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Wiring board and ceramic capacitor

一种陶瓷电容器、布线基板的技术，应用在电固体器件、电路、电气元件等方向，能够解决IC芯片连接困难、端子间间距差等问题

Active Publication Date: 2010-05-26
NGK SPARK PLUG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a large difference in the pitch between terminals between the terminal group on the IC chip side and the terminal group on the motherboard side, so it is difficult to directly connect the IC chip to the motherboard.

Method used

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  • Wiring board and ceramic capacitor
  • Wiring board and ceramic capacitor
  • Wiring board and ceramic capacitor

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0112] Hereinafter, the first embodiment embodying the wiring board of the present invention will be described in detail based on the drawings.

[0113] Such as figure 1 As shown, the wiring board 10 of this embodiment is a wiring board for mounting an IC chip, and includes a substantially rectangular plate-shaped substrate core 11 made of epoxy glass, and an upper surface 12 (core core main surface) of the substrate core 11 The first build layer 31 (build layer) formed on the upper surface and the second build layer 32 formed on the lower surface 13 (back surface of the core core) of the substrate core 11. Via-hole conductors 16 are formed at multiple locations on the substrate core 11. Such via-hole conductor 16 connects and conducts the upper surface 12 side and the lower surface 13 side of the substrate core 11. In addition, the inside of the via-hole conductor 16 is filled with a blocking body 17 such as epoxy resin, for example. Also, on the upper surface 12 and the lower...

no. 2 Embodiment approach

[0152] Hereinafter, a second embodiment embodying the wiring board of the present invention will be described in detail based on the drawings.

[0153] Such as Figure 8 As shown, the wiring board 10' of this embodiment has two IC chip mounting regions 51 and 52 (semiconductor integrated circuit element mounting regions) on the surface 9 of the first build layer 31. In addition, in the IC chip mounting areas 51 and 52, instead of the IC chip 21 of the first embodiment described above, two IC chips 53 and 54 each having only one processor core are mounted.

[0154] A part of each of the first power supply via conductors 131 constituting the capacitor function section 107 is electrically connected to the surface connection terminal 22 of the IC chip 53 through the first power supply electrode terminal 111 and the first power supply conductor section 171. A part of each of the first ground via conductors 132 constituting the capacitor function portion 1107 is electrically connected to...

no. 3 Embodiment approach

[0179] Hereinafter, a third embodiment embodying the wiring board of the present invention will be described in detail based on the drawings.

[0180] The IC chip 21 has two processor cores 24, 25, and also has two I / O circuit units 28, 29, etc., which is similar to figure 1 The wiring board 10 of the first embodiment shown is different.

[0181] Shows the ceramic capacitor 101 Figure 2~4 And its description and showing the manufacturing method Figure 5-7 The descriptions thereof are also applicable to the ceramic capacitor 101A of this embodiment, but the following points are different from the ceramic capacitor 101 of the first embodiment.

[0182] Figure 24 The ceramic capacitor 101A of this embodiment is shown in FIG. In the case of the ceramic capacitor 101A of this modified example, a system independent of the processor cores 24 and 25 of the IC chip 21 (used to supply power to the I / O circuit parts 28, 29, etc. ) Capacitor function unit 162. In addition, the capacitor fun...

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PUM

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Abstract

A circuit board capable of furthest exerting capacity of a semiconductor integrated circuit, easy to implement high function, easy to be produced and with excellent cost performance and reliability, comprising: a board core having a main core surface and a rear core surface; a ceramic capacitor having a main capacitor surface and a rear capacitor surface, having a structure in which a first innerelectrode layer and a second inner electrode layer are alternately stacked with a ceramic dielectric layer interposed therebetween, and having a plurality of capacitor function units being electrically independent from each other, the ceramic capacitor being buried in the board core in a state where the main core surface and the main capacitor surface are directed in a same direction; and a buildup layer having a structure in which an interlayer insulating layer and a conductor layer are alternately stacked on the main core surface and the main capacitor surface and having a semiconductor integrated circuit device mounting region for mounting a semiconductor integrated circuit device having a plurality of processor cores on a surface of the buildup layer, wherein the plurality of capacitorfunction units are capable of being electrically connected to the plurality of processor cores, respectively.

Description

Technical field [0001] The present invention relates to a wiring substrate on which a semiconductor integrated circuit element is mounted, in which a ceramic capacitor (capacitor) is embedded in a substrate core and a build-up layer is formed on the surface, and the use of the wiring substrate Ceramic capacitors. Background technique [0002] Semiconductor integrated circuit elements (IC chips) used in computer microprocessors, chipsets, etc. have become more and more high-speed and more functional in recent years, and with this, the number of terminals has increased and the pitch between terminals has also tended to become narrower. Generally speaking, there are many terminals densely arranged in an array on the bottom surface of an IC chip, and such a terminal group is connected to the terminal group on the motherboard side in the form of flip chip. However, the terminal group on the IC chip side and the motherboard side In the terminal group, there is a large difference in th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K1/00H01L23/498H01L23/50H01L23/32H01L23/12
CPCH01L2924/14H01L2924/01019H01L2924/19042H01L2924/15311H01L2924/01078H01L2924/19041H01L2924/3025H01L2224/16H01L2924/09701H01L2224/16235
Inventor 小川幸树由利伸治佐藤学杉本康宏
Owner NGK SPARK PLUG CO LTD
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