A cooling device used in conjunction with a module to be cooled

Abstract

The invention discloses a cooling device used in conjunction with a module to be cooled, which belongs to the technical field of electronic device cooling, and comprises a cold plate (1), wherein two ends of the cold plate (1) are provided with inlets and outlets, and an external cooling medium enters through the inlet The cold plate (1) flows out through the outlet; the number of the modules to be cooled (2) is n, and they are arranged in sequence on the surface of the cold plate (1); each of the modules to be cooled (2) is A heat source (3) is provided; at least one notch is provided on the surface of the cold plate (1) at a position corresponding to the heat source (3) on each module to be cooled, and the total number of the notches is m, The cooling medium is in direct contact with the shell of the module to be cooled through the slot, and n and m are natural numbers. The invention has the function of being replaceable on site, and at the same time can reduce the high contact thermal resistance between the module and the cold plate, can significantly improve the cooling effect of the cooling device, reduce the working temperature of the module to be cooled, and improve the reliability of the system.

Description

technical field [0001] The invention relates to a cooling device matched with a module to be cooled, and belongs to the technical field of electronic device cooling. Background technique [0002] Cold plates are single-fluid heat exchangers that are increasingly used in the cooling of electronic devices. [0003] Field replaceable module is a general term for all kinds of general-purpose units that are relatively independent in terms of installation structure and function of the system. In order to ensure the detachability and maintainability of field replaceable modules that require cooling, field replaceable modules are often connected by threads or locking mechanisms On the cold plate, this constitutes a traditional cooling device (such as the cooling devices mentioned in patents 200610096619.2, 200920106318.2, 201020691749.2). [0004] For such a cooling device, there is often a large contact thermal resistance at the contact interface between the cold plate and the dev...

AI Technical Summary

Problems solved by technology

Although coating a layer of thermally conductive silicon ester on the contact surface can reduce a certain contact thermal resistance, the life of the thermally conductive silicon ester is generally short, and it is easy to shorten the life of the thermally conductive silicon ester when it is repeatedly disassembled and cause pollution and other problems.

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