41results about How to "Reduce conduction thermal resistance" patented technology

The invention discloses a thermoelectric refrigeration technology-based high-efficiency cooling device and method of a soaking plate reinforcement server. The cooling device comprises a soaking platecold plate, a printed plate, an upper groove plate, a lower groove plate, a thermoelectric refrigeration sheet, an upper soaking heat sink, a lower soaking heat sink and an axial draught fan, whereinheat conduction bosses are arranged on the upper groove plate and the lower groove plate, the soaking plate cold plate is contacted with the heat conduction bosses of the upper groove plate and the lower groove plate by locking devices, the printed board is fixed on the soaking plate cold plate, heat of a heating component on the printed board is conducted to the bosses of the upper groove plate and the lower groove plate by the soaking plate cold plate, is conducted to the thermoelectric refrigeration sheet by the bosses of the upper groove plate and the lower groove plate and then is conducted to the upper soaking plate heat sink and the lower soaking plate heat sink by the thermoelectric refrigeration sheet, and heat of the heat sinks is taken away by pumping of the axial draught fan. Heat is dissipated by combining the soaking plate and thermoelectric refrigeration, a large amount of heat is dissipated, heat dissipate is stable, and moreover, damage to cooling equipment is reduced.

The invention relates to a direct current cable for subway, which comprises a conductor, wherein the conductor adopts tin-plating copper wires; the strand is stranded by a plurality of tin-plating copper wires; water blocking yarns are clamped among the tin-plating copper wires; a power wire core is stranded by a plurality of strands horizontally coated with double-surface semi-conductive water blocking tapes and is coated with two layers of double-surface semi-conductive water blocking tapes outside which polyester film tapes are coated; the polyester film tapes is coated with 105 DEG C heat-resistant, high-strength and flame-retardant ethylene propylene terpolymer rubber outside which an expansion type semi-conductive water resistance tape is coated; aluminum plastic composite tapes are arranged outside the expansion type semi-conductive water resistance tapes and are overlapped, horizontally coated and welded in a lapping way; a high flame retardant oxygen-blocking layer is extruded and coated between the aluminum plastic composite tapes and a polyethylene inner sheath, wherein the high flame retardant oxygen-blocking layer is filled with a great amount of organic flame retardants, such as metal hydroxides of aluminum hydroxide, magnesium hydroxide and the like; a ratproof, termiteproof, ultraviolet-resistant, low-smoke, halogen-free and high flame retardant type polyolefine sheath is arranged outside the polyethylene inner sheath. The invention can be completely used under bad geological conditions.

The invention discloses a cooling device used in conjunction with a module to be cooled, which belongs to the technical field of electronic device cooling, and comprises a cold plate (1), wherein two ends of the cold plate (1) are provided with inlets and outlets, and an external cooling medium enters through the inlet The cold plate (1) flows out through the outlet; the number of the modules to be cooled (2) is n, and they are arranged in sequence on the surface of the cold plate (1); each of the modules to be cooled (2) is A heat source (3) is provided; at least one notch is provided on the surface of the cold plate (1) at a position corresponding to the heat source (3) on each module to be cooled, and the total number of the notches is m, The cooling medium is in direct contact with the shell of the module to be cooled through the slot, and n and m are natural numbers. The invention has the function of being replaceable on site, and at the same time can reduce the high contact thermal resistance between the module and the cold plate, can significantly improve the cooling effect of the cooling device, reduce the working temperature of the module to be cooled, and improve the reliability of the system.