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A kind of gradient diamond/copper composite material and its preparation method

A composite material and diamond technology, applied in the field of gradient diamond/copper composite material and its preparation, can solve the problems of difficult bonding, low expansion coefficient and welding performance, high thermal conductivity, etc. High-efficiency preparation

Active Publication Date: 2022-04-12
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a gradient diamond / copper composite material with high interface quality and a preparation method thereof, which can realize diamond / copper interface bonding difficulties and problems such as high thermal conductivity, low expansion coefficient and welding performance. Good combination with copper and low diamond volume fraction in the area that needs to be welded are conducive to welding, and high diamond volume fraction in the area connected to the semiconductor device is conducive to heat conduction and thermal expansion coefficient matching, taking into account the thermal performance and sealing performance of the package heat dissipation shell

Method used

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  • A kind of gradient diamond/copper composite material and its preparation method
  • A kind of gradient diamond/copper composite material and its preparation method
  • A kind of gradient diamond/copper composite material and its preparation method

Examples

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Embodiment 1

[0029] The preparation of tungsten-coated diamond particles on the surface, the specific process includes: put the diamond particles in ethanol and clean them with ultrasonic vibration for 30 minutes, take them out and wash them with deionized water until they are neutral, then put them in acetone and clean them with ultrasonic vibrations for 30 minutes, take them out and use them again. Wash with deionized water until neutral. Then put the cleaned diamond particles into 15% NaOH solution and boil for 10min, take it out and wash with deionized water until neutral, then put the diamond particles into 30% HNO 3 Boil in the solution for 30 minutes, take it out, wash it with deionized water until it is neutral, and dry it to obtain a surface-activated diamond. Put the pretreated diamond, high-purity tungsten powder, and tungsten trioxide mixed powder into a ball mill tank at a mass ratio of 1:1, and use a planetary ball mill mixer at a speed of 200r / min to rotate forward and rever...

Embodiment 2

[0034] This embodiment is a gradient diamond / copper composite heat dissipation material. The preparation process is the same as that of Embodiment 1, the only difference is that the diamond in the composite material is distributed in a transverse gradient, and the gradient filling method is set in a high-strength graphite mold and the mold The tungsten wire mesh with the same shape and smaller size divides the mold into two areas in the lateral direction, and fills 10% and 50% of the designed amount of mixed powder with the volume fraction of diamond in the outer and inner parts respectively to realize the mixed powder transverse gradient packing. After molding process, get such as Figure 5 The laterally graded diamond / copper composite is shown.

Embodiment 3

[0036] This embodiment is a gradient diamond / copper composite heat dissipation material. The preparation process is the same as that of Embodiment 1. The only difference is that the diamond in the composite material is distributed in a three-dimensional gradient, that is, there are both horizontal and vertical gradients, and the gradient filling method is also Use both ways at the same time. After molding process, get such as Figure 6 The 3D gradient diamond / copper composite is shown.

[0037] According to the longitudinal and transverse gradient diamond / copper composite materials prepared in Examples 1, 2, and 3 of the present invention, after proper size adjustment, arrangement and combination, they can be directly welded as Figure 7 The gradient diamond / copper heat dissipation shell shown, pattern ① represents a lower diamond volume fraction, and pattern ② represents a higher diamond volume fraction; the bottom plate and cover plate of the shell are designed with a trans...

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Abstract

The invention relates to a gradient diamond / copper composite material and a preparation method thereof, belonging to the field of thermal management materials. It is characterized in that: the diamond / copper mixed powder with different diamond volume fractions is filled into the high-strength graphite mold according to the design through the gradient filling method to realize the transverse or longitudinal gradient distribution of the diamond volume fraction; and the tungsten plating on the diamond surface strengthens the The combination of diamond and copper improves the thermal conductivity of the composite material; the composite material is formed by resistance hot pressing sintering, which has a fast sintering speed and high density of the material. The invention provides a preparation method of a gradient diamond / copper composite material, which can prepare a composite material with good interface quality and high density, and realize the gradient distribution of diamond volume fraction for specific needs, taking into account thermal performance and sealing and welding performance.

Description

technical field [0001] The invention relates to a gradient diamond / copper composite material and a preparation method thereof, belonging to the field of thermal management materials. Background technique [0002] With the development of science and technology, the power of devices used in aerospace, military and other fields is increasing, and the degree of integration is getting higher and higher. The problem of heat dissipation has gradually become an important factor restricting the performance of electronic devices. Especially in high-tech technical fields with typical applications of high-power insulated gate bipolar transistors (IGBT), microwave, electromagnetic, photoelectric and other devices, and in defense technologies with typical applications of active phased array radar and high-energy solid-state lasers, etc. The field has urgent application requirements. [0003] A new generation of thermal management materials—high thermal conductivity diamond / copper composi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C47/14C22C49/02C22C49/14B22F7/04B22F3/14B22F3/10C22C111/02
CPCC22C47/14C22C49/02C22C49/14B22F7/04B22F3/14B22F3/1007B22F2207/01B22F2999/00B22F2201/20
Inventor 李金旺戴书刚王昌机
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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