41results about How to "Reduce conduction thermal resistance" patented technology

A heat-dissipating fin of a heat sink for improving thermal conduction is disclosed. The heat sink has a base plate and a plurality of heat-dissipating fins. The base plate includes a first surface contacting with a heat source, and a second surface having a plurality of grooves orderly formed on the second surface. The heat dissipating fin of the heat sink has the feature that the thickness of the heat-dissipating fin is not uniform, and the thickness of a bottom surface of the heat-dissipating fin facing the groove is greater than the other portions of the heat-dissipating fin.

The invention relates to a direct current cable for subway, which comprises a conductor, wherein the conductor adopts tin-plating copper wires; the strand is stranded by a plurality of tin-plating copper wires; water blocking yarns are clamped among the tin-plating copper wires; a power wire core is stranded by a plurality of strands horizontally coated with double-surface semi-conductive water blocking tapes and is coated with two layers of double-surface semi-conductive water blocking tapes outside which polyester film tapes are coated; the polyester film tapes is coated with 105 DEG C heat-resistant, high-strength and flame-retardant ethylene propylene terpolymer rubber outside which an expansion type semi-conductive water resistance tape is coated; aluminum plastic composite tapes are arranged outside the expansion type semi-conductive water resistance tapes and are overlapped, horizontally coated and welded in a lapping way; a high flame retardant oxygen-blocking layer is extruded and coated between the aluminum plastic composite tapes and a polyethylene inner sheath, wherein the high flame retardant oxygen-blocking layer is filled with a great amount of organic flame retardants, such as metal hydroxides of aluminum hydroxide, magnesium hydroxide and the like; a ratproof, termiteproof, ultraviolet-resistant, low-smoke, halogen-free and high flame retardant type polyolefine sheath is arranged outside the polyethylene inner sheath. The invention can be completely used under bad geological conditions.

The invention relates to a single-mode high-power vertical cavity surface-emitting laser based on a SiC heat sink. Including N electrode, SiC substrate, N-type DBR, active region, oxidation limiting layer, P-type DBR, SiC (electrode + window + heat sink), SiO2 mask, solder. The present invention is characterized by adopting a flip-chip top-emitting structure. The light output window is made on the P-type DBR, and the top light output method is adopted, and the heat sink is also placed at the end of the P surface. SiC wafers have high thermal conductivity, high electrical conductivity and high transmittance of near-infrared light after being modified by special technology. The P electrode, light window and heat sink in the traditional structure are replaced by SiC wafers, and the functions of the three are combined into one. The SiC wafer is used as an electrode, and the circular P electrode of the traditional VCSEL is replaced by a planar electrode or a non-uniform grid electrode; the SiC wafer is used as a heat sink material, and the thermal expansion coefficient is similar to that of GaAs materials, and it is directly flip-chip connected to the P surface in the epitaxial wafer; The SiC wafer simultaneously becomes the light exit window.

The invention discloses a low-resistance enhanced heat transfer structure based on a nanometer super-wetting interface. The low-resistance enhanced heat transfer structure comprises a lower embedded microchannel layer and an upper manifold channel layer, wherein embedded microchannels are perpendicular to manifold channels; the lower embedded microchannel layer consists of a plurality of embeddedmicrochannel units; the cross section of each embedded microchannel of each unit is a rectangular divergent cross section along the flowing direction of a cooling working medium; the shape of each embedded microchannel of each unit is isosceles trapezoid; the upper manifold channel layer is composed of the S-shaped manifold channels; and two adjacent S-shaped manifold channels form inlets and outlets of the manifold channels. According to the low-resistance enhanced heat transfer structure, a microchannel radiator is constructed by utilizing a layered flow structure, the heat transfer characteristic and the resistance characteristic can be simultaneously improved by combining the microchannel radiator with the nano super-wetting interface and the divergent microchannel section, and the low-resistance enhanced heat exchange of the microchannel radiator is achieved under the condition of higher heat dissipation efficiency.

