Heat dissipation structure suitable for spacecraft high-power device
A high-power device, heat dissipation structure technology, applied to the circuit layout on the support structure, electrical components, circuit layout on the insulating board, etc., can solve the problem of low normal heat transfer coefficient and can not play the role of high-power device insulation protection effect, adverse device thermal reliability design, etc.
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[0030] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0031] A heat dissipation structure suitable for spacecraft high-power devices, such as figure 1 , 2 As mentioned above, it includes the installation pressing block 1, the elastic sponge body 2, the insulating sleeve 7, the first thermally conductive filler 8, the insulating ceramic sheet 9, the second thermally conductive filler 10 and the mounting plate 12,
[0032] The mounting plate 12 is the main mounting structure of the single-ear high-power device, and the insulating ceramic sheet 9 is placed on the mounting plate 12, and the thermally conductive filler 10 is evenly applied between the insulating ceramic sheet 9 and the mounting plate 12,
[0033] The single-ear high-power device is placed on the insulating ceramic sheet 9, and the heat-conducting filler 8 is evenly applied between the insulating ceramic sheet 9 and the high-power device, and the ins...
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