Preparation method of AlN film based on patterned sapphire substrate (PPS)
A thin film and sputtering coating technology, applied in ion implantation plating, metal material coating process, coating and other directions, can solve the problems of large warpage and high production cost in epitaxial growth, save process time and reduce defect density , The effect of improving yield and output power
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[0034] Select a piece of wafer, the wafer is Ф101.6mm×0.650mm PSS wafer, its microscopic appearance is as follows figure 1 As shown, the equipment used is a sputtering coating machine, and the workshop meets the requirements of a class 100 clean room standard. The following specific steps are followed to prepare the PSS-based AlN film:
[0035](1) Select a piece of PSS wafer, and pre-treat the PSS wafer and the Al target, wherein the pre-treatment of the PSS wafer includes: sequentially using analytical grade isopropyl ketone and alcohol to scrub the PSS wafer to remove grease and water on the surface of the PSS wafer and other dirt, then blow it off with compressed air with a pressure of 1.2MPa, and finally place the processed PSS wafer on the anode plate, cover the vacuum cover, and keep the reaction chamber clean;
[0036] The pretreatment of the Al target includes: wipe the round Al target with a purity of 99.99% with a dust-free cloth soaked in isopropanol to remove the o...
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