The invention discloses a thermoelectric refrigeration technology-based high-efficiency cooling device and method of a soaking plate reinforcement server. The cooling device comprises a soaking platecold plate, a printed plate, an upper groove plate, a lower groove plate, a thermoelectric refrigeration sheet, an upper soaking heat sink, a lower soaking heat sink and an axial draught fan, whereinheat conduction bosses are arranged on the upper groove plate and the lower groove plate, the soaking plate cold plate is contacted with the heat conduction bosses of the upper groove plate and the lower groove plate by locking devices, the printed board is fixed on the soaking plate cold plate, heat of a heating component on the printed board is conducted to the bosses of the upper groove plate and the lower groove plate by the soaking plate cold plate, is conducted to the thermoelectric refrigeration sheet by the bosses of the upper groove plate and the lower groove plate and then is conducted to the upper soaking plate heat sink and the lower soaking plate heat sink by the thermoelectric refrigeration sheet, and heat of the heat sinks is taken away by pumping of the axial draught fan. Heat is dissipated by combining the soaking plate and thermoelectric refrigeration, a large amount of heat is dissipated, heat dissipate is stable, and moreover, damage to cooling equipment is reduced.

The invention provides a low-flow-resistance chip embedded array micro-jet radiator and a manufacturing method thereof. The low-flow-resistance chip embedded array micro-jet radiator adopts a viscoelastic fluid as a medium, and comprises a chip substrate, a partition plate and a liquid supply bottom plate which are bonded and sealed, wherein a plurality of micro grooves and micro columns are arranged on the chip substrate, a plurality of jet micropores and reflux micropores are formed in the partition plate, the liquid supply bottom plate is provided with a working medium inlet, a liquid distribution area, a plurality of liquid supply micro-channels, a plurality of liquid return micro-channels, a liquid collection area and a working medium outlet, the liquid distribution area is communicated with the working medium inlet, the liquid supply micro-channels are communicated with the liquid distribution area, the liquid return micro-channels are communicated with the liquid collection area, and the liquid collection area is communicated with the working medium outlet. According to the chip-level embedded micro-jet radiator, a cooling liquid is directly guided into the chip substrate ofa chip, so that the heat conduction resistance from a heat source to a fluid is greatly reduced; and elastic turbulence is triggered in a flow field by utilizing a micropore jet flow cooling structure, so that microfluid heat exchange enhancement under a low Reynolds number is realized so as to substantially reduce the flow resistance and reduce the pump power consumption.

The invention relates to a phase change heat storage solar air source dual-heat-source heat pump hot water power generation system. The heat pump hot water power generation system comprises a refrigerant circulation system, a water source heating system and a power generation system body. A photovoltaic panel and a heat collection evaporator are combined together, the heat of the photovoltaic panel is absorbed through phase change heat storage materials, and a refrigerant continuously and stably absorbs the heat of the solar photovoltaic panel in the heat collection evaporator to be evaporated. On one hand, the effect of cooling the photovoltaic panel is achieved, the photoelectric conversion efficiency of the photovoltaic panel is improved, and the photoelectric panel stably outputs electric energy. On the other hand, the effect of collecting the heat of the photovoltaic panel is achieved. Solar energy absorbed by the heat collection evaporator and air heat energy absorbed by an air cooling type evaporator exchange energy with cold water in a water cooling type condenser through a heat pump system, hot water is produced, and heat energy is effectively utilized. Accordingly, the energy quality is improved, energy is effectively utilized and saved, and the phase change heat storage solar air source dual-heat-source heat pump hot water power generation system has the advantages of being stable, convenient to use and the like.

The invention discloses a patch-type power device integration scheme applied to an electric control product of an electric vehicle, and relates to the technical field of a new energy automobile. A thick-copper PCB (Printed Circuit Board) embedded or buried with a plurality of copper blocks is used as a main circuit carrier, a patch-type power device is welded on the copper blocks, a bus capacitor is welded on the thick-copper PCB, the thick-copper PCB is pressed on a heat dissipation cold plate, and an insulation heat conduction gasket is arranged between the thick-copper PCB and the heat dissipation cold plate. The patch-type power device is welded on the copper blocks, and heat is transmitted by means of high heat conductivity of copper; meanwhile, the peak impact capability can be effectively improved by heat capacity of the thick copper blocks; and the insulation heat conduction gasket is arranged between the thick-copper PCB and the heat dissipation cold plate, and thus, extremely low heat conduction resistance between the power device and the heat dissipation cold plate is achieved.

