The invention discloses a preparation method of an AlN film based on a patterned
sapphire substrate (PPS). The method comprises the following steps that (1) a PSS
wafer is selected, and the PSS
wafer and an Al target are pretreated; (2) a
reaction chamber is vacuumized, and the PSS
wafer is placed in the vacuumized
reaction chamber; (3) the PSS wafer is cleaned with low energy, so that an
oxide layer on the surface of the wafer is removed; (4) the PSS wafer is heated to be at a certain temperature through currents; (5) the PSS wafer is subjected to pre-
sputtering in a vacuum environment; (6) sputter
coating is carried out at a stable air pressure, and the AlN film based on the PSS is obtained; and (7) equipment is
shut down, and the prepared AlN film based on the PSS is taken out. The graph dimension of the PPS is 2.6-2.8 microns, the height of the PPS is 1.6-1.8 microns, the thickness of the AlN film is 15-50 nm, the half-peak width is 160-180 arcsec, and the
surface roughness is 0.3-0.5 nm. According to the method, patterned
sapphire is adopted as the substrate, the AlN film is prepared through the
plasma magnetron
sputtering method, by means of the AlN film, the warping during epitaxial growth of the
sapphire can be greatly reduced, and the yield and output power of an LED
chip are greatly improved.