Cooling device assorted with to-be-cooled modules

Abstract

The invention discloses a cooling device assorted with to-be-cooled modules, and belongs to the technical field of electronics cooling. The cooling device comprises a cooling plate (1). An inlet and an outlet are arranged at two ends of the cooling plate (1), and external cooling media enter the cooling plate (1) from the inlet and outflow from the outlet. N to-be-cooled modules (2) are arranged in sequence and mounted on the surface of the cooling plate (1). Heat sources (3) are arranged on each of the to-be-cooled modules (2). At least one notch is reserved at a position corresponding to each heat source (3) of the to-be-cooled modules (2) in the cooling plate (1), and the total number of the notches is m. The cooling media contact with shells of the to-be-cooled modules directly through the notches, and the n and the m are of natural numbers. The cooling device assorted with the to-be-cooled modules has a function of field replacement; high thermal contact resistance between modules and the cooling plate (1) can be reduced, and cooling effect of the cooling device can be significantly improved; and operating temperature of the to-be-cooled modules (2) is reduced, so that system reliability is improved.

Description

technical field [0001] The invention relates to a cooling device matched with a module to be cooled, and belongs to the technical field of electronic device cooling. Background technique [0002] Cold plates are single-fluid heat exchangers that are increasingly used in the cooling of electronic devices. [0003] Field replaceable module is a general term for all kinds of general-purpose units that are relatively independent in terms of installation structure and function of the system. In order to ensure the detachability and maintainability of field replaceable modules that require cooling, field replaceable modules are often connected by threads or locking mechanisms On the cold plate, this constitutes a traditional cooling device (such as the cooling devices mentioned in patents 200610096619.2, 200920106318.2, 201020691749.2). [0004] For such a cooling device, there is often a large contact thermal resistance at the contact interface between the cold plate and the dev...

AI Technical Summary

Problems solved by technology

Although coating a layer of thermally conductive silicon ester on the contact surface can reduce a certain contact thermal resistance, the life of the thermally conductive silicon ester is generally short, and it is easy to shorten the life of the thermally conductive silicon ester when it is repeatedly disassembled and cause pollution and other problems.

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