The invention provides a liquid cooling heat dissipation apparatus and a motor controller. The liquid cooling heat dissipation apparatus comprises a substrate and a cooling liquid channel formed in the substrate; at least one heat conducting lug boss which protrudes out of the upper surface of the substrate is arranged on the substrate; a first mounting station used for mounting a power device is arranged on the side surface of each heat conducting lug boss; a lug boss water channel is formed in the heat conducting lug boss; and the lug boss water channel forms a part of the cooling liquid channel. By means of forming the lug boss water channel in the heat conducting lug boss and enabling the lug boss water channel to be one part of the cooling liquid channel, the heat conducting efficiency of the heat conducting lug boss can be greatly improved, and heat of the power device which is mounted on the surface of the heat conducting lug boss from the side surface can be taken away rapidly.

The present invention discloses a combined modular backlight unit for a flat panel display and a helmet. The present invention aims to provide a combined modular backlight unit for a flat panel display and a helmet. The present invention is characterized in that: it comprises LED chips packaged by ceramic, a heat spreader and cooling fins, a LED module packaged by resin is equipped on the heat spreader and cooling fins are equipped below the heat spreader, and the LED module packaged by resin is consists of at least one piece of LED chip packaged by ceramic. The present invention is mainly applicable to the display device.

The invention relates to a single LED (light-emitting diode) light source radiating seat which comprises a substrate for fixing an LED light source, a radiating block connected with the substrate, and a radiating plate connected with the radiating block, wherein the radiating block comprises a connecting part connected with the substrate and the radiating plate and a protruding part arranged on the connecting part; and the protruding part is adhered to the LED light source through a hole formed on the substrate. The LED light source is jointed with the protruding part of the radiating block, so that the heat generated by the light source can be directly transferred to the radiating plate through the radiating block; and because the traditional heat is transferred to the radiating block and the radiating plate in turn through the substrate, the whole conducting thermal resistance between the LED light source and the radiating plate is reduced. Therefore, the heat conduction efficiency is higher, the radiating effect is better, the junction temperature of the LED light source can be effectively reduced, and the service life of the LED light source is prolonged. In addition, the invention also relates to an LED lamp employing the single LED light source radiating seat.

The invention discloses a halogen-free low-smoke oxygen-barrier flame-retardant cable, which comprises cable cores, wherein each cable core is provided with a wire core conductor, a fire-resistant mica layer, an insulated layer, a wrapping shielding layer, and an inner sheath sequentially from inside to outside; a filling layer is arranged outside the cable core; a fire barrier layer is arranged outside the filling layer; an oxygen barrier layer is arranged outside the fire barrier layer; an outer sheath is arranged outside the oxygen barrier layer; the filling material of the filling layer is inorganic aluminum hydroxide colloid; and the oxygen barrier layer is a wrapping alkali-free glass fiber rope. According to the halogen-free low-smoke oxygen-barrier flame-retardant cable, as the fire-resistant mica layer, the insulated layer, the wrapping shielding layer and the inner sheath are arranged outside each wire core conductor, fire-resistant insulation shielding protection is carried out on the wire core conductor, and as the filling layer, the fire barrier layer, the oxygen barrier layer and the outer sheath are arranged outside the cable core, good oxygen-barrier and flame-retardant roles are played on the cable core, and the strength and the mechanical performance of the cable are enhanced; and due to filling of aluminum hydroxide, the thermal capacity and the conductive thermal resistance of the cable are reduced, the oxygen-barrier cable is hard to ignite and ablate, and emission of smoke and poisonous gas is reduced.

The invention discloses a high-power LED lighting device, which mainly comprises an LED lighting chip, a circuit board and a radiating fin. The high-power LED lighting device is characterized in that: the LED lighting chip is welded on the circuit board which is closely connected with the radiating fin; the heat generated when the LED lighting chip works is transferred to the radiating fin; waterproof and insulating treatment is performed on the LED chip and circuits so that the radiating fin can be bared in the air directly; an air convection channel is designed on the radiating fin, so the heat which is transferred to the radiating fin when the LED lighting chip works enables hot air to rise, and cold air forms air convection to perform circulation radiation through the air convection channel so as to exchange heat with the environment rapidly. The high-power LED lighting device has the characteristics of low thermal-conduction resistance, insulativity and waterproof performance, utilization of air circular convection for radiating, high heat exchange efficiency, simple implementation process, capability of effectively ensuring that the LED lighting chip works in good temperature environment, simple structure, low cost, no mechanisms of a fan or the like and high reliability, and can be widely applied to various LED lighting devices such as a street lamp, a tunnel road, a flood lamp, a strip lamp and a wall washing lamp.

