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Combined modular backlight unit for flat panel display and helmet

A modular and backlight technology, applied in the direction of light source, electric light source, point light source, etc., can solve the problems of inability to meet the needs of batch products, lack of mature heat dissipation modules, and increase design costs, so as to shorten product maintenance time and shorten R & D cycle, the effect of improving the cooling effect

Inactive Publication Date: 2011-04-13
江苏捷诚车载电子信息工程有限公司
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Problems solved by technology

[0002] Backlights are widely used in display devices, and their application fields are very wide. However, for display devices with high brightness requirements (greater than 15,000 nits) such as head-up displays and helmets, the previous designs have been customized for different product models, prolonging research and development. Cycle time, increase design cost, and lack of mature heat dissipation module, which reduces its reliability, resulting in head-up display and helmet backlights that cannot meet the needs of mass-produced products

Method used

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  • Combined modular backlight unit for flat panel display and helmet

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Embodiment Construction

[0008] The present invention and its specific implementations will be described in further detail below in conjunction with the accompanying drawings.

[0009] Referring to the accompanying drawings, the present invention is characterized in that it includes a ceramic-packaged LED chip 1, a vapor chamber 2, and heat dissipation fins 3. On the top of the vapor chamber 2, there is a resin-encapsulated LED module 4. Heat dissipation fins 3 are provided, and the resin-encapsulated LED module consists of at least one ceramic-encapsulated LED chip.

[0010] The invention adopts single or multiple LEDs with small volume and good heat dissipation performance as the backlight module, and the circuit board adopts a uniform temperature plate with a thermal conductivity of 800W / mK or more, and conducts heat dissipation according to the power consumption and quantity of LEDs used in the backlight of a single module. Simulation, design heat dissipation fins that meet the heat dissipation re...

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Abstract

The present invention discloses a combined modular backlight unit for a flat panel display and a helmet. The present invention aims to provide a combined modular backlight unit for a flat panel display and a helmet. The present invention is characterized in that: it comprises LED chips packaged by ceramic, a heat spreader and cooling fins, a LED module packaged by resin is equipped on the heat spreader and cooling fins are equipped below the heat spreader, and the LED module packaged by resin is consists of at least one piece of LED chip packaged by ceramic. The present invention is mainly applicable to the display device.

Description

technical field [0001] The invention relates to a modularized backlight source, in particular to a combinable modularized backlight source for head-up displays and helmets. Background technique [0002] Backlights are widely used in display devices, and their application fields are very wide. However, for display devices with high brightness requirements (greater than 15,000 nits) such as head-up displays and helmets, the previous designs have been customized for different product models, prolonging research and development. cycle time, increase design cost, and lack of mature heat dissipation module, which reduces its reliability, resulting in head-up display and helmet backlights that cannot meet the needs of mass-produced products. Contents of the invention [0003] The object of the present invention is to provide a combinable modular backlight for head-up display and helmet, so as to solve the above-mentioned existing problems. [0004] In order to achieve the above ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S4/00F21V19/00F21V29/00F21Y101/02F21S8/00F21V29/508F21V29/71F21Y115/10
Inventor 夏显忠夏季
Owner 江苏捷诚车载电子信息工程有限公司
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