41results about How to "Reduce conduction thermal resistance" patented technology

A heat-dissipating fin of a heat sink for improving thermal conduction is disclosed. The heat sink has a base plate and a plurality of heat-dissipating fins. The base plate includes a first surface contacting with a heat source, and a second surface having a plurality of grooves orderly formed on the second surface. The heat dissipating fin of the heat sink has the feature that the thickness of the heat-dissipating fin is not uniform, and the thickness of a bottom surface of the heat-dissipating fin facing the groove is greater than the other portions of the heat-dissipating fin.

The invention discloses a patch-type power device integration scheme applied to an electric control product of an electric vehicle, and relates to the technical field of a new energy automobile. A thick-copper PCB (Printed Circuit Board) embedded or buried with a plurality of copper blocks is used as a main circuit carrier, a patch-type power device is welded on the copper blocks, a bus capacitor is welded on the thick-copper PCB, the thick-copper PCB is pressed on a heat dissipation cold plate, and an insulation heat conduction gasket is arranged between the thick-copper PCB and the heat dissipation cold plate. The patch-type power device is welded on the copper blocks, and heat is transmitted by means of high heat conductivity of copper; meanwhile, the peak impact capability can be effectively improved by heat capacity of the thick copper blocks; and the insulation heat conduction gasket is arranged between the thick-copper PCB and the heat dissipation cold plate, and thus, extremely low heat conduction resistance between the power device and the heat dissipation cold plate is achieved.

The present invention discloses a combined modular backlight unit for a flat panel display and a helmet. The present invention aims to provide a combined modular backlight unit for a flat panel display and a helmet. The present invention is characterized in that: it comprises LED chips packaged by ceramic, a heat spreader and cooling fins, a LED module packaged by resin is equipped on the heat spreader and cooling fins are equipped below the heat spreader, and the LED module packaged by resin is consists of at least one piece of LED chip packaged by ceramic. The present invention is mainly applicable to the display device.

The invention relates to a single LED (light-emitting diode) light source radiating seat which comprises a substrate for fixing an LED light source, a radiating block connected with the substrate, and a radiating plate connected with the radiating block, wherein the radiating block comprises a connecting part connected with the substrate and the radiating plate and a protruding part arranged on the connecting part; and the protruding part is adhered to the LED light source through a hole formed on the substrate. The LED light source is jointed with the protruding part of the radiating block, so that the heat generated by the light source can be directly transferred to the radiating plate through the radiating block; and because the traditional heat is transferred to the radiating block and the radiating plate in turn through the substrate, the whole conducting thermal resistance between the LED light source and the radiating plate is reduced. Therefore, the heat conduction efficiency is higher, the radiating effect is better, the junction temperature of the LED light source can be effectively reduced, and the service life of the LED light source is prolonged. In addition, the invention also relates to an LED lamp employing the single LED light source radiating seat.

The invention discloses a halogen-free low-smoke oxygen-barrier flame-retardant cable, which comprises cable cores, wherein each cable core is provided with a wire core conductor, a fire-resistant mica layer, an insulated layer, a wrapping shielding layer, and an inner sheath sequentially from inside to outside; a filling layer is arranged outside the cable core; a fire barrier layer is arranged outside the filling layer; an oxygen barrier layer is arranged outside the fire barrier layer; an outer sheath is arranged outside the oxygen barrier layer; the filling material of the filling layer is inorganic aluminum hydroxide colloid; and the oxygen barrier layer is a wrapping alkali-free glass fiber rope. According to the halogen-free low-smoke oxygen-barrier flame-retardant cable, as the fire-resistant mica layer, the insulated layer, the wrapping shielding layer and the inner sheath are arranged outside each wire core conductor, fire-resistant insulation shielding protection is carried out on the wire core conductor, and as the filling layer, the fire barrier layer, the oxygen barrier layer and the outer sheath are arranged outside the cable core, good oxygen-barrier and flame-retardant roles are played on the cable core, and the strength and the mechanical performance of the cable are enhanced; and due to filling of aluminum hydroxide, the thermal capacity and the conductive thermal resistance of the cable are reduced, the oxygen-barrier cable is hard to ignite and ablate, and emission of smoke and poisonous gas is reduced.

The invention relates to a heat dissipation structure suitable for a spacecraft high-power device. The structure comprises an installation pressing block, an elastic sponge body, heat conduction filler, an insulation ceramic piece, an insulation sleeve and an installation plate. The installation plate and the installation pressing block are main heat dissipation structures, a single-lug high-powerdevice is fixed to the installation plate, the insulation ceramic piece is arranged between the installation plate and the device, and the heat conduction filler is evenly smeared at the gap betweenthe installation plate and the device; a fastener and a metal shell of the single-lug high-power device are isolated by using a T-shaped insulating sleeve; and the elastic sponge body is loaded between the installation pressing block and the device to provide uniform pressing force for the mounting surface of the device. According to the structure, a large-area heat conduction path does not need to be drawn, active thermal control measures do not need to be provided, the temperature rise suppression amplitude of the single-lug high-power device can reach 23% or above, the insulation and voltage resistance of 10 kV or above can be achieved, and the structure can be widely applied to insulation and heat dissipation installation of the spacecraft high-power device.