The invention relates to a heat dissipation structure suitable for a spacecraft high-power device. The structure comprises an installation pressing block, an elastic sponge body, heat conduction filler, an insulation ceramic piece, an insulation sleeve and an installation plate. The installation plate and the installation pressing block are main heat dissipation structures, a single-lug high-powerdevice is fixed to the installation plate, the insulation ceramic piece is arranged between the installation plate and the device, and the heat conduction filler is evenly smeared at the gap betweenthe installation plate and the device; a fastener and a metal shell of the single-lug high-power device are isolated by using a T-shaped insulating sleeve; and the elastic sponge body is loaded between the installation pressing block and the device to provide uniform pressing force for the mounting surface of the device. According to the structure, a large-area heat conduction path does not need to be drawn, active thermal control measures do not need to be provided, the temperature rise suppression amplitude of the single-lug high-power device can reach 23% or above, the insulation and voltage resistance of 10 kV or above can be achieved, and the structure can be widely applied to insulation and heat dissipation installation of the spacecraft high-power device.

The invention provides an IGBT device with a built-in temperature sensor and a preparation method thereof.The IGBT device comprises a temperature sensor part and an IGBT part, the IGBT part comprises an IGBT chip, the temperature sensor part is located in an accompanying area of the IGBT chip, the temperature sensor part comprises an N-type polycrystalline silicon area, a P-type polycrystalline silicon area, a gate oxide layer, a dielectric isolation layer and a metal layer, and the N-type polycrystalline silicon area, the P-type polycrystalline silicon area, the gate oxide layer, the dielectric isolation layer and the metal layer are located in the accompanying area of the IGBT chip. The IGBT part comprises a cellular area and a terminal area; the side walls of the N-type polycrystalline silicon region and the gate oxide layer comprise a plurality of lug bosses, and the plurality of lug bosses are in one-to-one correspondence. According to the invention, the side wall of the polycrystalline silicon diode (temperature sensor) is designed into a convex structure, so that in a gate oxide growth process, a local gate oxide layer thinning effect can be formed at the position of a convex corner or a concave corner of the side wall, and meanwhile, the opposite contact area between the polycrystalline silicon diode and an IGBT chip active region is also increased by the convex structure; the conductive thermal resistance is reduced, and the temperature measurement accuracy of the diode temperature sensor is improved.

The invention relates to a method for cooling a laptop, a cooling system and an efficiently cooled laptop. The cooling method comprises the following steps of: attaching an evaporation section of a first flat heat pipe directly or indirectly to a central processing unit (CPU) in the laptop or other heating device; connecting a condensation section of the first flat heat pipe with the evaporation section of a second flat heat pipe via a heat transmission structure for transmitting heat; and attaching the condensation section of the second flat heat pipe directly or indirectly to a cooling region of the laptop far from the CPU or other heating device, wherein both the first flat heat pipe and the second flat heat pipe are flat heat pipes with at least one group of micro-heat pipe arrays; the flat heat pipe is extruded and packaged through a metal sheet material and has one or more parallel micro heat pipes; and an equivalent diameter of the micro heat pipe is 0.3-2.5mm. By the method, the problem that the heat is hard to further dissipate due to the narrow cooling space inside the laptop is solved, and the cooing capacity of the laptop is improved.

