disclosed by the present invention will be described below with reference to the accompanying drawings, and the surface treatment device is applicable to any plane grinding conditions. It is especially suitable for flattening processing of semiconductor materials, such as single crystal silicon, single crystal silicon carbide, sapphire single crystal, semiconductor wafers, chips, and optoelectronic and ceramic materials, subverting the traditional processing technology and mode.
[0082] as attached figure 1 As shown, the surface treatment device includes a grinding tool spindle 10 and a workpiece spindle 20, at least one of which is connected to a feed drive mechanism (not shown) that drives its axial feed relative to the other, namely In one mode, the workpiece spindle 20 does not feed, and the grinding tool spindle 10 feeds to the workpiece spindle 20; in another mode, the grinding tool spindle 10 does not feed, and the workpiece spindle ...
Embodiment 2
[0116] as attached Figure 8 As shown, the overall structure of this embodiment is similar to that of Embodiment 1, the difference is that: the grinding tool spindle 10 and the workpiece spindle 20 are not coaxial, that is, the axes 103, 203 of the grinding tool spindle 10 and the workpiece spindle 20 are parallel (their axes are staggered) and their opposite end faces 101, 201 are partially overlapped (that is, the projections of their opposite end faces on the projection plane parallel to the opposite end faces are partially coincident), and the opposite end faces 101 of the grinding tool spindle 10 are altogether The shaft is provided with a grinder 30 and the opposite end face 201 of said workpiece spindle 20 is coaxially provided with a workpiece 40 .
[0117] In one way, the grinding tool 30 can directly cover the surface to be processed of the workpiece 40, at this time, at least one of the grinding tool spindle 10 and the workpiece spindle 20 can be connected to an aut...
Embodiment 3
[0128] In the above-mentioned embodiments 1 and 2, the semi-finishing tool spindle 10 and the workpiece spindle 20 are all one. When grinding or polishing with different precision is required, the corresponding surface treatment needs can be realized by replacing different abrasive tools. Such a process is time-consuming strenuous. as attached Figure 12 - attached Figure 15 As shown, so compared with the above-mentioned embodiments 1 and 2, the difference in this embodiment is that: the workpiece spindle 20 in the surface treatment device is one, and the grinding tool spindle 10 is multiple, and according to a certain Track arrangement; the workpiece spindle 20 can move to the state of the above-mentioned embodiment 1 with each of the grinding tool spindles, or the workpiece spindle 20 can move to reach the above-mentioned embodiment 2 with each of the grinding tool spindles status. And in this embodiment, only the workpiece spindle 20 can be fed, and the plurality of gri...
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