The invention provides an IGBT device with a built-in temperature sensor and a preparation method thereof.The IGBT device comprises a temperature sensor part and an IGBT part, the IGBT part comprises an IGBT chip, the temperature sensor part is located in an accompanying area of the IGBT chip, the temperature sensor part comprises an N-type polycrystalline silicon area, a P-type polycrystalline silicon area, a gate oxide layer, a dielectric isolation layer and a metal layer, and the N-type polycrystalline silicon area, the P-type polycrystalline silicon area, the gate oxide layer, the dielectric isolation layer and the metal layer are located in the accompanying area of the IGBT chip. The IGBT part comprises a cellular area and a terminal area; the side walls of the N-type polycrystalline silicon region and the gate oxide layer comprise a plurality of lug bosses, and the plurality of lug bosses are in one-to-one correspondence. According to the invention, the side wall of the polycrystalline silicon diode (temperature sensor) is designed into a convex structure, so that in a gate oxide growth process, a local gate oxide layer thinning effect can be formed at the position of a convex corner or a concave corner of the side wall, and meanwhile, the opposite contact area between the polycrystalline silicon diode and an IGBT chip active region is also increased by the convex structure; the conductive thermal resistance is reduced, and the temperature measurement accuracy of the diode temperature sensor is improved.

The invention provides a power control composite braided shield flexible cable for an urban railway system. The power control composite braided shield flexible cable comprises a DC electric power cable core and at least two control cable cores, and is characterized in that the control cable cores are stranded at the outside of the DC electric power cable core concentrically to form a control cable core layer; the DC electric power cable core includes a DC electric power cable conductor, an extruded DC electric power cable insulation layer, a wrapped first flame retardation band, a longitudinally lapped plastic-aluminum composite band, an extruded first inner sheath layer successively from the inside to the outside; and a wrapped second flame retardation band, an extruded second inner sheath layer, a copper wire braided and coated flame-resistant material layer and an extruded outer sheath layer are arranged successively outside the control cable core layer from the inside to the outside. The flexible cable has the advantages of being high in insulating properties, being A-level in flame retardation, being low smoke zero halogen, being waterproof, being ratproof and antproof, being anti ultraviolet, being able to resist disturbance of electric field, being high in flexibility, being high in bending property and being compact in structure, and can simultaneously realize functions for electric energy transmission, control, signal, protection and measurement.

The invention discloses an efficient radiating LED street lamp. The efficient radiating LED street lamp comprises an LED lamp body and a radiating device which are installed on the two sides of a base correspondingly. The radiating device comprises radiating fins and a heat pipe, wherein each radiating fin is arranged to be in a U shape, and the tail ends of the two side surfaces of each radiating fin are inserted into the base; one end of the heat pipe is connected to the center of the base, and the other end of the heat pipe spirals up by a helix angle of being no less than 20 degrees and is in penetrating connection with the radiating fins. The heat pipe comprises an evaporator section, a heat insulation section and a condensation section in the spiral-up direction of the heat pipe in sequence, and the length ratio of the evaporator section to the heat insulation section to the condensation section is 2.2-3:1:2-2.7. According to the efficient radiating LED street lamp, the radiating requirements of high-power LED lamps can be effectively met, the junction temperature rise of the LED street lamp under the long time working condition is controlled to be not higher than 15 DEG C, the working stability of the LED street lamp is improved remarkably, and the service life of the LED street lamp is prolonged outstandingly.

The invention relates to a compaction heat dissipation device. The device comprises a printed board, a compaction assembly, buffer pads and heat dissipation fins; the buffer pads comprise a first buffer pad and a second buffer pad; the heat dissipation fins are arranged on the printed board; the first buffer pad is arranged on a heat dissipation copper sheet; the compaction assembly and the printed board are detachably connected to the upper portions of the buffer pads; and the second buffer pad is connected with the compaction assembly. The compression heat dissipation device is characterized by further comprising a heat dissipation link, and the heat dissipation link is connected with the printed board and arranged between the heat dissipation fins and the printed board. The compression heat dissipation device can be widely applied to heat dissipation installation and uniform pressing force distribution installation of most aerospace electronic products; and a distributed installation mode can be adopted according to heat consumption and actual requirements of the devices, so that high-power heating devices can meet the uniform compression force distribution installation requirements and can bear the harsh thermal impact test environment, and the service lives of the high-power devices are prolonged.

The invention discloses a cooling device assorted with to-be-cooled modules, and belongs to the technical field of electronics cooling. The cooling device comprises a cooling plate (1). An inlet and an outlet are arranged at two ends of the cooling plate (1), and external cooling media enter the cooling plate (1) from the inlet and outflow from the outlet. N to-be-cooled modules (2) are arranged in sequence and mounted on the surface of the cooling plate (1). Heat sources (3) are arranged on each of the to-be-cooled modules (2). At least one notch is reserved at a position corresponding to each heat source (3) of the to-be-cooled modules (2) in the cooling plate (1), and the total number of the notches is m. The cooling media contact with shells of the to-be-cooled modules directly through the notches, and the n and the m are of natural numbers. The cooling device assorted with the to-be-cooled modules has a function of field replacement; high thermal contact resistance between modules and the cooling plate (1) can be reduced, and cooling effect of the cooling device can be significantly improved; and operating temperature of the to-be-cooled modules (2) is reduced, so that system reliability is improved.