Low-flow-resistance chip embedded array micro-jet radiator and manufacturing method thereof

Abstract

The invention provides a low-flow-resistance chip embedded array micro-jet radiator and a manufacturing method thereof. The low-flow-resistance chip embedded array micro-jet radiator adopts a viscoelastic fluid as a medium, and comprises a chip substrate, a partition plate and a liquid supply bottom plate which are bonded and sealed, wherein a plurality of micro grooves and micro columns are arranged on the chip substrate, a plurality of jet micropores and reflux micropores are formed in the partition plate, the liquid supply bottom plate is provided with a working medium inlet, a liquid distribution area, a plurality of liquid supply micro-channels, a plurality of liquid return micro-channels, a liquid collection area and a working medium outlet, the liquid distribution area is communicated with the working medium inlet, the liquid supply micro-channels are communicated with the liquid distribution area, the liquid return micro-channels are communicated with the liquid collection area, and the liquid collection area is communicated with the working medium outlet. According to the chip-level embedded micro-jet radiator, a cooling liquid is directly guided into the chip substrate ofa chip, so that the heat conduction resistance from a heat source to a fluid is greatly reduced; and elastic turbulence is triggered in a flow field by utilizing a micropore jet flow cooling structure, so that microfluid heat exchange enhancement under a low Reynolds number is realized so as to substantially reduce the flow resistance and reduce the pump power consumption.

Description

technical field [0001] The invention belongs to the field of heat dissipation of semiconductor chips, and relates to a high-efficiency heat dissipation technology suitable for ultra-high heat flux density chips, in particular to a chip-embedded array micro-jet radiator with low flow resistance and a manufacturing method thereof. Background technique [0002] With the rapid development of electronic information technology and micro-nano processing technology, the performance, frequency and integration of electronic chips continue to increase, but the size continues to decrease, which makes the heat flux of electronic chips increase rapidly. At present, the average heat flux density of RF power devices (such as GaN power devices) has exceeded 1kW / cm 2 , the local heat flux in the active area is more than 10 times the average value. How to quickly transfer the heat of the chip from the heating area to the environment, reduce the junction temperature of the chip, thereby improv...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a low-resistance chip-embedded array micro-jet radiator and its manufacturing method, which can solve the bottlenecks of traditional micro-jet heat exchange technology such as high flow resistance, large pressure drop and easy wear.

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