The invention discloses a heterogeneous liquid cooling server with a semiconductor dehumidification device, and the liquid cooling heat dissipation device can quickly take away the heat of a high-power-consumption device, thereby greatly improving the heat dissipation efficiency of the server. The semiconductor refrigerating and dehumidifying device refrigerates, dehumidifies and cools humid air in a closed cavity of the heterogeneous liquid cooling server to prevent the humid air in the heterogeneous liquid cooling server from being condensed into liquid drops to endanger electrical safety, and meanwhile, the flow guide fan drives the internal air to circulate to finish air cooling and heat dissipation of parts with relatively small heat productivity; the rack type heterogeneous liquid cooling server is suitable for a sealing structure with the cooling medium temperature lower than the environment temperature or in a humid and hot environment. The heterogeneous liquid cooling server can solve the problems that an existing heterogeneous server is low in heat dissipation efficiency, high in PUE value, high in noise, large in occupied space, complex in structure, low in reliability and the like, meets the heat dissipation requirement of the heterogeneous server carrying a high-performance CPU or GPU plug-in or having high noise index requirements, expands the application range of the heterogeneous liquid cooling server, and has the advantages of being compact in size, high in environmental adaptability and the like.

A low-resistance chip-embedded array micro-jet radiator and a manufacturing method thereof, using viscoelastic fluid as a medium, including a bonded and sealed chip substrate, a partition and a liquid supply bottom plate. There are several micro-grooves and micro-columns on the chip substrate; several jet micro-holes and return micro-holes are set on the partition; working fluid inlets, liquid separation areas, several liquid supply micro-channels, and several liquid return channels are set on the liquid supply bottom plate. Micro channel, liquid collection area and outlet of working fluid. The liquid distribution area is connected with the working medium inlet, the liquid supply microchannel is connected with the liquid separation area, the liquid return microchannel is connected with the liquid collection area, and the liquid collection area is connected with the working medium outlet. The chip-level embedded micro-jet heat sink of the present invention guides the cooling liquid directly to the chip substrate of the chip, which greatly reduces the heat conduction resistance from the heat source to the fluid; uses the micro-hole jet cooling structure to trigger elastic turbulence in the flow field, and realizes Microfluidic heat transfer is enhanced at low Reynolds numbers, thereby greatly reducing flow resistance and reducing pump power consumption.

The invention discloses a patch-type power device integration scheme applied to an electric control product of an electric vehicle, and relates to the technical field of a new energy automobile. A thick-copper PCB (Printed Circuit Board) embedded or buried with a plurality of copper blocks is used as a main circuit carrier, a patch-type power device is welded on the copper blocks, a bus capacitor is welded on the thick-copper PCB, the thick-copper PCB is pressed on a heat dissipation cold plate, and an insulation heat conduction gasket is arranged between the thick-copper PCB and the heat dissipation cold plate. The patch-type power device is welded on the copper blocks, and heat is transmitted by means of high heat conductivity of copper; meanwhile, the peak impact capability can be effectively improved by heat capacity of the thick copper blocks; and the insulation heat conduction gasket is arranged between the thick-copper PCB and the heat dissipation cold plate, and thus, extremely low heat conduction resistance between the power device and the heat dissipation cold plate is achieved.

The invention provides a power control composite braided shield flexible cable for an urban railway system. The power control composite braided shield flexible cable comprises a DC electric power cable core and at least two control cable cores, and is characterized in that the control cable cores are stranded at the outside of the DC electric power cable core concentrically to form a control cable core layer; the DC electric power cable core includes a DC electric power cable conductor, an extruded DC electric power cable insulation layer, a wrapped first flame retardation band, a longitudinally lapped plastic-aluminum composite band, an extruded first inner sheath layer successively from the inside to the outside; and a wrapped second flame retardation band, an extruded second inner sheath layer, a copper wire braided and coated flame-resistant material layer and an extruded outer sheath layer are arranged successively outside the control cable core layer from the inside to the outside. The flexible cable has the advantages of being high in insulating properties, being A-level in flame retardation, being low smoke zero halogen, being waterproof, being ratproof and antproof, being anti ultraviolet, being able to resist disturbance of electric field, being high in flexibility, being high in bending property and being compact in structure, and can simultaneously realize functions for electric energy transmission, control, signal, protection and measurement.

