The invention provides an ultra-thin even-temperature plate device and a manufacturing method thereof. The device comprises a bottom plate, a capillary core, an upper cover plate and a working medium. A gas-liquid channel
integrated design is adopted in the capillary core, a steam circulation space and a liquid
backflow channel are arranged on the capillary core in the plane direction, and a
solid part of the capillary core is provided with holes for supporting columns to penetrate, the supporting columns are arranged on the bottom plate, the bottom plate is of a groove structure, and the supporting columns are evenly arranged in the bottom plate. The supporting columns penetrate the holes to make contact with the inner surface of the upper cover plate, and
welding forming is finished. A liquid filling port is reserved in the bottom plate, and after filling of the working medium, sealing
welding is carried out. The manufacturing method of the device comprises the steps of
machining of the bottom plate and the upper cover plate,
punching forming of the capillary core, vacuum pressurizing
diffusion welding,
machining margin removing, vacuumizing liquid injecting and the sealing
welding process. An even-temperature plate can be manufactured to be of an ultra-thin structure, and the ultra-thin even-temperature plate device and the manufacturing method are particularly suitable for heat dissipation occasions with the strict requirement for the installing thickness space.