Heterogeneous liquid cooling server with semiconductor dehumidification device

Abstract

The invention discloses a heterogeneous liquid cooling server with a semiconductor dehumidification device, and the liquid cooling heat dissipation device can quickly take away the heat of a high-power-consumption device, thereby greatly improving the heat dissipation efficiency of the server. The semiconductor refrigerating and dehumidifying device refrigerates, dehumidifies and cools humid air in a closed cavity of the heterogeneous liquid cooling server to prevent the humid air in the heterogeneous liquid cooling server from being condensed into liquid drops to endanger electrical safety, and meanwhile, the flow guide fan drives the internal air to circulate to finish air cooling and heat dissipation of parts with relatively small heat productivity; the rack type heterogeneous liquid cooling server is suitable for a sealing structure with the cooling medium temperature lower than the environment temperature or in a humid and hot environment. The heterogeneous liquid cooling server can solve the problems that an existing heterogeneous server is low in heat dissipation efficiency, high in PUE value, high in noise, large in occupied space, complex in structure, low in reliability and the like, meets the heat dissipation requirement of the heterogeneous server carrying a high-performance CPU or GPU plug-in or having high noise index requirements, expands the application range of the heterogeneous liquid cooling server, and has the advantages of being compact in size, high in environmental adaptability and the like.

Description

technical field [0001] The invention belongs to the field of heat dissipation of rack-type servers, in particular to a heterogeneous liquid-cooled server with a semiconductor dehumidification device. Background technique [0002] With the rise of big data, cloud computing and artificial intelligence, the computing requirements of data centers and servers are getting higher and higher, and the computing architecture based on CPU chips is becoming more and more difficult to meet the analysis and processing of big data and the model of artificial intelligence. For training, heterogeneous computing servers represented by GPUs and FPGAs have great potential for development, but the power density is also increasing, and a single chip can reach 300W or even more than 500W. [0003] Traditional data centers generally use precision air-conditioning cooling technology to exchange heat with the radiator of the server chip through the cold air. Due to the poor heat transfer characterist...

AI Technical Summary

Problems solved by technology

[0004] Existing heterogeneous liquid-cooled servers mostly adopt the immersion liquid cooling scheme. The main board and other components of the server are directly immersed in the insulating liquid for heat exchange. Because the single-phase immersion cooling adopts the convection method for heat exchange, there are uneven flow fields, Low heat exchange efficiency and other issues, it takes a long time to completely dry during maintenance, which affects the maintenance efficiency of the server; the two-phase immersion liquid cooling system is efficient and uniform, but generally has a large volume and high price, and the maintenance cooling liquid has a complex evaporation and dissipation structure, which is difficult to adapt to the environment Low stability makes the two-phase immersion heterogeneous liquid-cooled server unable to be applied on a large scale, which limits the application field of liquid-cooled heterogeneous liquid-cooled server

[0005] The cold-plate heterogeneous liquid-cooled server scheme has a simple structure and is easy to maintain. However, in humid and high-temperature summers, especially in coastal areas, condensation may occur on the internal liquid-cooled plate and the surface of metal structural parts. To reduce the risk of condensation, high The cooling medium or open structure at a certain temperature of the ambient temperature limits the performance and application fields of the heterogeneous liquid-cooled server; condensation is very harmful to the server, and it is easy to cause an electrical short circuit, thereby affecting the normal operation of the heterogeneous liquid-cooled server , and even cause accidents, resulting in lower reliability and safety of cold-plate heterogeneous liquid-cooled servers, which limits the further promotion of liquid-cooled heterogeneous liquid-cooled servers

[0006] The principle of the traditional heating dehumidifier is that when the temperature is high, the humid air can hold more moisture, and heating the air can make the moisture that may condense into dewdrops remain in the air instead of condensing on the surface of the equipment, but the moisture is still in the server Inside, when the temperature difference is large, the moisture in the humid air will condense on the surface of the equipment, which will still affect the normal operation of the equipment; the heating method and dehumidification will affect the reliability and performance of other components in the server.

[0007] It can be seen that although the application range of heterogeneous liquid-cooled servers continues to expand, the existing heterogeneous liquid-cooled servers still have defects such as complex structure, inconvenient maintenance, low safety, and poor environmental adaptability, which urgently need further improvement

Images