The invention discloses an efficient radiating LED street lamp. The efficient radiating LED street lamp comprises an LED lamp body and a radiating device which are installed on the two sides of a base correspondingly. The radiating device comprises radiating fins and a heat pipe, wherein each radiating fin is arranged to be in a U shape, and the tail ends of the two side surfaces of each radiating fin are inserted into the base; one end of the heat pipe is connected to the center of the base, and the other end of the heat pipe spirals up by a helix angle of being no less than 20 degrees and is in penetrating connection with the radiating fins. The heat pipe comprises an evaporator section, a heat insulation section and a condensation section in the spiral-up direction of the heat pipe in sequence, and the length ratio of the evaporator section to the heat insulation section to the condensation section is 2.2-3:1:2-2.7. According to the efficient radiating LED street lamp, the radiating requirements of high-power LED lamps can be effectively met, the junction temperature rise of the LED street lamp under the long time working condition is controlled to be not higher than 15 DEG C, the working stability of the LED street lamp is improved remarkably, and the service life of the LED street lamp is prolonged outstandingly.

All or part of heat radiating fins and all or part of wall of heat pipe are structural parts integrative formed. Advantages are: low conductive thermal resistance so as to raise effect of heat radiation. All or part of heat radiating fins and all or part of wall of heat pipe is directly fabricated from structural part integrative formed.

The invention relates to a direct current cable for subway, which comprises a conductor, wherein the conductor adopts tin-plating copper wires; the strand is stranded by a plurality of tin-plating copper wires; water blocking yarns are clamped among the tin-plating copper wires; a power wire core is stranded by a plurality of strands horizontally coated with double-surface semi-conductive water blocking tapes and is coated with two layers of double-surface semi-conductive water blocking tapes outside which polyester film tapes are coated; the polyester film tapes is coated with 105 DEG C heat-resistant, high-strength and flame-retardant ethylene propylene terpolymer rubber outside which an expansion type semi-conductive water resistance tape is coated; aluminum plastic composite tapes are arranged outside the expansion type semi-conductive water resistance tapes and are overlapped, horizontally coated and welded in a lapping way; a high flame retardant oxygen-blocking layer is extruded and coated between the aluminum plastic composite tapes and a polyethylene inner sheath, wherein the high flame retardant oxygen-blocking layer is filled with a great amount of organic flame retardants, such as metal hydroxides of aluminum hydroxide, magnesium hydroxide and the like; a ratproof, termiteproof, ultraviolet-resistant, low-smoke, halogen-free and high flame retardant type polyolefine sheath is arranged outside the polyethylene inner sheath. The invention can be completely used under bad geological conditions.

The invention discloses an integrated ice making machine, and relates to the technical field of refrigerators. The integrated ice making machine comprises a machine body shell, a fan, a radiator, a refrigeration chip, a control mainboard, a heat preservation layer, an ice making box and a top cover. The ice making box is jointed with one face of the refrigeration chip, the radiator is jointed with the other face of the refrigeration chip, and the fan is jointed with the fin end of the radiator. According to the integrated ice making machine, the ice making box, the refrigeration chip and the radiator are connected through a heat insulation connecting piece, so that it is guaranteed that the cold end face and the hot end face of the refrigeration chip are effectively attached to the ice making box and the radiator correspondingly, cold and heat are effectively conducted, no direct metal connection exists among the radiator, the heat insulation connecting piece and the ice making box, cold losses caused by hot short circuits are effectively reduced, cold conducted to the ice making box by the refrigeration chip is increased, and the ice making speed is increased.

The invention provides a dynamic control composite flexible cable for city track traffic, comprising a direct current power cable core and at least two control cores, and characterized in that the control cores are concentrically intertwisted outside the direct current power cable core to form a control core layer; the direct current power cable core successively comprises, from inside to outside, a direct current power cable conductor, an extruded direct current power cable insulation layer, a lapped first flame retardation band, a longitudinal wrap plastic-aluminum composite band, and an extruded first inner sheath layer; the control core layer successively comprises, from inside to outside, a lapped second flame retardation band, an extruded second inner sheath layer, a brass wire and glass fiber mixing braid ply, and an extruded oversheath layer. The flexible cable possess the characteristics of high insulating property, A grade flame retardation, low smoke, free halogen, water resistance, rodent resistance, termite prevention, UV protection, electrostatic disturbance resistance, high flexibility, sound bending performance, and compact structure, and meanwhile realizes the functions of electric energy transmission, control, signal, protection and measurement.

