2691results about How to "Improve deformation" patented technology

A method for closing an opening in a wall of a body lumen wherein an elongate member is advanced into the body lumen and a distal portion of an obturator is positioned distally beyond the distal end of the elongate member within the body lumen and in which one or more expandable elements on the distal portion of the obturator are expanded. The obturator is then withdrawn until the expandable elements contact the wall of the body lumen and a clip having tines is advanced over the elongate member until the tines penetrate the wall of the body lumen. The tines and the expandable elements are offset from one another. The elongate member is withdrawn from the body lumen and the clip substantially closes the opening in the body lumen.

A stacked package formed by stacking semiconductor device packages and a method of manufacturing a stacked semiconductor package. Each package includes leads and connection terminals. A semiconductor chip is electrically connected to the connection terminals. A package body has the same thickness as that of the lead so as to expose the upper and the lower surfaces of the leads at a surface of the package body. Each of the packages is stacked on another package by electrically connecting the exposed surfaces of the leads. The manufacturing method includes preparing lead frames, including a plurality of leads, supporting a semiconductor chip in a chip receiving cavity between the leads, connecting the semiconductor chip to the connection terminals of the leads, forming a package body of a thickness such that a portion of surface of the leads are exposed, separating packages from the lead frame, and forming a stacked package by stacking a plurality of the packages.

The present invention discloses an improvement in coaxial compression connectors used in, inter alia, CATV, satellite, and home theater electronics. The present connectors accept a large range of cable sizes, allow replacement of the holding or compression element to accommodate a range of sizes, and allow the connector to be re-uesable. The connector comprises an attachment nut operable for electrically connecting the coaxial cable to another device, a tubular shank attached to the connector nut operable for accepting the dielectric layer of the coaxial cable therewithin, a body portion connecting the nut and tubular shank, a compression ring and an outer shell. In a first embodiment, the compression ring is a relatively short tubular member removably housed within the outer shell. The compression ring has an annular compression groove on the outer circumference thereof which causes a mid-portion of the ring to deform inwardly in response to a longitudinal force applied to opposing ends of the compression ring to securely hold the cable within the connector and create a 360 degree moisture seal. In a second embodiment, the body portion deforms inwardly. In both embodiments, a shoulder within the shell abuts the trailing end of the compressive member and exerts a longitudinal compression force thereon that causes the compressive member to circumferentially buckle inwardly against the cable.

Apparatus and method for manufacturing an electroacoustic transducer for, for instance, a hearing aid, with a diaphragm arranged in a housing. The diaphragm is attached onto a film or punched from a sheet of material, such that along the circumferential edge of the diaphragm, a free strip of film or a strip of material remains present, in a capillary space between the circumferential edge of the film and the inner wall of the housing, or in a capillary space between the diaphragm and the strip of material, a polymer of a low viscosity is provided to connect to diaphragm with the housing wall. Through the method, the production of the transducer is greatly simplified.

An electrically controlled light modulator device comprises at least one cell, where two deformable dielectric layers meet at an interface, at least one of said layers consisting of viscoelastic relief forming gel. A first support electrode structure and a second signal electrode structures are arranged on separate sides of the dielectric layers in order to create an electric field passing through said layers and in order to create surface reliefs on the viscoelastic gel layer. According to the invention, a third enhancement electrode structure is arranged in the proximity of the first signal electrode structure. Applying enhancement signal voltage between the enhancement electrode structure and the signal electrode structure concentrates locally the electric field passing through the two deformable dielectric layers and therefore enhances the amplitude of the deformation of the viscoelastic gel layer.

Methods and compositions useful for subterranean formation treatments, such as hydraulic fracturing treatments and sand control that utilize relatively lightweight and / or substantially neutrally buoyant particulates. Particles that may be employed include particulates of naturally occurring materials that may be optionally strengthened or hardened by exposure to a modifying agent; porous materials including selectively configured porous material particles manufactured and / or treated with selected glazing materials, coating materials and / or penetrating materials; and well treating aggregates composed of an organic lightweight material and a weight modifying agent. The relatively lightweight particulate may be suspended as a substantially neutral buoyant particulate and stored with a carrier fluid as a pumpable slurry.

There are disclosed a stacked package formed by stacking semiconductor device packages and a manufacturing method thereof. Each package includes leads and connection terminals. A semiconductor chip is electrically connected to the connection terminals. A package body has the same thickness as that of the lead so as to expose the upper and the lower surfaces of the leads to the package body. Each of the packages is stacked on another package by electrically connecting the exposed upper and lower surfaces of the leads with each other. The manufacturing method has preparing lead frames, attaching an adhesive tape to the lower surface of the lead frame, bonding a semiconductor chip to the adhesive tape in the chip receiving cavity between the leads, connecting the semiconductor chip to the connection terminals, forming a package body, removing the adhesive tape; removing dam bars from the side frame, separating packages from the lead frame, and forming a stacked package by stacking a plurality of the packages.

A clip for engaging tissue includes a generally annular-shaped body defining a plane and disposed about a central axis extending normal to the plane. The body includes alternating inner and outer curved regions, defining a zigzag pattern about a periphery of the clip. The body is biased towards a planar configuration lying in the plane and deflectable towards a transverse configuration extending out of the plane. Tines extend from the inner curved regions, the tines being oriented towards the central axis in the planar configuration, and parallel to the central axis in the transverse configuration. The tines include primary tines and secondary tines that are shorter than the primary tines. The primary tines may be disposed on opposing inner curved regions and oriented towards one another. The primary tines are configured such that they are offset from the axes of symmetry of the curved regions from which they extend and are connected to the curved regions by curved or linear regions or are connected directly to the curved regions. The primary tines may overlap the body and may be of different lengths.

A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are electrically interconnected with the microelectronic element and the flexible substrate includes a gap extending at least partially around at least one of the conductive terminals. In certain embodiments, the package includes a support layer, such as a compliant layer, disposed between the first face of the microelectronic element and the flexible substrate. In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

Part of a front side frame is configured to be deformed so as to bend outwardly, in a vehicle width direction, by a collision load in a vehicle frontal collision. A sub frame provided at a lower portion of a front vehicle body is joined to the front side frame via a reinforcement. A front portion of the reinforcement is located at a position which corresponds to a bending portion of the front side frame which is to be deformed so as to bend outwardly, in the vehicle width direction, by the collision load in the vehicle frontal collision. Accordingly, the bending of the front side frame at its bending portion when the collision load acts in the vehicle frontal collision can be promoted, so that the collision load against passengers can be decreased securely.