Heat-tube radiator for integrated circuit and its manufacturing method

A technology of heat pipe radiator and integrated circuit, which is applied in the direction of circuits, electric solid devices, indirect heat exchangers, etc., can solve the problems of small conduction thermal resistance, large conduction thermal resistance, inefficient and smooth conduction of heat, and achieve improved Heat dissipation effect, small temperature difference effect

Inactive Publication Date: 2005-02-16
胡成钢
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the disadvantages of conventional heat pipe radiators for integrated circuits that the heat cannot be efficiently and smoothly conducted from the heat pipe wall to the heat dissipation fins due to the large conduction thermal resistance between the heat pipe wall and the heat dissipation fins, the present invention provides a A heat pipe radiator for an integrated circuit and a manufacturing method thereof. The heat conduction resistance between all or part of the heat dissipation fins and the heat pipe wall of the heat pipe radiator is small, and the heat can be efficiently and smoothly conducted from the heat pipe wall to the heat sink. Fins, which can improve the heat dissipation effect of the heat pipe radiator

Method used

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  • Heat-tube radiator for integrated circuit and its manufacturing method
  • Heat-tube radiator for integrated circuit and its manufacturing method
  • Heat-tube radiator for integrated circuit and its manufacturing method

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Embodiment Construction

[0035] Attached below figure 2 , Attached Figure 3, Attached Figure 4 The embodiment illustrates the present invention:

[0036] exist figure 2 Among them, the heat pipe radiator is mainly composed of heat dissipation fins (2), heat pipes (4) and base (5), wherein the heat pipe wall (3) and heat dissipation fins (2) are integrally formed structural parts.

[0037] In Fig. 3, the heat pipe radiator is mainly composed of heat dissipation fins (2), heat pipes (4) and base (5), wherein the heat pipe wall (3) and heat dissipation fins (2) are integrally formed structural parts, made of The number of completed heat pipes is more than one.

[0038] exist Figure 4 Among them, the heat pipe radiator is mainly composed of heat dissipation fins (2), heat pipes (4) and base (5), wherein part of the heat pipe wall (3) and part of the heat dissipation fins (2) are integrally formed structural parts.

[0039] in the attached figure 2 , Attached Figure 3, Attached Figure 4 The ma...

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Abstract

All or part of heat radiating fins and all or part of wall of heat pipe are structural parts integrative formed. Advantages are: low conductive thermal resistance so as to raise effect of heat radiation. All or part of heat radiating fins and all or part of wall of heat pipe is directly fabricated from structural part integrative formed.

Description

(1) Technical field [0001] The invention relates to a cooling device for integrated circuits combined with heat pipe technology and a manufacturing method thereof, in particular to a heat pipe radiator for integrated circuits with reduced thermal conduction resistance between the heat pipe wall and cooling fins and its manufacturing method method. (2) Background technology [0002] At present, heat pipe radiators for integrated circuits are mainly composed of heat dissipation fins, heat pipes and bases. The heat pipe wall of the heat pipe is connected to the heat dissipation fins, and the connection method is mostly welding or close contact. The heat dissipation mechanism is that the base absorbs the heat emitted by the integrated circuit, and the heat absorbed by the base is transferred to the heat pipe. Due to the high heat conductivity of the heat pipe, the heat is efficiently diffused in the heat pipe, and the heat in the heat pipe is conducted from the heat pipe wall to...

Claims

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Application Information

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IPC IPC(8): F28D15/02H01L23/427H05K7/20
Inventor 胡成钢
Owner 胡成钢
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