The invention relates to a compaction heat dissipation device. The device comprises a printed board, a compaction assembly, buffer pads and heat dissipation fins; the buffer pads comprise a first buffer pad and a second buffer pad; the heat dissipation fins are arranged on the printed board; the first buffer pad is arranged on a heat dissipation copper sheet; the compaction assembly and the printed board are detachably connected to the upper portions of the buffer pads; and the second buffer pad is connected with the compaction assembly. The compression heat dissipation device is characterized by further comprising a heat dissipation link, and the heat dissipation link is connected with the printed board and arranged between the heat dissipation fins and the printed board. The compression heat dissipation device can be widely applied to heat dissipation installation and uniform pressing force distribution installation of most aerospace electronic products; and a distributed installation mode can be adopted according to heat consumption and actual requirements of the devices, so that high-power heating devices can meet the uniform compression force distribution installation requirements and can bear the harsh thermal impact test environment, and the service lives of the high-power devices are prolonged.

The invention discloses a cooling device assorted with to-be-cooled modules, and belongs to the technical field of electronics cooling. The cooling device comprises a cooling plate (1). An inlet and an outlet are arranged at two ends of the cooling plate (1), and external cooling media enter the cooling plate (1) from the inlet and outflow from the outlet. N to-be-cooled modules (2) are arranged in sequence and mounted on the surface of the cooling plate (1). Heat sources (3) are arranged on each of the to-be-cooled modules (2). At least one notch is reserved at a position corresponding to each heat source (3) of the to-be-cooled modules (2) in the cooling plate (1), and the total number of the notches is m. The cooling media contact with shells of the to-be-cooled modules directly through the notches, and the n and the m are of natural numbers. The cooling device assorted with the to-be-cooled modules has a function of field replacement; high thermal contact resistance between modules and the cooling plate (1) can be reduced, and cooling effect of the cooling device can be significantly improved; and operating temperature of the to-be-cooled modules (2) is reduced, so that system reliability is improved.

The invention relates to a disc-type hub drive motor. It includes a stator assembly and a rotor assembly; the stator assembly includes an annular stator fixing frame, several stator units, a fixed shaft and a shaft-shaped flange, and the rotor assembly includes a front flange, a yoke, and a permanent magnet; the improvement lies in: the fixed stator The frame includes an annular outer fixing frame and an annular inner water jacket, and the outer fixing frame is sleeved on the outer circumference of the inner water jacket; the outer fixing frame includes a fixing ring and several fins, and several fins are radially arranged on the On the outer circumference of the fixed ring, a U-shaped water channel is opened in each fin; the plurality of stator units are correspondingly and fixedly arranged between two adjacent fins. When working, the cooling liquid in the U-shaped water channel in each fin circulates and takes away the heat generated on the stator unit. The invention directly contacts the cooling water circuit of the motor with the winding of the motor, effectively increases the heat dissipation area of ​​the motor winding, reduces the heat conduction resistance of the motor heat circuit, and effectively improves the heat dissipation power of the motor, and its power density is greater than 6kW / kg.

The invention discloses a cross-linked polyethylene insulated direct current cable for urban light rail subway, comprising a copper conductor, a cross-linked polyethylene insulating layer, an intumescent water-blocking tape, an aluminum-plastic bonded comprehensive protective layer, a low-smoke halogen-free flame retardant inner a protective layer, an anti-mouse ant layer and an outer sheath; the cross-linked polyethylene insulating layer covers the copper conductor, the intumescent water-blocking tape covers the cross-linked polyethylene insulating layer, the aluminum The plastic-bonded comprehensive protective layer is extruded and wrapped around the intumescent water-blocking tape, and the low-smoke halogen-free flame-retardant inner protective layer is wrapped with an aluminum-plastic bonded comprehensive protective layer. The low-smoke halogen-free flame retardant inner protective layer is wrapped around layer by layer, and the outer sheath is extruded and wrapped around the anti-mouse and ant layer; the compound antioxidant can prevent or slow down the degradation of the cross-linked polyethylene insulating layer. The self-oxidation reaction rate can delay the aging and degradation of the cross-linked polyethylene insulating layer, effectively improve the service life of the product, and at the same time improve the mechanical and electrical properties of the product.