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102results about How to "High curing temperature" patented technology

Method for at least partially reworking or replacing a reinforcement element of a fibre composite structure and associated connecting device

The invention relates to a method for at least partially reworking or replacing a reinforcement element of a fibre composite structure. In a first method step, at least one fibre layer is arranged on a surface section of the reinforcement element and / or at least one replacement section of the reinforcement element of the same material and same layer structure is arranged on a surface reinforcement section of the fibre composite structure. In a second method step, at least a pressure mat adjusted to the contour of the reinforcement element is disposed above the at least one fibre layer and / or the at least one replacement section of the reinforcement element, wherein the at least one pressure mat is supported and fixed in a nominal position by a fixing frame adjusted to the contour of the reinforcement element. In a third method step, the at least one pressure mat is then acted upon by a pressure medium in order to press the same against the reinforcement element and the fixing frame. In a fourth method step, a hardening of the at least one fibre layer and / or the at least one replacement section of the reinforcement element is carried out. The invention further relates to a corresponding connecting device for carrying out the method.
Owner:AIRBUS OPERATIONS GMBH

Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive

A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Preferably, a flexible epoxy anhydride adduct modified solid bismaleimide and solid benzoxazine resin composition that can survive high temperature and high moisture conditions and maintain good adhesion strength and minimize the stress resulting from a coefficient of thermal expansion mismatch between a silicon die and a substrate which is Ball Grid Array solder mask or a smart card polyethylene terephthalate or silver or copper metal lead frame.
Owner:PROTAVIC KOREA

Preparation method of room-temperature regenerated phenolic resin and recycling technology and application thereof

The invention relates to a preparation method of room-temperature regenerated phenolic resin and a recycling technology and application thereof. The preparation method comprises the following steps of according to parts by mass, melting and blending 100 parts of thermoplastic phenolic resin and 18.4 to 55 parts of boric acid compound at the temperature of 60 to 100 DEG C, so as to obtain boron-containing thermoplastic phenolic resin; or, dissolving 100 parts of thermoplastic phenolic resin and 20 to 50 parts of boric acid compound into an organic solvent with low boiling point at the temperature of 40 to 60 DEG C, so as to obtain the boron-containing thermoplastic phenolic resin; curing, so as to obtain the room-temperature regenerated phenolic resin. The preparation method has the advantages that the preparation technology of the resin is simple; the resin is dissolved into the mixing solvent of ethyl alcohol and water at room temperature, so that the resin can be recycled; the resin can be used for preparing the recyclable fiber reinforced boron-containing thermoplastic phenolic resin-based composite material. The prepared boron-containing thermoplastic phenolic resin has the advantages that the function of arylboronic acid ester structure promoting the heat-resistant property of the thermoplastic phenolic resin is fully realized, and the technology of the resin and the mechanical property of the composite material can be simultaneously realized.
Owner:XI AN JIAOTONG UNIV +1

Low viscosity polyimide copolymerized thermosetting resin and preparation method and application thereof

The invention relates to the technical field of high molecular materials, and particularly relates to copolymerized polyimide thermosetting resin comprising a carborane structure and a preparation method and an application thereof. The copolymerized polyimide resin is prepared by thermally cross-linking and solidifying polyimide oligomers represented by a formula I as a raw material. The oligomersintroduce the carborane of a certain composition into a conventional thermosetting polyimide resin system by means of a copolymerization method, so that the conventional thermosetting polyimide resinhas relatively low hot melt viscosity and a higher glass-transition temperature (higher than 500 DEG C) and also has more excellent thermal oxidation resistance and heat stability resistance. Therefore, the thermosetting resin has the extremely low hot melt viscosity. The resin is more easily prepared into a composite material part of a complex structure through a conventional processing technology, can improve the thermal oxidation resistance of the material to a great extent, and has very high application value and innovation to prepare a light high strength high-temperature-resistant easily processed polyimide composite material for a structural material in the aerospace field.
Owner:BEIHANG UNIV

Smoke-free micro-expansive anhydrous stemming

The invention discloses smoke-free micro-expansive anhydrous stemming, comprising the following components in parts by weight: 10-30 parts of corundum, 15-25 parts of alumina, 10-20 parts of silicon carbide, 10-25 parts of coke, 15-25 parts of clay, 5-10 parts of expanding agent and 15-18 parts of phenolic resin binder. The invention has the advantages that: in the stemming using process, yellow smoke is not generated, pungent smell is less, and the used phenolic resin binder has higher curing temperature and can meet the use requirements of the stemming. Because the expanding agent is added, the stemming can generate micro-expansion at the high temperature so as to fill cracks generated due to inside and outside stresses and modify the high temperature using performance of the stemming.
Owner:MCC ENERGY SAVING & ENVIRONMENTAL PROTECTION

Aqueous adhesive for bonding elastomers

An adhesive composition containing an aqueous butadiene polymer latex, and an acid scavenging compound, wherein the adhesive comprises essentially no phenolic resin or methylene donor compounds. The aqueous covercoat adhesive is particularly well suited for rubber to metal bonding applications. The adhesive have shown excellent adhesion to a number of compounds but perform best on natural rubber compounds and prefer higher cure temperatures to lower cure temperatures. Further, the formulation has been developed without the need for a methylene donor such as 2-polyoxymethylene dimethylether (gamma POM).
Owner:LORD CORP

Alloy for casting space shuttle liquid hydrogen fuel tank

The invention discloses alloy for casting a space shuttle liquid hydrogen fuel tank. The alloy is prepared from the following raw materials in parts by weight: 85-90 parts of Al, 2.0-3.0 parts of Li, 2.0-3.0 parts of Cu, 0.1-0.25 parts of Zr and 0.1-0.2 parts of Sr. The alloy has the advantages as follows: with adoption of electron beams for smelting the alloy, harmful impurity elements such as O, N, S and the like can be greatly reduced in the alloy smelting process, purity and content of Al, Ni and Cu in the alloy are increased, low temperature resistance of the alloy is guaranteed, and as the temperature decreases, strength, ductility and toughness of the alloy are greatly improved; the aluminum ingot with the grade of Al99.85 is used as a raw material, purity of Al in the alloy is further improved; an ultra-low-temperature-resistant pressure-sensitive adhesive is solvent-free, the curing temperature is low, curing time is short, the ultra-low-temperature-resistant pressure-sensitive adhesive is used for bonding flexible foam plastic and a pipe rapidly, the on-site construction process is good, the ultra-low-temperature-resistant pressure-sensitive adhesive still realizes a better adhesion effect under the condition of ultra-low temperature; and transmission of low temperature can be better insulated by the soft foam plastic layer.
Owner:NANJING LVZHICHENG PATENT TECH DEV CO LTD
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