249results about How to "Increase element content" patented technology

The invention discloses a technology for processing a CrNiMo series steel material. The technology comprises the steps of adopting an electroslag remelting technology to obtain a steel ingot which contains 0.14-0.19% of C, 1.5-1.8% of Cr, 0.17-0.35% of Si, 0.4-0.6% of Mn, 0.25-0.36% of Mo, 1.4-1.7% of Ni, 0-0.035% of P and 0-0.030% of S according to percent by weight, forging the steel ingot, then carrying out normalizing and high temperature tempering, carburizing, high temperature tempering and oil quenching, and finally, carrying out low temperature tempering to complete the processing. According to the technology, a heat treatment processing technology which is simple and easy to operate is utilized to ensure the product quality, the problem that a loading part of a coal machine fails to work is solved, the service life of a product is prolonged, and the producing and processing costs are lowered.

The invention discloses a compound microbial agent for promoting fermentation of pig manure composting. The compound microbial agent is prepared from thermobifida fusca, ureibacillus thermophaericus, pantoea agglomerans, gibsonii, bacillus amyloliquefaciens, bacillus pumilus and a liquid culture medium. Compared with other treatment methods, the fermentation time of the compound microbial agent on the pig manure composting is shorter, and more obvious facilitation effect on fermentation of the pig manure composting is obtained.

The invention relates to the technical field of chemical engineering, and discloses a fertilizer capable of fixing soil heavy metal and a preparing method thereof. The fertilizer is prepared from, by weight, 9-11 parts of urea, 12-18 parts of phosphoric acid, 20-50 parts of alkaline potassium, 12-20 parts of reaction auxiliary, 0.6-1.5 parts of water, 15-25 parts of modified smectite powder, 0.6-1.0 part of calcium sulfate, 0.2-0.6 part of aluminum sulfate, 0.3-0.9 part of magnesium sulfate and 0.4-1.2 parts of ferrous sulfate. The used reaction auxiliary can be used as a catalyst when urea reacts with phosphoric acid and can be used for removing heavy metal ions in soil, impurity removal is omitted, no effluent or waste gas is exhausted, raw materials used in production are fully and reasonably used, and the fertilizer has remarkable environment protection benefits.

The invention relates to a high-strength high-tenacity titanium alloy, which is mainly used for manufacturing forged parts in structures of an airframe, airfoils and an undercarriage of an airplane. The high-strength high-tenacity titanium alloy is characterized in that the compositions of each alloy by weight percentage are: 3.5 to 5.5 percent of Al, 4.0 to 8.0 percent of V, 5.0 to 7.0 percent of Cr, 3.0 to 7.0 percent of Mo, and the residual amount of Ti and inevitable impurities. The nominal chemical composition of the high-strength high-tenacity titanium alloy is Ti-4Al-6V-6Cr-5Mo, compared with Ti-1023 titanium alloy and BT22 titanium alloy, the alloy uses Ti-Al-Mo-V-Cr alloy system, so as to increase the content of alloying elements, and reasonably adjusts the proportion of aluminum equivalent and molybdenum equivalent, so that the strength index and the tenacity index of the alloy is obviously improved and the performance of the alloy is more excellent. The obdurability of the high-strength high-tenacity titanium alloy can reach that: the strength sigmab is more than or equal to 1,200MPa, and the fracture toughness K1C is more than or equal to 65MPa m.

The invention belongs to the field of welding material, and particularly relates to a SnZn-based lead-free brazing filler metal containing Cr suitable for reflow soldering and wave soldering in electronic packing. The SnZn-based lead-free brazing filler metal comprises 0.01 to 0.1 percent by weight of Ni, 0.001 to 0.01 percent by weight of P, 0.05 to 0.2 percent by weight of Nd, 0.1 to 0.5 percent by weight of In, 0.01 to 0.5 percent by weight of Cr, 1 to 5 percent by weight of Bi, 7 to 11 percent by weight of Zn, and Sn in balancing amount; and the weight percentage sum of all the components is 100%. The SnZn-based lead-free brazing filler metal has excellent antioxygenic property, wettability and mechanical property, the melting point is equal to that of a conventional SnPb brazing filler metal, copper precipitation is not required, the SnZn-based lead-free brazing filler metal is suitable for reflow soldering and wave soldering, traditional brazing packing devices and electronic components.

The invention discloses a planting method capable of preventing peanut continuous cropping obstacle and belongs to the technical field of crop planting. According to the planting method capable of preventing the peanut continuous cropping obstacle, orychophragmus violaceus is sowed at land after peanut harvesting and used for turning over of green manure before planting of continuous cropping peanut. The peanut is spring peanut and the land is winter fallowing field. Through turning over of green manure by the orychophragmus violaceus, on one hand, the organic matter content of soil can be increased and organic fertilizer basal application can be reduced; on the other hand, the microbial groups of soil in the continuous cropping peanut field can be changed. By means of the planting method,manpower and material resource consumption caused by intensive cultivation of soil can be substantially reduced, the transpiration of the soil can be reduced, the utilization rate and productivity ofthe soil can be increased, and the peanut yield can be increased.

The invention relates to the field of lithium ion batteries, and particularly relates to a positive pole piece and a lithium ion battery containing the pole piece. The positive pole piece provided by the invention comprises a positive pole current collector, and a positive pole active material adhered to the positive pole current collector, the positive pole active material contains a modified ternary material with a coating layer on the surface, the structural formula of the modified ternary material is LiCo(1-x-y)MnxNiyO2, wherein x is more than 0 and is less than or equal to 0.3, y is more than 0 and is less than or equal to 0.3, and x+y is more than 0 and is less than or equal to 0.6, and the coating layer contains imidazole ion liquid. According to the invention, the proportion of the contents of Ni element and Mn element in the ternary material can be optimized, meanwhile, the imidazole ion liquid is added in the positive pulping process, the direct contact of an active material and the electrolyte can be blocked to avoid corrosion, and the stability of the battery is improved.

The invention discloses a lead welding technique for packaging a semiconductor power device and belongs to the technical field of semiconductor power device packaging and manufacturing. According to the technique, lead connection is achieved through a brazing technique, and the brazing process is achieved through lasers, wherein lead connection refers to the completion of the welding process of a lead and a chip and the welding process of the lead and two welding points of a frame. In the welding process, the lead, the frame and a chip welding pad are preheated through direct laser spot radiation, the diameter of laser spots is 1 mm, and laser radiation time is 10 ms; and a brazing wire is heated through direct laser spot radiation, the diameter of the laser spots is 1 mm, and laser radiation time is 10 ms. By the adoption of the technique, the wet aluminum pad and the frame can be melted directly to achieve stable and reliable connection of the lead, the chip and the frame, the aluminum pad and the frame cannot be melted due to the fact that the temperature does not reach the melting point, and the aluminum pad and the frame are just preheated, so that the surfaces are stretched fully to assist in combination of the aluminum pad and liquid brazing filler metal and combination of the frame and the liquid brazing filler metal, and therefore mechanical damage, thermal damage and the stress problem existing in a traditional routing technique are avoided.